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Vacuum Electronics
1002-8935
2003 Issue 4
Study of Quality and Reliability of Ceramic-to-Metal-Seal
gao long qiao
..............
page:1-5
Preparation of Alumina High Voltage Vacuum Interrupter Housing by Aqueous Gel-Casting
chen da ming
..............
page:6-8,12
Generation Mechanism of Internal Stress during Liquid-Solid Conversion of Colloidal Injection Moulding
yang jin long ; ma li guo ; ma tian ; huang yong
..............
page:9-12
Present Situation and Problems of Ceramic Housing for Vacuum Interrupters
liu bao hua
..............
page:13-14
Inspection and Evaluation of 95% Alumina Ceramics
zeng gui sheng
..............
page:15-19
Application of the Energy Dispersion Fluorescence X-ray Spectrometer in Vacuum Switch Tube
wang wei jie ; he xiao mei
..............
page:20-23
Microstructure of Metallized Alumina Ceramics Applied in Vacuum Electronics Components of Domestic and Oversea
zhang ju xian
..............
page:24-25,36
Research for Adhesion of Ceramic Substrates by Direct Copper Bonding
yan xue xiu ; xu hong lin
..............
page:26-27
The Ceramic-to-Metal Seal Production Technology and Gas Media
gao long qiao
..............
page:28-30,34
A Discussion on the Reasons of the Rejects for Vacuum Interrupter
ye shao jie ; kuang yan rong
..............
page:31-32
dian zhen kong qi jian yong tao ci jin shu hua he you hua gong yi de gai jin
wu chun rong ; li ming xing
..............
page:33-34
Application of the Precision Electrical Discharge Machining Technology in the Electrical Vacuum Components
chen tong jiang ; hou yu mei
..............
page:70-72
Machining for the Shell of A Compound Material of Tu1-NCu40-2-1
wang jun
..............
page:66-69
Development on Electrical Vacuum Parts' Machining Accuracy by Using Precision NC Machining Technology
chi xun
..............
page:63-65
Application of the New Type Pd-Ba Cold Cathode in the CFA
song zhen hong
..............
page:60-62
zhen kong jian lou shi ye de fa zhan he zhan wang
zhou xiao di
..............
page:58-59
Glass Phase in High-Alumina Ceramics
zhu jun ; pu xue qin
..............
page:56-57
kai guan guan guan ke fei pin fen xi
huo shun zhi
..............
page:54-55
Joining of Ceramic to Metal by Active Metal Brazing
lu yan ping
..............
page:51-53
Design of Glaze Formulas Suitable for High Temperature Ceramic Metallizing
wang li jun
..............
page:48-50
Alumina Ceramics and Alumina Micro Powders
zhao ze hao
..............
page:45-47,53
Metallization Technologies for Micro-electronic Ceramic Packaging
zhang bing qu ; zhao ping ; dai zeng rong
..............
page:41-44
The Pollution on the Surface of Ceramics Vacuum Envelope when Mo Ions are Oxidized
yang bao zhu
..............
page:39-40,50
How to Improve the Qualities of the Glaze Surface for Ceramic Housing
liu jian hong
..............
page:37-38
A Discussion on Skewbald of Ceramic Metallization
lu huang
..............
page:35-36