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Vacuum Electronics
1002-8935
2003 Issue 4
Study of Quality and Reliability of Ceramic-to-Metal-Seal
gao long qiao
..............page:1-5
Generation Mechanism of Internal Stress during Liquid-Solid Conversion of Colloidal Injection Moulding
yang jin long ; ma li guo ; ma tian ; huang yong
..............page:9-12
Inspection and Evaluation of 95% Alumina Ceramics
zeng gui sheng
..............page:15-19
Research for Adhesion of Ceramic Substrates by Direct Copper Bonding
yan xue xiu ; xu hong lin
..............page:26-27
The Ceramic-to-Metal Seal Production Technology and Gas Media
gao long qiao
..............page:28-30,34
A Discussion on the Reasons of the Rejects for Vacuum Interrupter
ye shao jie ; kuang yan rong
..............page:31-32
dian zhen kong qi jian yong tao ci jin shu hua he you hua gong yi de gai jin
wu chun rong ; li ming xing
..............page:33-34
Application of the New Type Pd-Ba Cold Cathode in the CFA
song zhen hong
..............page:60-62
zhen kong jian lou shi ye de fa zhan he zhan wang
zhou xiao di
..............page:58-59
Glass Phase in High-Alumina Ceramics
zhu jun ; pu xue qin
..............page:56-57
kai guan guan guan ke fei pin fen xi
huo shun zhi
..............page:54-55
Joining of Ceramic to Metal by Active Metal Brazing
lu yan ping
..............page:51-53
Alumina Ceramics and Alumina Micro Powders
zhao ze hao
..............page:45-47,53
Metallization Technologies for Micro-electronic Ceramic Packaging
zhang bing qu ; zhao ping ; dai zeng rong
..............page:41-44
A Discussion on Skewbald of Ceramic Metallization
lu huang
..............page:35-36