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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
China Adhesives
1004-2849
2014 Issue 8
Study on thermal stability of cashew nut shell liquid modified phenolic resin
Feng Xiaoqin;Liu Yuan;Luo Jun;School of Chemical Engineering;Guizhou Institute of Technology;Guizhou Provincial College Special Engineering Center for Materials Protection of Wear and Corrosion;Guiyang University;
..............page:1-3
Study on heat aging resistance of EPS wood adhesive
Liu Yunxue;Li Lan;Yao Pengcheng;Tang Yuanliang;Ge Dali;School of Material Science and Engineering;Shenyang Jian Zhu University;Shenyang Zhongchen Steel Structure Engineering Co.;Ltd.;
..............page:4-8
Synthesis and characterization of energetic adhesive BAMO-THF-GAP random copolyether
Liu Jianxin;Wang Cundong;Pan Hongbo;Peng Jing;Zhang Lihua;Chemical Industry and Ecology Institute;North University of China;
..............page:9-12
Study on high-performance benzoxazine molding composites
Wu Ke;Wang Rumin;Zeng Jinfang;Dong Dazhou;Department of Applied Chemistry;College of Science;Northwestern Polytechnical University;Xi’an Aerospace Composites Research Institute;
..............page:13-15+34
Preparation and characterization of a core/shell type nanoparticle
Sun Xiaohao;Shao Shuiyuan;School of Materials Science and Engineering;Xi’an University of Science and Technology;
..............page:16-19
A low molecular weight polyisobutylene epoxidized by dimethyl dioxirane
Wang Dongxia;Li Jianxiong;Liu Anhua;Gao Shichu;School of Materials Science and Engineering;South China University of Technology;
..............page:20-23
Influences of molecular structures on synthesis and properties of polyimide
Xu Xiaolu;Guizhou Provincial College Special Engineering Center for Materials Protection of Wear and Corrosion;GuiyangUniversity;
..............page:24-26+34
Influences of curing process on conductivity of silver conductive adhesive
Xiong Nana;Wang Meina;Zhang Hanping;Yang Shiyong;Tan Zhe;Wang Yuehui;Li Jingze;State Key Laboratory of Electronic Thin Films and Integrated Devices;School of Microelectronics and Solid-State Electronics;University of Electronic Science and Technology;Department of Chemistry and Biology;China Zhongshan Institute;University of Electronic Science and Technology;
..............page:27-30
Study on preparation and its film-forming properties of half-curing film with high thermal conductivity for metal base copper clad laminates
Zheng Chao;Wang Zhehui;Wang Ping;Jiang Xiuzhong;Institute of Chemical Engineering;Taishan Medical College;
..............page:31-34
Synthesis of p-aminobenzenesulfonate-melamine-formaldehyde copolymer resin for superplasticizer
Shen Xiaolei;Wu Tao;Zhu Caixia;Zeng Xiaojun;School of Chemistry and Material Engineering;Changshu Institute of Technology;Jiangsu Key Laboratory of Advanced Functional Materials;Changshu Institute of Technology;
..............page:35-38
Study on preparation and properties of urea-formaldehyde resin adhesive modified by phenol and polyvinyl alcohol
Liu Xuan;Yu Qingyang;Yu Lizhen;Shen Limei;Gu Shunfei;Fan Yuchang;School of Chemistry and Material Engineering;Changshu Institute of Technology;
..............page:39-42
Study on bonding technic of silicone rubber
Ma Huan;Qi Shuhua;Zhang Fan;Shi Jinling;Department of Applied Chemistry;School of Science;Northwestern Polytechnical University;
..............page:43-47
The latest application status of carbon fiber reinforced resin matrix composites
Peng Jintao;Ren Tianbin;School of Materials Science and Engineering;Tongji University;
..............page:48-52
huan bao xing wu ji - you ji ju an zuo chao shu shui xing tu ceng de zhi bei
wei xiao li ; zhang fa xing ;
..............page:53-55
zhuan li jie shao
..............page:59-60