China Adhesives 2011 Issue 10 Discussing adsorption behavior and adsorption mechanism of crosslinked starch microspheres on anilin

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China Adhesives
1004-2849
2011 Issue 10

Discussing adsorption behavior and adsorption mechanism of crosslinked starch microspheres on anilin
Zhao Qianfei;Su Xiuxia;Li Zhongjin

..............page:1-5

Research and preparation of SiO2 hybrid environment-friendly PF
Wu Jiangtao;Qi Shuhua;Li Chunhua;Yin Biwen

..............page:6-9

Study on bonding properties for bisphenol A benzoxazine resin
Wang Qingsong;Ning Rongchang;Ai Jing

..............page:10-13

Study on curing kinetics for polyamide acid/epoxy resin
Wang Cheng;Gao Xiaojun;Yu Juan;Wang Xiaodong;Huang Pei

..............page:14-17

wa ke tui chu gao xing neng jiao zhan ji he mi feng ji xin pin

..............page:17

Structure characterization for dicyclopentadiene-styrene copolymer resin
Li A iyuan;Sun Xiangdong;Zhang Huibo;Peng Zhenbo

..............page:18-22

de guo han gao ji tuan tui chu wu yi qing suan gen jiao zhan ji

..............page:22

Synthesis and characterization of WPU/SBB composite emulsion for coating HNIW
Liao Suran;Luo Yunjun;Sun Jie;Tan Huimin

..............page:23-27

Influences of Ca2+ contents on WPU emulsion and film properties
Jiang Jilei;Su Xiuxia;Hui Yuanyuan

..............page:28-31

yong guang tui chu xin xing ju an zuo tie he jiao

..............page:31

wa ke tui chu yi yong you ji gui jiao zhan ji

..............page:31

Study on properties for UF adhesive intercalated into cation modified MMT
Qin Bei

..............page:32-36

Study on preparing cassava dialdehyde starch adhesive for wood
Hu Lei;Gao Qunyu

..............page:37-40

Study on preparation and properties of modified silicate adhesive
Zhang Qin;Yi Shouzhi;Ma Hongyun

..............page:41-44

Study on one-component EP structure adhesive with moderate temperature curing
Ai Jing;Ning Rongchang;Wang Qingsong

..............page:45-48

Study on curing accelerant for epoxy resin
Yin Xiongfei;Shi Wei;Yi Na

..............page:49-53

Application and development trend of adhesives in process of machining photoelectric element
Ju Hongbing;Yang Junhong;Zhao Chengbo;Zi Yunxu;Xun Tao;Zhang Baofu

..............page:54-57

Research progress of epoxy resin and adhesives modified by tougheners
Yang Weipeng;Hao Zhuang;Ming Lu

..............page:58-62

de guo han gao xin tui huan bao jie neng xing jiao zhan ji

..............page:62

tao shi hua xue tui chu feng dian ye pian yong xin xing ep jiao zhan ji

..............page:62

xin xi dong tai

..............page:63-64

zhuan li jie shao

..............page:63-64

zheng jiao you hua fa zhi bei huan bao xing zi wai guang gu hua you mo
gong yan ; xie guo qing ; liu yang ; lu cui ping

..............page:65-66

zheng jiao you hua fa zhi bei huan bao xing zi wai guang gu hua you mo
gong yan ; xie guo qing ; liu yang ; lu cui ping ;

..............page:65-66