China Adhesives 2010 Issue 6 Study on kinetics of polyimide modified EP/anhydride curing system

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China Adhesives
1004-2849
2010 Issue 6

Study on kinetics of polyimide modified EP/anhydride curing system
qi zuo liang ; zhang guang cheng ; li zuo ming

..............page:4-6

..............page:15-20

..............page:60-61

Research progress of precoatable microcapsule type anaerobic adhesive
chen yao ; hu xiao yong ; zhang yin zhong

..............page:54-57

Study on structure and performance of sealants for automotive windscreen
cao chun li ; zhang jun ying ; wang rui ; cheng zuo ;qu jun;jaeger urs

..............page:33-38

..............page:前插4

..............page:11-14

Study on increasing range of PSA peeling strength for protective film
wu peng ; feng xiao ping ; qi shu hua ; liu nai liang ; mao sheng hua ; li sheng hua

..............page:46-49

Modification research progress for heat resistance of phenolic resin
cao peng ; qi shu hua ; li sha sha ; cheng bo

..............page:50-53

..............page:7-10

Study on heat resistance of silicone adhesives
wu jun ; huang shi qiang

..............page:30-32

xin xi dong tai

..............page:14,29,49,53,58-59,61

Study on preparation of polyvinyl butyral adhesives
shen zuo zuo ; zhu chuan yong ; wang shao li

..............page:39-41

..............page:42-45

..............page:61

Study on conductivity behavior of MWNTs/HDPE composites
ding yang ; ji tie zheng ; mo xiang you ; li bo ; song wen chao

..............page:25-29

Study on testing ability of imaging method for bonding quality
li jian wen ; wang zeng yong ; sun chao ming ; yang zhan feng

..............page:1-3

..............page:21-24