China Adhesives 2009 Issue 7 Study on preparation and performance of antistatic adhesives based on PU/conductive carbon black composite

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China Adhesives
1004-2849
2009 Issue 7

Study on preparation and performance of antistatic adhesives based on PU/conductive carbon black composite
LIANG Shu-en;TIAN Chun-rong;GU Yuan;WANG Jian-hua

..............page:1-4

Study on novel polyether elastic adhesive modified by silane
WANG Zhi-zheng;ZHOU You-liang;HUANG Shi-qiang

..............page:5-7

Numerical value analysis of stress distribution in crippling bonding joints
LUO Wei;YOU Min;ZHENG Xiao-ling;ZHU Ding-feng

..............page:8-11

Study on environment-friendly BN hybrid phenolic resin
LI Chun-hua;QI Shu-hua;MO Jun-lian

..............page:12-16

Study on preparation and performances of hot melt adhesive with low cost based on modified starch/EVA blends
QIAN Zhi-guo;WANG Yong-tao;HAN Yu ;REN Tian-bin

..............page:17-21

Study on preparation of a non-solvent sizing agent for paper surface based on waste polystyrene foam
ZHANG Guang-hua;ZHANG Wan-bin;ZHU Xue-dan;LIU Lin-tao

..............page:22-25

Study on preparation of antistatic and high temperature resistance composites
ZHANG Bin

..............page:26-28

Study on preparation and performance of light-heat dual curable polyacrylate pressure sensitive adhesive
XU Zhi-yi;LIAO Jian-he;LIAO Shuang-quan;TANG Sheng-bin

..............page:29-33

Lead-free interlinkage technique and electrically conductive adhesive in encapsulation of micro-electronics
ZHA NG Shao-dong;FU Ren-li;ZENG Jun;SHI Zhi-xiang;SONG Xiu-feng

..............page:34-40

Research progress of enhancing bonding performances for PTFE pretreated by plasma and modified by grafting
CHEN Ming-hua;KAO Kai-chang;WANG Zhi-chao

..............page:41-47

Study on modification and application of cyanate ester resin
GONG Da-jun;WEI Bo-rong;LIU Yu-yang

..............page:48-53

Application research progress of starch adhesives
ZHANG Chang-hua;ZHENG Qiang

..............page:54-58

Failure analysis of die attach adhesive for encapsulation SMT LED
CHEN Jian-wei;WANG Hai-long

..............page:59-63

Application research progress of hyperbranched polyesteramide
ZHANG Xin-li;ZHANG Ke-qing

..............page:64-68

e0 ji san ju qing an gai xing zuo quan shu zhi zhi bei ji shu
zhang yun ming ; wei zuo feng

..............page:71

dian dong ji di jiao de zhan jie
jiao wei guang

..............page:71