Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
China Adhesives
1004-2849
2008 Issue 11
Fabrication of ceramic MEMS devices by polymer precursor derived ceramic
LV Hong-ying;CHEN Li-xin;WANG Ya-zhou;ZHANG Jiao-qiang
..............page:56-60
Current research progress of polymerization methods for polyurethane-acrylate composite emulsion
WANG Yue-ju;YANG Jian-jun;ZHANG Jia-nan;WU Qing-yun;WU Ming-yuan
..............page:51-55
Research progress of biodegradable adhesive
CHEN Ying;HUANG Ying;MIAO Lu;ZHAI Qing-xia
..............page:46-50
Study on conductive adhesive with cuprum powder as conductive filler
LIU Yun-xue;WANG Xiao-dan;GU Ya-xin;FAN Zhao-rong
..............page:27-29
Study on reduced graphite conductive adhesive
LIN Wei;YU Chao-sheng
..............page:20-26
Study on synthesis and performance of a super absorbent polymer with large size and beaded by inverse-suspension polymerization
LIU Qin;FAN Xiao-dong;SU Xia;LIU Tao;GAO Zhi-liang;LIU Guo-tao
..............page:16-19
Study on influence factor for VeoVa/VAc/BA emulsion viscosity
ZHANG Tai-long;DING Sheng;FU Yan
..............page:13-15
Influence of modified nano-CaCO3 on epoxy resin adhesive performance
YUAN Qing-feng;GAO Yan-min;ZHU Jing-yan;LV Wei-gang
..............page:5-8
Study on epoxy resin systems with high elongation at break
ZHANG Xiao-a;ZHANG Jun-ying
..............page:1-4