1004-2849
2006 Issue 3
..............page:51-52
High-speed label adhesive for beer bottle
WANG Liang-dong;DU Feng-guang;SHI Ji-ping;YAN De-ran;DONG Qing-shan
WANG Liang-dong;DU Feng-guang;SHI Ji-ping;YAN De-ran;DONG Qing-shan
..............page:48-50
Application of starch-based adhesive in architectural coatings
XUE Xin-shun;LUO Fa-xing;HUANG Qiang
XUE Xin-shun;LUO Fa-xing;HUANG Qiang
..............page:45-47
Review of poly(lactide-co-amino acid) controlled-release drug carrier microparticles
WANG Ning;YAO Jun-yan;GUO Bao-hui;YANG Qing-fang;SHU Xiao-jun
WANG Ning;YAO Jun-yan;GUO Bao-hui;YANG Qing-fang;SHU Xiao-jun
..............page:39-44
..............page:34-38
Development of two-component silane-terminated PU elastomeric sealants
WANG Rong-chang;LI Ying
WANG Rong-chang;LI Ying
..............page:32-33,38
Study on environmental protection and heat-resistant adhesives based SBS for decoration
XIANG Shang-lin;YANG Chen;SHI Wei;CHEN Rui-zhu
XIANG Shang-lin;YANG Chen;SHI Wei;CHEN Rui-zhu
..............page:29-31
Study on curing reactions and application of E-44 epoxy resin
LIANG Cui;ZHONG Hong
LIANG Cui;ZHONG Hong
..............page:26-28,44
Study on adhesive applied for mending antique pottery
DONG Bing-hai;XIA Lu;TAN Bai-ming
DONG Bing-hai;XIA Lu;TAN Bai-ming
..............page:23-25
Study on the phenol-formaldehyde resin adhesive modified with lac
WANG Xia;LI Jian-zhang;ZHOU Wen-rui;ZHANG De-rong
WANG Xia;LI Jian-zhang;ZHOU Wen-rui;ZHANG De-rong
..............page:19-22
The research on corrosion resistance of epoxy resin nano-montmorillonite adhesive
LI He-liang;LIU Jing-fu
LI He-liang;LIU Jing-fu
..............page:15-18
Effect of SiO2 filler on the elastic modulus and Poisson's ratio of epoxy layer
YOU Min;CAO Ping;WEI Xiao-hong;YU Hai-zhou
YOU Min;CAO Ping;WEI Xiao-hong;YU Hai-zhou
..............page:12-14
Influence of chain transfer agent and polar monomer on properties of acrylic acid copolymerized emulsion pressure-sensitive adhesive
ZHOU Wei-ping;WEN Huo-sheng
ZHOU Wei-ping;WEN Huo-sheng
..............page:8-11
Research on modified epoxy resin for electronic mold encapsulation with toughness and flame retardance
GE Jian-fang;ZHANG Ya-ping;LIANG Shi-qiang;LI Zhen-hua
GE Jian-fang;ZHANG Ya-ping;LIANG Shi-qiang;LI Zhen-hua
..............page:4-7,11
Study on nano-TiO2/anionic aqueous polyurethane adhesive
WANG Chun-hui;LI Shu-cai
WANG Chun-hui;LI Shu-cai
..............page:1-3