1681-5289
2013 Issue 3
Enhancing Overall System Functionality and Performance with the Right Packaging Solutions
Nozad Karim;ZOU Yi-da;WEN Sheng-min
Nozad Karim;ZOU Yi-da;WEN Sheng-min
..............page:66-73
..............page:74-77,81
..............page:78-81
..............page:34-35,73
zheng che dian zi xi tong gong yi de kai fa yu ying yong
hu chang hua ; lu yong shan
hu chang hua ; lu yong shan
..............page:82-86
Design of Current Limit Control in Switching Power Chip
LIU Chong;DAI Qing-yuan;OU Yu;HUANG Jie-ke
LIU Chong;DAI Qing-yuan;OU Yu;HUANG Jie-ke
..............page:36-39
Logging winch depth and speed measurement system design
CHEN Li-juan;REN Jia-fu;ZHANG Tao
CHEN Li-juan;REN Jia-fu;ZHANG Tao
..............page:87-90
An Efficient Physical Coding Sublayer for PCI Express2.0 in 65nm CMOS
LIU Qi-hao;WENG Hui-hui;ZHANG Feng;ZHAO Jian-zhong;LV Jun-sheng;LI You
LIU Qi-hao;WENG Hui-hui;ZHANG Feng;ZHAO Jian-zhong;LV Jun-sheng;LI You
..............page:40-45
da rong liang lin suan tie zuo dian chi xu yao da gong lv chong dian qi
steve knoth;trevor barcelo
steve knoth;trevor barcelo
..............page:46-48,53
..............page:49-53
..............page:54-56,62
Flip-Chip Bonding Process Improvement in FPC Product
ZHENG Zhi-rong;CUI Song
ZHENG Zhi-rong;CUI Song
..............page:57-62
The Study of Hardener Influence on the Curing Reaction of Epoxy Molding Compound
ZHU En-bo;JIA Lu-fang;HU Chang-feng;XIE Guang-chao;YU Wei-gao
ZHU En-bo;JIA Lu-fang;HU Chang-feng;XIE Guang-chao;YU Wei-gao
..............page:63-65
..............page:31-33
The Risk of Military Integrated Circuit Supply Chain in the United States and its Countermeasures
HU Kai-bo;ZHANG Qian
HU Kai-bo;ZHANG Qian
..............page:24-30
..............page:18-23
..............page:12-17,23
..............page:1-11,后插1-后插3