Printed Circuit Information 2016 Issue z2 Seamless linking between CAM and ERP

Seamless linking between CAM and ERP
ZHANG Hao;,QIN Xin;,DING Jian;,CHEN Min;

..............page:1-16

Design of a mobile phone transmission cable based on HFSS
LU Ping;

..............page:17-23

Study on differential via of high-speed PCB
LIU Wen-min;,CHENG Liu-jun;,WANG Hong-fei;,LI Yan-guo;

..............page:24-28

Study on the impedance consistency of high-speed PCB
CHENG Liu-jun;,LIU Wen-min;,WANG Hong-fei;,CHEN Bei;

..............page:29-37

Systematic research on high speed signal Influence of copper thickness, line width and copper surface roughness
LI Min-shan;

..............page:38-47

Effect of PCB copper surface treatment process on high-frequency signal transmission
mao ying jie ;, he wei ;, wang shou xu ;, zhou guo yun ;, chen yuan ming ;, su xin hong ;, hu yong shuan ;, hu xin xing ;, wu shi ping ;

..............page:48-56

Development of plugging resin used for PCB with large or highly dense holes
DING Jie;,CHEN Hong;,WANG Kuo-jun;,TANG Zhang-jun;,CAI Xiao-song;

..............page:57-63

A pretreatment method of wet and dry film which is superior to ultra coarsening
ZHONG Ru-quan;

..............page:64-70

The effect of solder mask curing degree to bonding force
ZHOU Bo;,TIAN Jia;,HU Meng-hai;

..............page:71-77

The 38 μm/38 μm fine line manufacturing
CHEN Juan;,LI Juan;,LI Yan-guo;

..............page:78-83

The effect of different light type to ink light curing degree
CHEN Bi-yu;,CHEN Li-yang;,YE He-yuan;

..............page:84-91

Research of the mechanism and improving about the concentrative smudginess on the surface of board
TANG Chang-sheng;,YANG Xing-ming;

..............page:92-99

Study on alkaline etching dynamic compensation coefficient of different basic copper
ZHANG Jun;,TAN Xiao-lin;,CHEN Qian;,WANG Jun;,ZHANG Kai-rui;

..............page:100-105

Influence of the synergetic effect of convection and leveler on the throwing power
LAI Zhi-qiang;,WANG Chong;,HE Wei;,CHENG Jiao;,LIANG Kun;,XIAO Ding-Jun;

..............page:106-110

Research on through-hole filling by copper electroplating for high density interconnection (HDI) manufacture
PEN Jia;,WANG Yu;,HE Wei;,XI Dao-lin;,CHEN Jiao;,LIANG Kun;

..............page:111-117

Feasibility study of employing gloxylate to activate copper lines for ENIG without Pd
LIN Jian-hui;,LIANG Kun;,YANG Wen-jun;,WANG Shou-xu;,LIU Bin-yun;,HE Wei;

..............page:118-122

Discussion about the design of the engineering process of selective nickel and the thick gold platting
LAI Chang-lian;,YANG Lin;

..............page:123-129

Analysis of a typical skip plating phenomenon in ENIG
ZHANG Peng-wei;,CHEN Li-yang;,LUO Chang;,HAO Qiang-li;,JI Meng-jie;

..............page:130-134

Failure analysis of blind via separation in IC substrate
SUN Hong-chao;,WANG Ming-hao;,XIE Tian-hua;,LI Zhi-dong;

..............page:135-143

Study on the effect of wave disturbance of PPR on throwing Power of high-aspect-ratio vias
LIU Zu-shan;,ZHU Chen;,CHEN Bei;

..............page:144-148

Study of the key factors affecting interface caves in IMAg PCBs
LU Zhiqiang;,CHEN Li-yang;,ZHANG Peng-wei;,AI Xin;

..............page:149-154

Analysis of the cause of blackening film surface after reflow on OSP
XIN Yu-wei;,ZHANG Jian;

..............page:155-161

Study on influence factors of ashing rate by plasma
CAO Da-fu;,SONG Xiang-qun;,XING Yu-wei;,YUAN Ji-wang;

..............page:162-169

Rigid flexible board making process applied to mobile phone camera
NIE Da-qing;,YE Jin-qun;,ZHANG Yong-mou;

..............page:170-173

The effect of copper plating on bending properties in FPC
LI Chong;,LIN Chu-tao;,LI Yan-guo;,CHEN BEI;

..............page:174-181

Research on the improvement of the binding force of the printing legend on the cover lay
WANG Zhao;,LIN Chu-tao;,LI Yan-guo;,CHEN PEI;

..............page:182-189

The size deviation of the Rigid-flex PCB with the design of the bonding finger
SONG Lin-peng;,SHI Xue-bing;,TANG Hong-hua;,CHEN CHUN;

..............page:190-196

Application of plasma cleaning in manufacture of multilayer Rigid-flex Boards
CHEN Qiao;,LIU Bin-yun;,LAI Zhi-qiang;,XIAO Ding-jun;,WANG CHONG;

..............page:197-200

Rigid-flex bending solution research
ZHANG He-gen;

..............page:201-207

Study on optimization of flow sizing control for non flowing/low flow prepreg
LI Wen-guan;,ZHANG XIA;,MA YI;,ZENG PING;,WANG JUN;

..............page:208-212

A brief discussion on the embedded capacitor PCB processing
HAO Yu-juan;,ZHENG Jian-ping;,LIU Ri-fu;,PENG Lang;

..............page:213-219

Research on high-withstand-voltage PCB applied to Thick Gaseous Electron Multiplier
WU Jun-quan;,TANG Hong-hua;,LIN Ying-sheng;,CHEN Chun;,XIE Yu-guang;

..............page:220-227

Research on the production technology of embedded component PCB with coverlay protection
LIN Qi-heng;,WEI Xiong;,LIN Ying-sheng;,CHEN Chun;

..............page:228-233

Research on PTFE material reliability
WAN Li-peng;,TANG Hai-bo;

..............page:234-241

The iron implant technology research on PCB
HUANG De-jun;,LI Zhao-fei;,WANG Wei-ye;

..............page:242-247

Embedded component in PCB solution for power module
HUANG Li-xiang;,LUO Bin;

..............page:248-253

Research on the stubs length of backdrilling
CUI Rong;,LI Zhi;

..............page:254-262

Analysis and research on starved resin of lamination for HDI
ZHONG Hao;,QIAO Peng-cheng;,ZHAO Hong-jing;,CHEN Zhi-yu;

..............page:263-266

Research on the surface smooth modification technology of high frequency Printed Circuit Board
wen na ;, he wei ;, wang shou xu ;, zhou guo yun ;, huang ji mao ;, zhou xian wen ;, wang zuo ;, xu huan ;

..............page:267-272

Research on mis-registration of lamination parameter effect
JIN Wen-xiong;,LI Qin-yuan;,LAN Fu-ming;,HAN Ming;

..............page:273-280

Impact of No-flow PP on reliability of rigid-flex PCB
ZHU Guang-Yuan;,WANG Zhao;,LIN Chu-Tao;,CHEN Bei;

..............page:281-287

Research about the change of shape processing size
LIN Fei;

..............page:288-294

Research on the drilling technology of high aspect ratio micro via
LUO Bin;,CHAI Chao;,LIU Chun-yu;

..............page:295-300

Research for wireless data collection based on radio frequency
CHEN Rui;

..............page:301-305

Cleaner production How to manage the process of saving water
CHEN Peng-yu;,HAO Bao-jun;,WANG Yu-chen;

..............page:306-311

Research on application of engraving equipment in PCB traceability system
GONG Jie;,LI Qin-yuan;,OUYANG Hong;,TAO Qi-guo;

..............page:312-324

The cost advantage analysis of LDI in producing industrial control HDI products
DONG Meng;,LI Xiang-hua;,SUN Yu-kai;,ZHOU Zhi-yong;,FU Hong-yu;

..............page:325-330

Effect of triazine mercaptan on the properties of Copper Clad Laminate
MENG Yun-dong;,HUANG Zhu-jin;,XU Ying;,FANG Ke-hong;

..............page:331-334

Application and practice of the total involvement energy saving delicacy management
MIN Xiu-hong;

..............page:335-341

Research on application of ultra-thin technology in HDI PCB
CHEN Shi-jin;

..............page:342-349

Study of plugging process with copper slurry
LENG Ke;,LI Xiang-yang;,LIU Hai-long;,LIU Jing-feng;

..............page:350-356

qian yan

..............page:前插1