1009-0096
2016 Issue z1
The challenge of high-end storage product design for PCB production
SUN Jun;,HUANG Yun-zhong;,WANG Cheng-li;
SUN Jun;,HUANG Yun-zhong;,WANG Cheng-li;
..............page:1-8
Study on high-speed channel of PCB
FAN Hong;,WANG Hong-fei;,CHEN Bei;
FAN Hong;,WANG Hong-fei;,CHEN Bei;
..............page:9-15
Study on effect of base material shrinkage-stretch in different pretreatment during the brush grinding process
CHEN Shi-jin;,HUANG Gan-hong;,HUANG Li-hai;,HU Zhi-qiang;,HE Wei;
CHEN Shi-jin;,HUANG Gan-hong;,HUANG Li-hai;,HU Zhi-qiang;,HE Wei;
..............page:16-26
The production and application research of a special high-precision entry board used in back-drilling
LIU Fei;,ZHANG Lun-qiang;,TANG Jia-lin;,LUO Xiao-yang;
LIU Fei;,ZHANG Lun-qiang;,TANG Jia-lin;,LUO Xiao-yang;
..............page:27-33
The solution for poor resin issue in lamination with ultra thin prepreg 1027
GUI Hang-yang;,WU Hui-lan;
GUI Hang-yang;,WU Hui-lan;
..............page:34-39
IFOV technology application research in UV laser drilling machine
YU Ting-xun;,GUO Meng-zu;,DU Xiao-jun;
YU Ting-xun;,GUO Meng-zu;,DU Xiao-jun;
..............page:40-49
Research on the characteristic power amplifier cavity
WU Hui;,LIU Ri-fu;,PANG Li;,HAO Yu-juan;
WU Hui;,LIU Ri-fu;,PANG Li;,HAO Yu-juan;
..............page:50-62
Improve the quality of LDD process
XU Ming;
XU Ming;
..............page:63-74
..............page:75-81
Process optimization of PTH at higher temperature and higher current density
LAI Zhi-qiang;,WANG Chong;,HE Wei;,CHENG Jiao;,XIAO Ding-jun;
LAI Zhi-qiang;,WANG Chong;,HE Wei;,CHENG Jiao;,XIAO Ding-jun;
..............page:82-88
Research on the use of FA intelligent software for electroplating
SUN Xin-fa;,GAO Tuan-fen;
SUN Xin-fa;,GAO Tuan-fen;
..............page:89-95
Analysis and optimization of the influence factors on the uniformity of electroplating copper
LI Jiu-Juan;,CHEN Yuan-ming;,He Wei;,CHEN Xian-ming;,ZHAN Hong-bin;
LI Jiu-Juan;,CHEN Yuan-ming;,He Wei;,CHEN Xian-ming;,ZHAN Hong-bin;
..............page:96-102
Research on PCB electroless Ni-Pd alloy plating
LAI Fu-dong;,CHEN Shi-rong;,HUA Shi-rong;,XIE Jin-ping;,FAN Xiao-ling;,TAN Xiao-lin;,KE Yong;
LAI Fu-dong;,CHEN Shi-rong;,HUA Shi-rong;,XIE Jin-ping;,FAN Xiao-ling;,TAN Xiao-lin;,KE Yong;
..............page:103-108
The effect of chlorideion concentration on the electrochemical behavior of microcrystalline phosphorous copper anode
LI Jing-jun;,TAN Fa-tang;,ZHANG Ming-yi;,LI Ke;,CHEN Shi-rong;,WEN Wu-jian;
LI Jing-jun;,TAN Fa-tang;,ZHANG Ming-yi;,LI Ke;,CHEN Shi-rong;,WEN Wu-jian;
..............page:109-113
Stability study on the technology of soluble anode via filling plating
XI Dao-lin;,WAN Hui-yong;
XI Dao-lin;,WAN Hui-yong;
..............page:114-120
High/low speed drilling rig drilling efficiency comparison research
LIU Zu-shan;,CHEN Bei;,WANG Qi;
LIU Zu-shan;,CHEN Bei;,WANG Qi;
..............page:121-126
The exploring of VCP process optimization and equipment contrast
HU Jin-ping;,ZHONG Jun-chang;
HU Jin-ping;,ZHONG Jun-chang;
..............page:127-138
..............page:139-142
..............page:143-149
..............page:150-159
Study on the application of the four terminal resistance test in PCB electric performance test
ZHAO Yu;
ZHAO Yu;
..............page:160-165
The impact of solder mask on high-speed PCB impedance and loss
CHEN Liu-jun;,WANG Hong-fei;,CHEN Bei;
CHEN Liu-jun;,WANG Hong-fei;,CHEN Bei;
..............page:166-173
Study on PCB impedance test method and failure cases analysis
DONG Shen-lei;,ZHANG Wei-ze;,LV Hong-gang;
DONG Shen-lei;,ZHANG Wei-ze;,LV Hong-gang;
..............page:174-186
In-situ preparation of the precise silver conductive track and the application for flexible printing
PIAO Xian-qin;,CAI Ya-guo;,SUN Zhuo;,GAO Wei;
PIAO Xian-qin;,CAI Ya-guo;,SUN Zhuo;,GAO Wei;
..............page:187-194
A preliminary approach to manufacturing technology of semi-flex PCB
WEN Shi-bin;,ZHANG Hong-wei;,TAN Xiao-lin;
WEN Shi-bin;,ZHANG Hong-wei;,TAN Xiao-lin;
..............page:195-200
Study on the reliability of laser blind holes in the mixed dielectric material of rigid-flex PCB
YI Xiao-long;,LIN Chu-tao;,CHEN Bei;
YI Xiao-long;,LIN Chu-tao;,CHEN Bei;
..............page:201-208
Research of high layer count PCB and the key production technology
WANG Zuo;,PENG Wei-hong;,ZHANG Pan-pan;,LIU Ke-gan;,WANG Shu-yi;
WANG Zuo;,PENG Wei-hong;,ZHANG Pan-pan;,LIU Ke-gan;,WANG Shu-yi;
..............page:209-216
Production and application of the ultrahigh thermal conductivity ceramics
ZHAI Qing-xia;,LI Jin-long;,HUANG Hai-jiao;
ZHAI Qing-xia;,LI Jin-long;,HUANG Hai-jiao;
..............page:217-222
The impact of AL surface treatment on the peel strength between rigid-flex circuit board
CHEN Liang-liang;,HU Ke-ke;
CHEN Liang-liang;,HU Ke-ke;
..............page:223-227
Research on the production process of conductive carbon paste PCB with high precision resistance
WU Jun-quan;,WEI Xiong;,LIN Yin-sheng;,CHEN Chun;
WU Jun-quan;,WEI Xiong;,LIN Yin-sheng;,CHEN Chun;
..............page:228-232
Research and improvement on the process optimization of embedded copper coin PCB
LIN Qi-heng;,LIN Ying-sheng;,WEI Xiong;,CHEN Chun;
LIN Qi-heng;,LIN Ying-sheng;,WEI Xiong;,CHEN Chun;
..............page:233-240
Research on the process of multilayer ladder board
LIU Yang-yang;,WANG Yi-xiong;
LIU Yang-yang;,WANG Yi-xiong;
..............page:241-247
A kind of manufacturing technology of VGA graphics board with I/L yin-yang copper thickness
LIU Jing-di;,ZHANG Yong-mou;,ZENG Xiang-fu;
LIU Jing-di;,ZHANG Yong-mou;,ZENG Xiang-fu;
..............page:248-254
..............page:255-257
Environmental protection engineering performing with industry 4.0 concept effectuates green manufacturing of printed circuit
WANG Yan-hui;,XIAO Ying-dong;,CHEN Zhi-qiang;
WANG Yan-hui;,XIAO Ying-dong;,CHEN Zhi-qiang;
..............page:258-260
..............page:前插1