1009-0096
2016 Issue 9
The development of targeted innovation
wang heng yi ;
wang heng yi ;
..............page:1
Driven to profitability——NTI-100 in 2015
Hayao Nakahara;,GONG Yong-lin;
Hayao Nakahara;,GONG Yong-lin;
..............page:5-11,30
..............page:12-16,35
Study of halogen free, high heat resistance copper clad laminate for high-multilayer PCB
JI Li-fu;,CHEN Xiang-xiu;,DAI Shan-kai;,HUANG Rong-hui;
JI Li-fu;,CHEN Xiang-xiu;,DAI Shan-kai;,HUANG Rong-hui;
..............page:17-22
Effect of epoxy resin with different molecular weight distribution on the properties of laminated sheet
MA Jie-fei;,YANG Yu;,WANG Xiao-bing;,MENG Yun-dong;
MA Jie-fei;,YANG Yu;,WANG Xiao-bing;,MENG Yun-dong;
..............page:23-26
Discussion on the production process of aluminum substrate
YANG Yu;,MENG Yun-dong;,PAN Hong-jie;
YANG Yu;,MENG Yun-dong;,PAN Hong-jie;
..............page:27-30
..............page:31-35
Research process of copper foil for preparation of graphene
SUN Yun-fei;,WANG Xue-jiang;,SONG Ji-chang;,YANG Xiang-kui;
SUN Yun-fei;,WANG Xue-jiang;,SONG Ji-chang;,YANG Xiang-kui;
..............page:36-42
..............page:43-45
The study of multi-channel high-speed transceiver circuit based on PCB stimulation
DAU Wen;,CHEN Li-jie;
DAU Wen;,CHEN Li-jie;
..............page:46-50,68
A brief discussion on the effect of PCB's solder mask plugged-hole to the copper in hole
WU Jiang-hao;
WU Jiang-hao;
..............page:51-55
PCB defect inspection method for electronic products
WU Ning-biao;,LIU Li-guo;
WU Ning-biao;,LIU Li-guo;
..............page:56-60
..............page:61-63
..............page:64-66
..............page:67-68
..............page:69-70
New Product & New Technology (111)
gong yong lin ;
gong yong lin ;
..............page:71
..............page:72