1009-0096
2016 Issue 7
..............page:1-1
The world will surely move towards big-data time
LIN Jin-du;
LIN Jin-du;
..............page:5-11
..............page:11-11
Research on the production method of high frequency and microwave interconnection PCB
LIU Ke-gan;,WANG Zuo;,LIU Dong;,PENG Wei-hong;
LIU Ke-gan;,WANG Zuo;,LIU Dong;,PENG Wei-hong;
..............page:12-17,26
A study on the production of buried copper
ZHANG Yong-mou;,ZHANG Huang-chu;
ZHANG Yong-mou;,ZHANG Huang-chu;
..............page:18-21
The technology of embedded metal coin thermal conductive PCB for automotive electronics
WU Tong-fang;
WU Tong-fang;
..............page:22-26
Research and discussion on the technology of golden ifngers
ZHAO Bo;,YU En;,ZHOU Wen-tao;
ZHAO Bo;,YU En;,ZHOU Wen-tao;
..............page:27-29,58
Progress of technology and application of substrate material used in automotive millimeter wave radar
ZHU Da-tong;
ZHU Da-tong;
..............page:30-36
The research of Copper Clad Laminate substrate under the drop impact load
LV Ji;,ZHANG Hong-xia;
LV Ji;,ZHANG Hong-xia;
..............page:37-40
Study on the modiifcation of EP/PN curing system with BPA
YI Qiang;,LIANG Guo-zheng;,TANG Qing-ke;,XIAO Sheng-gao;,CHEN Cheng;
YI Qiang;,LIANG Guo-zheng;,TANG Qing-ke;,XIAO Sheng-gao;,CHEN Cheng;
..............page:41-46
The Research on half via hole process
HAN Ming;,LI Qin-yuan;,PENG Jing-hui;,CHEN Xing-wu;
HAN Ming;,LI Qin-yuan;,PENG Jing-hui;,CHEN Xing-wu;
..............page:47-52,67
Improve problem of LED PCB edge section copper plating peeling off
HA Si Ge Ri Le Tu;
HA Si Ge Ri Le Tu;
..............page:53-55
..............page:55-55
..............page:56-58
The failure assistant device of rotating unit of regenerative thermal oxidizer
YAO Chun-quan;,ZHONG Shi-hua;,ZHONG Cai-lin;
YAO Chun-quan;,ZHONG Shi-hua;,ZHONG Cai-lin;
..............page:59-60
..............page:61-64
..............page:65-67
A production method of PTH process to solve encountered tape off about the R-FPCB with lfexible board
LIN Rong-fu;,HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
LIN Rong-fu;,HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
..............page:68-70
..............page:71-71
Technology & Abstract (173)
gong yong lin ;
gong yong lin ;
..............page:72-72