1009-0096
2016 Issue 6
Technology depth is to build the basis and technology amplitude is to promote the development of the industry
wang cheng yong ;
wang cheng yong ;
..............page:1
Introduce the Japanese technology roadmap for Printed Circuit Board(Part 3)——IC packaging substrate
GONG Yong-lin;
GONG Yong-lin;
..............page:5-13
The study on The relation between impedance controlled board dielectric constant and actual impedance value
QIU Cheng-wei;,QIN Shi-hang;,WANG Yu-zhou;
QIU Cheng-wei;,QIN Shi-hang;,WANG Yu-zhou;
..............page:14-17
The fabrication process optimization for 40 μm/40 μm fine line
ZHU Meng;,WU Dao-xin;,XIAO Zhong-liang;,ZHANG Wen-jing;,WU Rong;,ZHOU Guang-hua;
ZHU Meng;,WU Dao-xin;,XIAO Zhong-liang;,ZHANG Wen-jing;,WU Rong;,ZHOU Guang-hua;
..............page:18-21
Analysis and improvement of ragged edge
XIE Ming-yun;,ZENG Hong;,GUAN Jun-xuan;,PENG Jing-hui;
XIE Ming-yun;,ZENG Hong;,GUAN Jun-xuan;,PENG Jing-hui;
..............page:22-25,42
The cause and improvement measures of dentate circuit
HAN Yan-lin;,LIU Dong;
HAN Yan-lin;,LIU Dong;
..............page:26-31
Application of program analysis method on increasing drilling efficiency of PCB
LIU Bai-lan;,XUN Rui-ping;,ZHONG Yu-ling;,AO Si-chao;
LIU Bai-lan;,XUN Rui-ping;,ZHONG Yu-ling;,AO Si-chao;
..............page:32-34
Research on the blind via and through hole plating technology of HDI printed boards
ZHANG Pan-pan;,LIU Dong;,SONG Jian-yuan;,WANG Shu-yi;
ZHANG Pan-pan;,LIU Dong;,SONG Jian-yuan;,WANG Shu-yi;
..............page:35-37,65
..............page:38-42
Study on having no copper in the holes in batches of PCB
XU Wen-zhong;,ZHANG Liu;,ZHANG Yi-bing;,XUN Rui-ping;,LI Jiang;
XU Wen-zhong;,ZHANG Liu;,ZHANG Yi-bing;,XUN Rui-ping;,LI Jiang;
..............page:43-46
Plating copper whisker forming mechanism and study
LIN Xiu-xin;
LIN Xiu-xin;
..............page:47-49
A high dispersion black hole solution for direct plating
FU Fei-yan;,ZHOU Zhong-cheng;,YANG Meng-hui;,ZHAO Qi-zhi;,YU Jin;
FU Fei-yan;,ZHOU Zhong-cheng;,YANG Meng-hui;,ZHAO Qi-zhi;,YU Jin;
..............page:50-52
Automatic potentiometric titration method determined the content of low concentration chlorine ion in copper sulfate
FAN Xiao-ling;,XIE Jin-ping;
FAN Xiao-ling;,XIE Jin-ping;
..............page:53-55
..............page:55,72
Servo characteristics analysis and performances optimization of automatic stiffener adhesive machines
MEI Ling-liang;,GENG Tao;,LIN Ke;,CAI Hang-hang;
MEI Ling-liang;,GENG Tao;,LIN Ke;,CAI Hang-hang;
..............page:56-59
Investigation of scientific design and planning for PCB waste water high standard emission limits
HUANG Sheng-rong;
HUANG Sheng-rong;
..............page:60-65
Cause analysis of delamination in buried hole intensive areas
ZENG Xian-xi;,ZHAO Zhi-ping;
ZENG Xian-xi;,ZHAO Zhi-ping;
..............page:66-67
Improvement of dense hole drilling plug
SHEN Wen-bin;,LI Xiao-hai;,YE Han-xiong;,LIU Zao-lan;
SHEN Wen-bin;,LI Xiao-hai;,YE Han-xiong;,LIU Zao-lan;
..............page:68-70
..............page:71