1009-0096
2016 Issue 5
High performance is based on base material
gong yong lin ;
gong yong lin ;
..............page:1
..............page:5-8
Introduce the Japanese technology roadmap for Printed Circuit Board(Part 2)——Rigid PCB
GONG Yong-lin;,LI Min-ming;,MA Ming-cheng;
GONG Yong-lin;,LI Min-ming;,MA Ming-cheng;
..............page:9-18,41
Study on epoxy resin system curing by acid anhydride
WANG Qing;,FENG Qing;
WANG Qing;,FENG Qing;
..............page:19-20,49
Preparation of a halogen-free high Tg, and mid-loss Copper Clad Laminate
PAN Hua-lin;,CHEN Hu;,WANG Bi-wu;,HE Yue-shan;
PAN Hua-lin;,CHEN Hu;,WANG Bi-wu;,HE Yue-shan;
..............page:21-23,37
The development of a x,y-axis coefficient of linear thermal expansion method for CCL
WANG Jun;,WANG Jiang-hua;,HUANG Xin-he;
WANG Jun;,WANG Jiang-hua;,HUANG Xin-he;
..............page:24-25,58
A multi-type method for line width measurement based on four transcendental characteristics
ZHENG Chen;,HOU Zhi-song;,AO Hui-lan;,LONG Qing-wen;,ZHANG Yu;
ZHENG Chen;,HOU Zhi-song;,AO Hui-lan;,LONG Qing-wen;,ZHANG Yu;
..............page:26-30,64
Analysis and research for the conveyor driving shaft component in the PCB hole checker machine
LIN Xiao-xia;,HOU Zhi-song;,ZHOU Jiang-xiu;
LIN Xiao-xia;,HOU Zhi-song;,ZHOU Jiang-xiu;
..............page:31-37
Long-arm thickness measuring instrument dynamic performance analysis and structure optimization
ZHANG Ye;,LIN Xiao-xia;,HOU Zhi-song;
ZHANG Ye;,LIN Xiao-xia;,HOU Zhi-song;
..............page:38-41
Method for the jam detecting in horizontal production line
XIE Xun-wei;,CHEN Yue;
XIE Xun-wei;,CHEN Yue;
..............page:42-43,70
..............page:44-49
A production method of copper embedded PCB
ZHAO-Bo;,ZHAI Qing-xia;,ZHOU Wen-tao;
ZHAO-Bo;,ZHAI Qing-xia;,ZHOU Wen-tao;
..............page:50-54
Analysis on application of technological innovation in PCB enterprises
WANG Guang-ming;,XUN Rui-ping;,AO Si-chao;,ZHONG Yu-ling;
WANG Guang-ming;,XUN Rui-ping;,AO Si-chao;,ZHONG Yu-ling;
..............page:55-58
..............page:59-64
Analysis of the causes of the OSP defects for PCB surface treatment
DAI Chen-xi;,LI Xiao-wang;
DAI Chen-xi;,LI Xiao-wang;
..............page:65-67
..............page:68-70
New Product & New Technology (107)
gong yong lin ;
gong yong lin ;
..............page:71
..............page:72