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Printed Circuit Information
1009-0096
2016 Issue 4
Watch the development and progress
gong yong lin ;
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page:1
The printed circuit technology highlights from 2016 CPCA Show
GONG Yong-lin;
..............
page:5-8
Introduce the Japanese technology roadmap for Printed Circuit Board(Part 1)— outline the roadmap and PCB
GONG Yong-lin;,LI Min-ming;,MA Ming-cheng;
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page:9-16
Study on fabricating technology of large size backplanes
AO Si-chao;,Zhong Yu-ling;,LIU Jian-hui;,XUN Rui-ping;
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page:17-22,66
Study on the supportive model PCB manufacturing
LI Rui-zhi;,ZHANG Jia;,HE Guo-hui;
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page:23-26,60
Multilayer microwave material ladder plate bonding technology
LIAO Dao-quan;,GAO Tuan-fen;
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page:27-30
Study on the technology of HDI printing blind hole
LIANG Li-juan;,ZHANG Wen-han;
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page:31-36
Discussion and process optimization of resin plugging process
WANG Zuo;,LIU Ke-gan;,LI Jin-long;
..............
page:37-42
The new organic solution with efficient indicates rate for PCB (The carbonate type)
SHUAI He-ping;
..............
page:43-46
Study on the factor of black solder mask peeling after ENIG
WANG Wei;,LUO Xu;,CHEN Shi-jin;,DENG Hong-xi;,REN Jie-da;
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page:47-51
Supercritical fluid cleaning technology for PCB and electronic components
FANG Jing-li;
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page:52-56
PCB metal separation recycling which turn the waste heat into full play
DENG Gui-fang;
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page:57-60
Experimental study on treatment of PCB stripping waste water with improved fenton method
HE Cheng-xiang;,HUANG Zhi-qi;,CHEN Xiu-ning;,WANG Shu-ping;,ZHANG Yan-hua;
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page:61-63
The problem about filter element and packaging film materials for PCB green manufacturing
LIN Ke;,ZHANG Hua;,HUA Shi-rong;,CHEN Shi-rong;,LI Ke;
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page:64-66
The improvement for tin welding on BGA pads by lead-free HASL
SONG Qiang;,PAN Qiu-ping;
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page:67-70
xin xi dong tai
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page:71-72