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1009-0096
2016 Issue 4
Watch the development and progress
gong yong lin ;
..............page:1
Study on fabricating technology of large size backplanes
AO Si-chao;,Zhong Yu-ling;,LIU Jian-hui;,XUN Rui-ping;
..............page:17-22,66
Study on the supportive model PCB manufacturing
LI Rui-zhi;,ZHANG Jia;,HE Guo-hui;
..............page:23-26,60
Multilayer microwave material ladder plate bonding technology
LIAO Dao-quan;,GAO Tuan-fen;
..............page:27-30
Study on the technology of HDI printing blind hole
LIANG Li-juan;,ZHANG Wen-han;
..............page:31-36
Discussion and process optimization of resin plugging process
WANG Zuo;,LIU Ke-gan;,LI Jin-long;
..............page:37-42
Study on the factor of black solder mask peeling after ENIG
WANG Wei;,LUO Xu;,CHEN Shi-jin;,DENG Hong-xi;,REN Jie-da;
..............page:47-51
Experimental study on treatment of PCB stripping waste water with improved fenton method
HE Cheng-xiang;,HUANG Zhi-qi;,CHEN Xiu-ning;,WANG Shu-ping;,ZHANG Yan-hua;
..............page:61-63
The problem about filter element and packaging film materials for PCB green manufacturing
LIN Ke;,ZHANG Hua;,HUA Shi-rong;,CHEN Shi-rong;,LI Ke;
..............page:64-66
The improvement for tin welding on BGA pads by lead-free HASL
SONG Qiang;,PAN Qiu-ping;
..............page:67-70
xin xi dong tai
..............page:71-72