1009-0096
2016 Issue 2
..............page:2-2
A new method to manufacture FCCL
XIE Xin-lin;,GAO Ming-zhi;,XU Xi-zhou;,AN Bing;
XIE Xin-lin;,GAO Ming-zhi;,XU Xi-zhou;,AN Bing;
..............page:5-7
Discussion about the semi Rigid-Flex Board research
LUO Zeng-cai;,CHEN Xiao-yu;
LUO Zeng-cai;,CHEN Xiao-yu;
..............page:8-10
The study of failure mechanism of Flexible Printed Circuit Board pad pull-off and its control
YI Xiao-long;,MO Xin-man;,CHEN Bei;
YI Xiao-long;,MO Xin-man;,CHEN Bei;
..............page:11-17
A CCL of highDk & lowDf for miniaturization microstrip antenna
GUAN Chi-ji;,ZENG Xian-ping;,CHEN Guang-bing;
GUAN Chi-ji;,ZENG Xian-ping;,CHEN Guang-bing;
..............page:18-22
The discussion of Copper Clad Laminate surface oily point defect
PAN Hong-jie;,MING Hui;
PAN Hong-jie;,MING Hui;
..............page:23-24,33
Research of the test method of CCL dimensional stability
PAN Hua-lin;,PAN Jun-jian;,CHEN Hu;
PAN Hua-lin;,PAN Jun-jian;,CHEN Hu;
..............page:25-28,50
Investigate the test method on thermal conductivity of Copper Clad Laminate
SHE Nai-dong;,ZHANG Hua;,YE Xiao-min;
SHE Nai-dong;,ZHANG Hua;,YE Xiao-min;
..............page:29-33
The optimized process of resin plugging
WANG Zuo;,LIU Ke-gan;,LI Jin-long;,QUE Yu-long;
WANG Zuo;,LIU Ke-gan;,LI Jin-long;,QUE Yu-long;
..............page:34-37
..............page:38-41,56
Research on the horizontal production line’s drying capacity
HUANG Cai-dong;,HU Ping;,ZHENG Bin;,ZHANG Wei-jiang;,CHEN Qing-hua;
HUANG Cai-dong;,HU Ping;,ZHENG Bin;,ZHANG Wei-jiang;,CHEN Qing-hua;
..............page:42-46,66
Study on surface coating of electroless nickel/nickel palladium alloy
FAN Xiao-ling;,XIE Jin-ping;,LAI Fu-dong;,CHEN Shi-rong;,HUA Shi-rong;
FAN Xiao-ling;,XIE Jin-ping;,LAI Fu-dong;,CHEN Shi-rong;,HUA Shi-rong;
..............page:47-50
The study of new surface treatment-OM
XU Xue-jun;,YANG Ke-xiong;,TAN Nan-hai;
XU Xue-jun;,YANG Ke-xiong;,TAN Nan-hai;
..............page:51-56
Analysis and improvement of the solder joint failure in selective ENIG PCB
LIU Chang-chun;,GAO Tuan-fen;,WANG Jing-hua;
LIU Chang-chun;,GAO Tuan-fen;,WANG Jing-hua;
..............page:57-60
..............page:61-66
The resistance difference of two model for impedance test
ZHANG Xing-wang;,LIU Geng-xin;,XIONG Hou-you;,LI Wei-bao;
ZHANG Xing-wang;,LIU Geng-xin;,XIONG Hou-you;,LI Wei-bao;
..............page:67-70
New Product & New Technology (104)
gong yong lin ;
gong yong lin ;
..............page:71-71
Technology & Abstract (168)
gong yong lin ;
gong yong lin ;
..............page:72-72