Printed Circuit Information 2015 Issue z1 The mistake proofing of PCB engineering design

The mistake proofing of PCB engineering design
ZHANG Hao;,QIN Xin;

..............page:1-9

The impedance control of ±8％ tolerance
TU Xun;,WANG Cheng-Li;

..............page:10-15

A method to achieve high accurate impedance simulating and automated design system
HE Hong;

..............page:16-21

The impact of fiberglass weave on high-speed signal transmission
CHENG Liu-jun;,WANG Hong-fei;,CHEN Bei;

..............page:22-32

Microstripline impedance study
HOU Li-juan;,CHEN Xiao-yu;

..............page:33-40

Research on the lean fabrication of low-cost medium Tg materials PCB
SUN Liang;,TANG Hai-bo;,REN Yao-ru;

..............page:41-57

Discussion on the drilling technology of large size backplane
ZHU Tuo;,LIU Ke-gan;,HAN Qi-long;

..............page:58-67

Research and discussion on the technology of back drilling
ZHAO Bo;,LI Jin-long;,QUE Yu-long;

..............page:68-73

Study on the influence factors of outer layer line width and its control accuracy
CHENG Liu-jun;,WANG Hong-fei;,CHEN Bei;

..............page:74-82

Analysis and improve of ragged edge
XIE Ming-yun;,GUAN Jun-xuan;

..............page:83-88

Automatic drilling program secondary development
LI Kai;

..............page:89-95

Study on graphics compensation in acid etching
LIU Bin;

..............page:96-106

Research of the influence and improving about the try film vertical flowing
TANG Chang-sheng;

..............page:107-113

Study on graphics compensation in acid etching
GAO Qiang;

..............page:114-122

Effect of additives on copper electrodeposition for microvia filling
JI Lin-xian;,WANG Chong;,WANG Shou-xu;,CHEN Guo-qing;,HE Wei;,XIAO Ding-jun;

..............page:123-131

Effects of plating pretreatment on the uniformity of electroplating copper pillars
XIANG Jing;,CHEN Yuan-ming;,HE Wei;,CHEN Xian-ming;,BAO Yue;

..............page:132-138

Research on rapid copper electroplating additives for blind via
FU Zheng-gao;,PAN Zhan-chang;,HU Guang-hui;,CHEN Shi-rong;,ZHAN Guo-he;,ZHANG Bo;

..............page:139-145

Research on the skip via electroplating and reliability
WANG Xiao-ping;,DU Hong-bing;,YUAN Ji-wang;

..............page:146-152

Study on the causes and improvement of PTH bright line for backlight test
HU Jin-ping;,ZHONG Jun-chang;

..............page:153-164

The growth mechanism of ENIG's IMC and the reason analysis of solder joint failure caused by needle IMC
XU Long;,ZHANG Zhi-chang;,HU Meng-hai;

..............page:165-172

Study on the effect of reverse current of PPR on throwing power of through-hole
LIU Zu-shan;,CHEN Bei;

..............page:173-177

Hole copper plating research on material of polyimide resin
WU Yun-peng;,LIU Kai;,GONG Lei;

..............page:178-183

Step blind side wall of the groove is not more than the copper deposition process of rubber
HUANG Lei;

..............page:184-191

The process on the high density none-conductive wire gold finger-plating
ZHOU Ming-Di;

..............page:192-199

Effect of HEDP on electroless nickel plating
FAN Ting-hui;,CHEN Chun;,LIN Ying-sheng;,FU Zheng-gao;,DU Xiao-yin;,HU Guang-hui;,PAN Zhan-chang;

..............page:200-204

Research on the technology of G/F and ENIG composite surface treatment
TANG Dian-jun;,CHEN Chun;

..............page:205-209

Activated carbon filter current situation and new high-efficiency activated carbon filter's development
SU Hua-di;,LI Yong;,CAO Si-feng;

..............page:210-214

Study on the feasibility of ENEPIG goldfinger technology
KUANG Dong-lai;,ZHOU Bo;,HU Meng-hai;

..............page:215-221

Research for pads' difference effecting the thickness of ENIG
MENG Fan-yi;

..............page:222-227

Research and improvement of the ICD for Rigid-Flex PCB
LE Xiao-dong;

..............page:228-233

Study on the characteristics of new type copper foil used in Flexible Printed Circuit
XU Shu-min;,YANG Xiang-kui;,WANG Wei-he;,WANG Xue-jiang;,XU Hao-qiang;,LI Li;

..............page:234-239

Research on the optimization of Rigid-Flex PCB with gold finger technology
LIN Qi-heng;,LIN Ying-sheng;,WEI Xiong;

..............page:240-244

Resin flow improvement of Rigid-Flex PCB
LIN Ying-sheng;,TANG Hong-hua;,WU Zhi-jian;

..............page:245-250

Research on the influence Factor of Rigid-Flex PCB window position delamination problem
HE Miao;,QIN Hong-xiu;,ZHU Tuo;

..............page:251-257

The study of improving the COB technology about FPC
XU Bo;,MO Xin-man;,CHEN Bei;

..............page:258-264

Stretchable and Flexible Circuit Board based on polydimethylsiloxane (PDMS)
LU Yun;,ZHANG Shu;,XIANG Yong;,ZHANG Ya-lin;

..............page:265-268

Key technologies for flexible wearable device
HE Bo;,LIN Jun-xiu;,ZHANG Ya-lin;,FANG Gang;,ZHANG Shu;,XIANG Yong;

..............page:269-273

Research on the process of PTFE multilayer ladder board
LIU Yang-yang;,WANG Yi-xiong;

..............page:274-280

Research on cavity gold finger PCB with one step press process
WANG Xiao-ping;,BAI Yong-lan;,DU Hong-bing;

..............page:281-289

Embedded etching thin film Resistor Printed Board process research
HAO Yu-juan;,ZHOU Yu;

..............page:290-294

Particular producing process research on hybrid material combination board
HAN Ming;,XIE Shi-wei;

..............page:295-306

Metal base PCB slot insulation technology
XIAO Shi-xiang;

..............page:307-312

Development of Halogen-Free hole plugging resin for MCPCB
CHEN Yi-long;,TAN Xiao-lin;,LIU Zhen-meng;,WU Yan-jun;

..............page:313-317

Registration system control of 0.15mm big panel backboard
SUN Bo;

..............page:318-324

Sources, hazards and related treatment technology and of phosphorus-containing wastewater form PCB
LIU Chao;,PENG Jing-ping;,CHEN Shi-rong;,LAI Fu-dong;,XIE Jin-ping;,FAN Xiao-ling;

..............page:325-329

Brief on treatment process for PTH wastewater containing complex copper
CHEN Peng-yu;,WANG Yu-chen;,HAO Bao-jun;,GAO Yuan-ye;

..............page:330-336

Discussion on current situation and development strategy of PCB enterprise technology center
KE Yong;,DUAN Shao-hua;,TAN Xiao-lin;,WANG Jun;

..............page:337-342

Studying on how parameter influence the accuracy of material preparation
LIU Dong;,SUN Yan-lin;

..............page:343-350

The development of teledata acquisition and monitor system based on ethernet
CHEN Rui;

..............page:351-354

Development of plugging resin used in high-frequency radio HDI board
CHEN Hong;,DING Jie;,WANG Kuo-jun;,TANG Zhang-jun;

..............page:355-359

Research on the partial-thick Cu HDI technology
GU Yi-cheng;,ZHANG Zhi-yuan;,YUAN Ji-wang;,DONG Fu-xing;,LI Zheng-xi;

..............page:360-371

Research on the production method of high frequency and density interconnection PCB
WANG Qun-fang;,WANG Zuo;,LIU Dong;,LIU Ke-gan;

..............page:372-378

A thick copper production technology of HDI thermal conductive materials
WANG Ping;

..............page:379-386

Special material etching linewidth accuracy control capacity and control method
LIAO Hui;

..............page:387-391

Study on surface treatment of copper foil used for high frequency circuit
YANG Xiang-kui;,XU Shu-min;,LI Li;,WANG Wei-he;,WANG Xue-Jiang;,XU Hao-qiang;

..............page:392-398

All wet production process of metalized adhesiveless FCCL and its application on fine pattern circuits
Hirosawa Bashu;,Kohtoku Makoto;,Kobayashi Kanji;

..............page:399-406

Discussion on the bad cause and solution of ICD in high frequency material plate
HaSiGeRiLeTu;

..............page:407-416

qian yan
huang zhi dong ;

..............page:前插1