1009-0096
2015 Issue 8
Must have a solid foundation base
gong yong lin ;
gong yong lin ;
..............page:1-1
The Chinese PCB industry is big for certain
GONG Yong-lin;
GONG Yong-lin;
..............page:5-6
zheng wen tong zhi
ben kan bian ji bu ;
ben kan bian ji bu ;
..............page:6-6
Difference between foreign PCB standards and those of China
CHEN Pei-liang;
CHEN Pei-liang;
..............page:7-11
..............page:12-16,19
Speaking the standardization of the article from "PCB board"
GONG Yong-lin;
GONG Yong-lin;
..............page:17-19
The countermeasures for the development of automotive electronics and electronic copper foil
LIU Jian-guang;
LIU Jian-guang;
..............page:20-28,34
Study on low proifle copper foil effect on high frequency material
FAN Hong;,WANG Hong-fei;,ZHAO Liang-bing;,CHEN Bei;
FAN Hong;,WANG Hong-fei;,ZHAO Liang-bing;,CHEN Bei;
..............page:29-34
The application study of hydrotalcite in bromine containing CCL
WANG Bi-wu;,XU Yong-jing;,LI Jiang;,HE Yue-shan;,LUO Li;
WANG Bi-wu;,XU Yong-jing;,LI Jiang;,HE Yue-shan;,LUO Li;
..............page:35-38
The effect of DMF on the curing system of epoxy resin and Novolac
WANG Peng;,HU Lan-qing;,MENG Yun-dong;
WANG Peng;,HU Lan-qing;,MENG Yun-dong;
..............page:39-41
Study on dynamic mechanical analyzer for characterization of lead-free compatible copper clad laminateTg
HUANG Chen-guang;,HUANG Wei-zhuang;
HUANG Chen-guang;,HUANG Wei-zhuang;
..............page:42-44,48
Application on the enhanced-elastic buffer material in the process of CCL lamination
ZHOU Jiu-hong;,WEN Zhen-xiong;,YANG Xin;,ZHAI Jun-wei;
ZHOU Jiu-hong;,WEN Zhen-xiong;,YANG Xin;,ZHAI Jun-wei;
..............page:45-48
Application of synchronous heating technology in upgrading the efifciency of cutting prepreg
LI Hong-li;,PEI Tong-zhan;
LI Hong-li;,PEI Tong-zhan;
..............page:49-50,55
The preparation and application of the high thermolysis and lubrication characteristic plate using in PCB mechanical drilling
TANG Jia-lin;,QIN Xian-zhi;,LUO Xiao-yang;,CHANG Li-ling;
TANG Jia-lin;,QIN Xian-zhi;,LUO Xiao-yang;,CHANG Li-ling;
..............page:51-55
Research on CO2 laser used in PCB manufacturing
WU Jun-quan;,LIN Ying-sheng;,WEI Xiong;,CHEN Chun;
WU Jun-quan;,LIN Ying-sheng;,WEI Xiong;,CHEN Chun;
..............page:56-60
Research for the improvement of dissolved tin problem in pattern plating
WANG Zuo;,HAN Yan-lin;,ZHOU Hai-guang;
WANG Zuo;,HAN Yan-lin;,ZHOU Hai-guang;
..............page:61-64
The research and improvement of laser coverlayer causing FPC poor insulation
LIU Jun;,LIU Guo-han;,HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
LIU Jun;,LIU Guo-han;,HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
..............page:65-67
..............page:68-70
New Product & New Technology (98)
gong yong lin ;
gong yong lin ;
..............page:71-71
Technology & Abstract (162)
gong yong lin ;
gong yong lin ;
..............page:72-72