1009-0096
2015 Issue 7
Companies do lean is also strong
gong yong lin ;
gong yong lin ;
..............page:1-1
Thinking of industry big and strong
WANG Long-ji;
WANG Long-ji;
..............page:5-6
USA PCB industry survey & development strategy of China PCB industry
LIU Dong;,JIANG Xue-fei;,PENG Wei-hong;
LIU Dong;,JIANG Xue-fei;,PENG Wei-hong;
..............page:7-10
Current state & characteristics of the industry of entry and backup boards used for PCB drilling
YANG Liu;
YANG Liu;
..............page:11-14,39
..............page:15-20,51
Improving the problem of heavy gold plate resistance welding of half jack oil
CHANG Pan;,XING Yu-wei;
CHANG Pan;,XING Yu-wei;
..............page:21-27,35
Process research of high AR complex-hole selective resin plugging
LIU Qiu-hua;,MU Dong;,FANG Qing-ling;,DING Yang;,LUO Lin;,XU Meng;
LIU Qiu-hua;,MU Dong;,FANG Qing-ling;,DING Yang;,LUO Lin;,XU Meng;
..............page:28-31,44
Study of multilayer inner foil brown oxide processing solution for PCB
FU Fei-yan;,HUANG Ge;,YANG Meng-hui;,WANG Ke-jun;,ZHOU Zhong-cheng;
FU Fei-yan;,HUANG Ge;,YANG Meng-hui;,WANG Ke-jun;,ZHOU Zhong-cheng;
..............page:32-35
..............page:36-39
Analyzing the real reason of copper particle on copper billet after electroplating
XIAO Yun;,XIE Zha-hao;,MIAO Hua;,LI Chuan-zhi;
XIAO Yun;,XIE Zha-hao;,MIAO Hua;,LI Chuan-zhi;
..............page:40-44
Study of high selective organic solderability preservatives
LI Xiao-fang;,ZHAO Ming-yu;,XIAO Ding-jun;,LI Wei-ming;,LIU Bin-yun;
LI Xiao-fang;,ZHAO Ming-yu;,XIAO Ding-jun;,LI Wei-ming;,LIU Bin-yun;
..............page:45-47,70
Discussion about technology of high-frequency step PCB with gold ifnger
YE Jin-qun;,ZHOU Ding-zhong;,ZHANG Huang-chu;
YE Jin-qun;,ZHOU Ding-zhong;,ZHANG Huang-chu;
..............page:48-51
A process of segmented and classiifcation gold ifngers
LUO Zeng-cai;,CHEN Xiao-yu;
LUO Zeng-cai;,CHEN Xiao-yu;
..............page:52-54
Production method of buried copper coin PCB
HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
HUANG De-ye;,LI Chao-mou;,REN Dai-xue;
..............page:55-57
Research on hole location for high aspect ratio drilling
LIN Ye;,XIE Er-tang;,XING Rui-min;,CHAI Chao;
LIN Ye;,XIE Er-tang;,XING Rui-min;,CHAI Chao;
..............page:58-60
The root cause analysis of PCB backlight defect
ZHEN Fan;,LI Si-zhou;
ZHEN Fan;,LI Si-zhou;
..............page:61-64
The application of symbol on panel edge in PCB process
XU Xiao-long;,ZHANG Ya-feng;,WANG Ming-ge;,LIANG Tao;,YANG Wen-jun;
XU Xiao-long;,ZHANG Ya-feng;,WANG Ming-ge;,LIANG Tao;,YANG Wen-jun;
..............page:65-70
New Product & New Technology (97)
gong yong lin ;
gong yong lin ;
..............page:71-71
Technology & Abstract (161)
gong yong lin ;
gong yong lin ;
..............page:72-72