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Printed Circuit Information
1009-0096
2015 Issue 5
Expand the Horizon of Knowledge
gong yong lin ;
..............page:1-1
Research on area size of embedded lfexible substrate in R-FPC
WANG Shou-xu;,ZHOU Gou-yun;,DONG Yin-tao;,HE Wei;,HU Yong-shuan;,SU Xin-hong;
..............page:18-21
Application research on slot-cutting by UV laser in rigid-lfex PCB
WANG Shou-xu;,HE Xue-mei;,DONG Yin-tao;,HE Wei;,HU Yong-shuan;,SU Xin-hong;
..............page:22-24
Improving design to avoid lead residue of gold ifnger
CHEN Tao;,ZHAO Qi-xiang;,SHI Shi-kun;,ZHANG Ya-feng;
..............page:31-36
The new panel plating equipment and solution test technology
CHEN Shao-chang;
..............page:37-43,64
Study on thin surface copper technology in blind via iflling plating
CHEN Shi-jin;,XU Huan;,DENG Hong-xi;,LI Song_song;,HE Wei;
..............page:44-46,58
Assembly process and solder method of the CBGA device
GUO Ying;
..............page:51-54
The improvement of antenna welding method
TAN Xiao-peng;,ZHAO Zhi-ping;
..............page:55-58
Printed inductor alternative hollow inductor in RF circuit
HU Zhi-shan;
..............page:59-61
See wiring density development of HDI board from Genesis ifle
CHEN Hua-li;,ZHONG Wen-guang;
..............page:62-64
The causes and prevention of a plug hole broken
YE Jin-qun;
..............page:65-66
New Product & New Technology (95)
gong yong lin ;
..............page:71-71
Technology & Abstract (159)
gong yong lin ;
..............page:72-72