1009-0096
2015 Issue 4
..............page:1
Anatomy of the photochemical imaging technique of PCB as well as technical meliorate
CHENG Jing;,WU Pei-chang;,ZHANG Wei;
CHENG Jing;,WU Pei-chang;,ZHANG Wei;
..............page:5-10
..............page:10
..............page:11-12,19
Effect on SM thickness uniformity by nails-bed dsesign
LI Min-shan;,HU Yuan;,YUAN Ji-wang;
LI Min-shan;,HU Yuan;,YUAN Ji-wang;
..............page:13-16,38
..............page:17-19
Improvement of etching processing capacity for different base copper and fine-line requirements PCB
LIN Wei-na;
LIN Wei-na;
..............page:20-22,45
Comparison of electroless thick copper plating,organic conductive films and black hole
ZHANG Zheng;,LI Xiao-qiong;,GAO Si;,SU Liang-fei;
ZHANG Zheng;,LI Xiao-qiong;,GAO Si;,SU Liang-fei;
..............page:23-25
Direct plating of conductive polymer-polythiophene
LI Jian;,HE Cheng-xiang;,CHEN Xiu-ning;,WANG Shu-ping;,HUANG Jing-hua;,HUANG Zhi-qi;
LI Jian;,HE Cheng-xiang;,CHEN Xiu-ning;,WANG Shu-ping;,HUANG Jing-hua;,HUANG Zhi-qi;
..............page:26-31,58
High thick gold contact plating
ZHOU Guo-ping;
ZHOU Guo-ping;
..............page:32-35
Study on the tin content testing in spent tin stripping solution and tin sludge of PCB
ZHANG Guangzhu;,GAO Dong-rui;
ZHANG Guangzhu;,GAO Dong-rui;
..............page:36-38
The thin gold plating process for large copper surface of PCB
WANG Bao-cheng;,ZHANG Wen-han;,Li Yan-hua;
WANG Bao-cheng;,ZHANG Wen-han;,Li Yan-hua;
..............page:39-40,62
The characteristics of PCB for automotive
GONG Yong-lin;
GONG Yong-lin;
..............page:41-45
Reliability research on the cavity-finger board
REN Yao-ru;,WANG Xiao-ping;,FAN Jin-ze;,JIAO Qi-zheng;
REN Yao-ru;,WANG Xiao-ping;,FAN Jin-ze;,JIAO Qi-zheng;
..............page:46-50
Study structural problems of multilayer thick copper
WANG Li-feng;
WANG Li-feng;
..............page:51-54
Discussion on administration of the patent technology and intellectual property rights in PCB company
CHEN Shi-jin;
CHEN Shi-jin;
..............page:55-58
..............page:59-62
Mechanism of the peel-off solder mask ink for plugging hole process
QIN Shi-shuang;,HUANG Qin-wei;
QIN Shi-shuang;,HUANG Qin-wei;
..............page:63-65
..............page:66-67
Optimization of mechanical manufacture and design
ZHANG Hui-lai;,WANG Zhen;,LI Jia-yu;
ZHANG Hui-lai;,WANG Zhen;,LI Jia-yu;
..............page:68-70
..............page:71-72