Printed Circuit Information 2015 Issue 3 Analysis of factors influencing the 4G PCB signal loss

Analysis of factors influencing the 4G PCB signal loss
MENG Zhao-guang;,RAN yan-xiang;,YE zhi;

..............page:1-8

Telecommunications PCB material selection by electrical performance and cost
GU He-ping;

..............page:9-16

The research of loss for hole with high speed PCB above 100G
HAN Xue-chuan;

..............page:17-21

Approaching SI performance from PCB material composition
LIU Feng;,SU Xin-hong;,HU Xin-xing;,XIAO Yong-long;

..............page:22-26

High heat resistance& Low loss CCL for high layer count PCB application
HE Lie-xiang;,ZENG Xian-ping;,ZENG Hong-hui;,LUAN Yi;,MA Jie-fei;

..............page:27-30

Super fine line total solution
LI Hui-huang;

..............page:31-34

The study for 35μm/35μm fine line using vacuum and two fluid etching equipment
CHEN Hua-li;,LIN Hui;,ZHONG Wen-guang;

..............page:35-39

Research and application on production efficiency of PCB numerical control drilling technology
JI Long-jiang;,WANG Jun-hao;,WANG Zhong-hui;,LI Dong-mei;,JIAO Xiao-li;

..............page:40-45

Abnormal over-depth drilling analysis on PCB CNC backdrilling
LIU Ding-yu;,WANG Xing;,CAI Xiao-li;,ZHAI Xue-tao;

..............page:46-50

Research on Printed Circuit Board mechanical drilling
wang cheng yong ;, zheng li juan ;, huang xin ;, li shan ;, liao bing zuo ;, tang hong qun ;, wang bing ;, yang li peng ;

..............page:51-59

Transient dynamic finite element analysis technology research for reducing the amplitude of UV laser drilling machine Z axes system
LIN Xiao-xia;,GAO Lei;,YU Ting-xun;

..............page:60-63

Special pressing design structure analysis and control of deformation of plate
YANG Hai-yun;

..............page:64-76

A research on the process technology of step boards
JIAO Yun-feng;

..............page:77-80

Research of CO2 laser direct drilling for VIP in IC substrate
SUN Hong-chao;,WANG Ming-Hao;,XIE Tian-hua;,LI Zhi-dong;

..............page:81-86

Analysis for the influence factors on non-mechanism warpage of PCB
LIU Pan;,ZHANG Lai-ping;

..............page:87-91

Study on the key influence factors of thick board lamination for ultra-multilayer backplane technology applications
YANG Ting;,HE Wei;,HU Yongshuan;,SU Xin-hong;,HU Xin-xing;,SHI Shu-han;

..............page:92-97

The drilling technology improvement research for high-frequency and high-speed PCB
ZHANG Lun-qiang;,LIU Fei;,OU Ya-zhou;,WANG Cheng-yong;,LIAO Bing-miao;,LI Shan;

..............page:98-105

Research and Optimization of through hole filling by copper electroplating technology
LIU Jia;,CHEN Ji-da;,DENG Hong-xi;,CHEN Shi-jin;,GUO Mao-gui;,HE Wei;,JIANG Jun-feng;

..............page:106-111

A rapid via-filling technology and study of its principle
ZHU Kai;,WANG Chong;,HE Wei;,CHEN Jiao;,XIAO Ding-jun;

..............page:112-116

One new model of plating tank on improving the COV of plating
LIANG Jia-feng;

..............page:117-121

Study on the mechanism of additives on different stages in microvia filling plating
LIU Zu-shan;,CHEN Bei;

..............page:122-127

Application of hole filling plating process of vertical line equipment
XIAO Zheng-feng;

..............page:128-132

Pad cracking analysis and improvement
MENG Zhao-guang;,RAN Yan-xiang;

..............page:133-139

Study on PCB impendence measurement
LIU Wen-min;,WANG Hong-fei;,CHEN Bei;

..............page:140-145

Application of capacitance measurement in electrical performance test in PCB
ZHAO Yu;

..............page:146-150

Dry film preventing bonding technology for rigid-flex board with flex outer layer
HUANG Jiang-bo;,WANG Yi-xiong;

..............page:151-154

Development of rigid-flex PCB with high layers,bifurcated, overlapping structure
WU Chuan-liang;,HUANG De-ye;,REN Dai-xue;

..............page:155-159

The preparation of fast-curing white coating
HU Yu;,FAN He-ping;,ZHANG Xue-ping;,SHI Yu-jie;,LIU Sha-sha;

..............page:160-164

Effects of copper reduction process on the structures and properties of Flexible Copper Clad Laminate
WANG Zhi-jian;,AN Bing;,XIE Xin-lin;

..............page:165-168

The 18 layer backplane type rigid flex PCB production technology introduction
HE Miao;,QIN Hong-xiu;,ZHONG Hao-wen;

..............page:169-173

Study on the processing technology of the high frequency multilayer PCB for the microwave devices
YANG Wei-sheng;

..............page:174-183

Research and development of high thermal conductivity and heavy copper material HDI PCB technology
ZHAI Qing-xia;,ZHOU Wen-tao;,LI Jin-long;,Zhu Tuo;

..............page:184-190

Research on process of air-cavity embedded in PCB
LI Ming-shan;,JI Cheng-guang;,YUAN Ji-wang;

..............page:191-196

Research on heat dissipation performance of metal based PCB
PENG Jun;,SONG Guan-qiang;,LIU Yan-qi;

..............page:197-202

Anodic oxidation technology of aluminum alloys and the application to aluminum base Copper Clad Laminate
LIU Zheng-meng;,CHEN Yi-long;,TAN Xiao-lin;,WU Yan-jun;

..............page:203-208

Study on the process of PCB with ladder structure
HUANG Zhen;,ZHAN Yu;

..............page:209-214

The study of treatment for total-nitrogen in wastewater from PCB
PENG Jun;

..............page:215-218

PCB equipment heat balance energy saving reformation practice and application
MIN Xiu-hong;

..............page:219-223

Lean improvement based on value stream mapping
LI Kun;,ZHOU Qiu;,CHEN Chun;

..............page:224-228

The application of lean six sigma in milling production efficiency improvement
MA Jing-wei;

..............page:229-233

qian yan
gong yong lin ;

..............page:前插1