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Printed Circuit Information
1009-0096
2015 Issue 1
One Year Again
gong yong lin ;
..............
page:1
Sail the ocean starting from the end of the year
MA Ming-cheng;
..............
page:5
Improving efficiency by management, driving development by innovation——the changing road for the Chinese PCB enterprises in the big era
YOU Lei;
..............
page:6-7
Looking at the PCB new technology in 2014
GONG Yong-lin;
..............
page:8-14
Research and application of combination of static & dynamic ionic contamination testing
ZHANG Ye;,LIU Shi-qun;,MO Ling-ling;,CAI Lin;
..............
page:15-19,67
Rapid determination method of copper content in PCB spent etchant by baume' hydrometer
SONG Jian-yuan;,HUANG Zong-jiang;,LE Lu-an;,XU Li;
..............
page:20-22
Analysis and argument difference root cause of the PCB hole resistivity
ZHANG Jun-jie;,HAN Qi-long;,LIU Ke-gan;
..............
page:23-25
Analysis and verification of the fine line PCB surface roughness
ZHU Tuo;,LIU Jian-feng;
..............
page:26-30
Influence of solder ink on the impedance of PCB
GEN Bo;
..............
page:31-33,39
Quantitative analysis of solder resist ink's curing rate using FTIR method
ZHANG Meng-lin;
..............
page:34-36
Discussion on the board surface exposed material of HDI system PCB
CHEN Shi-jin;
..............
page:37-39
The cause and improvement of the delamination problem with PCBA
ZHAO Yu;
..............
page:40-43
A brief discussion about design and quality control for PCB in LED display
SUN Guang-hui;,ZHOU Long-jie;
..............
page:44-46
To investigate the causes of the PCB inner short circuit and method for improving
LI Fei-hong;,XU Huan;,DENG Hong-xi;,CHEN Shi-jin;
..............
page:47-49,52
The transformation and upgrading of WUZHU technology——The implementation of streamline personnel and five fixed management
CAI Zhi-hao;
..............
page:50-52
How to control the project development cost
LIN Ke;
..............
page:53-54,63
Equipment management of PCB laboratory based on FMEA
SONG Jian-yuan;
..............
page:55-58,70
AOI testing common false defect method and individual cases analyse
WANG Tao;
..............
page:59-60
Improvement of hole interconnection separation of PTFE multilayer PCB
LIU Guo-han;
..............
page:61-63
The difficulty points and improvement method in the production of R-F PCB
XU Ren-yuan;
..............
page:64-67
Improvement of PCB welding oil plug hole and risk prevention
LI Fei-hong;,CHEN Shi-jin;,XIONG Guo-xuan;
..............
page:68-70
New Product & New Technology (92)
gong yong lin ;
..............
page:71
xin xi dong tai
..............
page:72