1009-0096
2014 Issue z1
4 G motherboard material selection and circuit signal attenuation
MENG Zhao-guang;,RAN Yan-xiang;
MENG Zhao-guang;,RAN Yan-xiang;
..............page:1-9
Signal integrity analysis of PCB transmission line based on HFSS
HE Peng;,HE Wei;,SHI Shu-han;,SU Xin-hong;,YU Kai;,ZHU Xing-hua;
HE Peng;,HE Wei;,SHI Shu-han;,SU Xin-hong;,YU Kai;,ZHU Xing-hua;
..............page:10-15
The study of pad cratering impacted by different type of PCB materials
FENG Xiao-ming;,YE Jin-rong;
FENG Xiao-ming;,YE Jin-rong;
..............page:16-22
Surface modification technique for inorganic fillers and the application to Copper Clad Laminate
CHEN Yi-long;,LIU Zhen-meng;,TAN Xiao-lin;
CHEN Yi-long;,LIU Zhen-meng;,TAN Xiao-lin;
..............page:23-30
..............page:31-35
A study on the application of one side etched technology
DENG Jie-xiong;
DENG Jie-xiong;
..............page:36-45
Etch technology resin plug acid etching alkaline etching back-drilling
CHANG Pan;,XING Yu-wei;,ZHANG Jian;
CHANG Pan;,XING Yu-wei;,ZHANG Jian;
..............page:46-52
Research of the high precision line width control technology on high frequency communication
LI Qing-chun;,WANG Zuo;,ZHAI Qing-xia;,ZHAO Bo;,ZHU Tuo;
LI Qing-chun;,WANG Zuo;,ZHAI Qing-xia;,ZHAO Bo;,ZHU Tuo;
..............page:53-58
Ability development and model study of resin plugging on high aspect ratio PCB
LI Yan-guo;,YUAN Chu;,YUAN Kai-hua;
LI Yan-guo;,YUAN Chu;,YUAN Kai-hua;
..............page:59-67
..............page:68-74
Study on the key factors affecting the performance of inkjet printer
PENG Li-shan;,WANG Xiang-jiang;
PENG Li-shan;,WANG Xiang-jiang;
..............page:75-79
Study on influencing factors of S/M over-exposure defect
CHEN Shu-xi;,XIE Gui-shen;
CHEN Shu-xi;,XIE Gui-shen;
..............page:80-87
Failure analysis on resin grinding of selective resin plugged process technology
CHEN Shi-jin;,DENG Hong-xi;,HAN Zhi-wei;,XU Huan;
CHEN Shi-jin;,DENG Hong-xi;,HAN Zhi-wei;,XU Huan;
..............page:88-93
Discussing the inner micro short problem of large size back
LI Qing-chun;,WANG Zuo;,ZHAI Qing-xia;,ZHAO Bo;
LI Qing-chun;,WANG Zuo;,ZHAI Qing-xia;,ZHAO Bo;
..............page:94-101
The analysis of the affecting factors of dimensional accuracy
LIU Pan;,ZHANG Lai-ping;,ZHOU Yu;
LIU Pan;,ZHANG Lai-ping;,ZHOU Yu;
..............page:102-107
Production control of ultrathin prepreg
LI Pin-gao;,LUO Xiao-fan;
LI Pin-gao;,LUO Xiao-fan;
..............page:108-114
The influence of iron ions on the coating quality in PCB copper plating bath
CHEN Guo-qin;,HE Wei;,TAN Ze;,WANG Shou-xu;,WANG Yu;,XIAO Ding-jun;
CHEN Guo-qin;,HE Wei;,TAN Ze;,WANG Shou-xu;,WANG Yu;,XIAO Ding-jun;
..............page:115-121
Research of etching uniformity and load of multi-layer Printed Circuit Board
LIN Chu-tao;,MO Xin-man;,YU Zhen-zhong;
LIN Chu-tao;,MO Xin-man;,YU Zhen-zhong;
..............page:122-128
The research on half via hole process
HAN Ming;,PENG Jing-hui;
HAN Ming;,PENG Jing-hui;
..............page:129-137
Application research about diameter of 51mm phosphorized copper anode with micro-crystal structure on PCB planting
BAN Xiang-dong;,HAO Bao-jun;,WANG Yu-chen;
BAN Xiang-dong;,HAO Bao-jun;,WANG Yu-chen;
..............page:138-144
Study of high aspect ratio pulse plating and analysis of the abnormal crystallization in pulse plating
CHEN Bei;,REN Xiao-lang;,XU Guang-sui;
CHEN Bei;,REN Xiao-lang;,XU Guang-sui;
..............page:145-150
..............page:151-157
The research of plating copper wire improvement
CHEN Can;,XIE Ming-yun;
CHEN Can;,XIE Ming-yun;
..............page:158-164
The study on performance of the two generations microvia filling additives
CHEN Bei;,HU Meng-hai;,KUANG Dong-lai;
CHEN Bei;,HU Meng-hai;,KUANG Dong-lai;
..............page:165-170
The application of SOC process in via filling technology
LEI Hua-shan;,LIU Bin-yun;,XIAO Liang;
LEI Hua-shan;,LIU Bin-yun;,XIAO Liang;
..............page:171-175
The study of base material surface shape and the bonding force of deposition copper
CHEN Li-yang;,YOU De-jun;
CHEN Li-yang;,YOU De-jun;
..............page:176-181
Study on the factors effect of current parameter in blind via filling plating
CHEN Shi-jin;,DENG Hong-xi;,LI Yun-ping;,XU Huan;
CHEN Shi-jin;,DENG Hong-xi;,LI Yun-ping;,XU Huan;
..............page:182-185
Study on the electroless thick copper plating based on THPED-EDTA·2Na system
CAO Quan-gen;,CHEN Shi-rong;,FAN Xiao-ling;,LAI Fu-dong;,XIE Jin-ping;
CAO Quan-gen;,CHEN Shi-rong;,FAN Xiao-ling;,LAI Fu-dong;,XIE Jin-ping;
..............page:186-191
Study on blind-hole copper layer binding force control and monitoring method in HDI board production process
CHEN Shan-dong;,LIU Jian-jun;,LIU Zong-de;
CHEN Shan-dong;,LIU Jian-jun;,LIU Zong-de;
..............page:192-197
A special selective heavy gold plate after the OSP grommet gold nickel stripping research
LUO Xi-sheng;,XING Yu-wei;,ZHANG Jian;
LUO Xi-sheng;,XING Yu-wei;,ZHANG Jian;
..............page:198-212
Via-in-PAD lead-free HASL study of SM open on large Cu
HAN Yan-lin;,LIU Dong;,RONG Xiao-qiang;,ZHU Tuo;
HAN Yan-lin;,LIU Dong;,RONG Xiao-qiang;,ZHU Tuo;
..............page:213-220
Several performances of ENEPIG and current technology trend
QIAO Ben-guizhi;
QIAO Ben-guizhi;
..............page:221-227
The analysis of mechanism of gold wire bonding on ENEPIG
CHEN Bei;,HU Meng-hai;,TANG Yun-jie;
CHEN Bei;,HU Meng-hai;,TANG Yun-jie;
..............page:228-232
Research on discoloration problems of ENIG board
AI Xin;,CHEN Li-yang;,LIU Pan;,ZHANG Jie-wei;
AI Xin;,CHEN Li-yang;,LIU Pan;,ZHANG Jie-wei;
..............page:233-242
..............page:243-248
The research and development of electroless nickel/ immersion palladium/immersion gold process
CHEN Shi-rong;,DING Qi-hen;
CHEN Shi-rong;,DING Qi-hen;
..............page:249-257
Analyzing the performance of the different plating thickness of ENEP/IPIG
CHEN Run-Wei;,HUANG Hui-xiang;
CHEN Run-Wei;,HUANG Hui-xiang;
..............page:258-263
Relation of wire bonding reliability between the deposit composition and the type of the bonding wire
ZHOU Hua-ming;
ZHOU Hua-ming;
..............page:264-272
A method of backward the dielectric constant of solder mask through measurement and simulation
LU Ping;,PENG Pin-wei;
LU Ping;,PENG Pin-wei;
..............page:273-278
Study on insertion loss test by SET2DIL method
CHEN Bei;,LIU Wen-min;,WANG Hong-fei;
CHEN Bei;,LIU Wen-min;,WANG Hong-fei;
..............page:279-283
Print Circuit Board electrical failure analysis methods
JI Cai-bo;,SHEN Wei;
JI Cai-bo;,SHEN Wei;
..............page:284-294
Research of PCB surface dielectric voltage resistance
LUO Bing;,SONG Guan-qiang;
LUO Bing;,SONG Guan-qiang;
..............page:295-300
Measuring methods of PCB material dielectric constant and its application
CHEN Bei;,FAN Hong;,LIU Wen-ming;,WANG Hong-fe;
CHEN Bei;,FAN Hong;,LIU Wen-ming;,WANG Hong-fe;
..............page:301-307
Dependability study of though-hole with manual welding
CHEN Bei;,HU Meng-hai;,ZHANG Hui-chong;
CHEN Bei;,HU Meng-hai;,ZHANG Hui-chong;
..............page:308-313
Research on the nonwetting phenomenon of small pads in edge dip solderability test
CHEN Pei;,ZHANG Hui-chong;,ZHANG Zhi-chang;
CHEN Pei;,ZHANG Hui-chong;,ZHANG Zhi-chang;
..............page:314-318
BGA crack improve bearing pad at the bottom of the pit discussion
MENG Zhao-guang;,RAN Yan-xiang;
MENG Zhao-guang;,RAN Yan-xiang;
..............page:319-328
The analysis method of hole to conductor alignment capability
CENG Zhi-jun;,CHEN Pei;,REN Xiao-lang;
CENG Zhi-jun;,CHEN Pei;,REN Xiao-lang;
..............page:329-333
The application feasibility study of TPI membrance in FPC
CHEN Pei;,LI Chong;,MO Xin-man;
CHEN Pei;,LI Chong;,MO Xin-man;
..............page:334-341
Study on dimensional stability and reliability of PTH in non air-gap rigid-flex circuit board
CHEN Bei;,MO Xin-man;,YU Zhen-zhong;
CHEN Bei;,MO Xin-man;,YU Zhen-zhong;
..............page:342-347
Study on FPC impedance covering electromagnetic shielding film
CHEN Pei;,LIN Chu-tao;,MO Xin-man;
CHEN Pei;,LIN Chu-tao;,MO Xin-man;
..............page:348-352
Method for producing a symmetric rigid-flex PCB
CHEN Shi-jin;,CHEN Yuan-ming;,DENG Hong-xi;,HE Wei;,JIANG Jun-feng;,ZHOU Hua;
CHEN Shi-jin;,CHEN Yuan-ming;,DENG Hong-xi;,HE Wei;,JIANG Jun-feng;,ZHOU Hua;
..............page:353-357
Study on new type of manufacture engineering of Rigid-Flex Board
CHEN Xiao-yu;,HOU Li-jun;,ZENG Ping;
CHEN Xiao-yu;,HOU Li-jun;,ZENG Ping;
..............page:358-363
Introduction of the rigid-flex PCB processing method
HE Miao;,QIN Hong-Xiu;,TIAN Qing;,ZHONG Hao-Wen;
HE Miao;,QIN Hong-Xiu;,TIAN Qing;,ZHONG Hao-Wen;
..............page:364-371
Any layer interconnection board key technology development
MENG Shao-guang;,RAN Yan-xiang;
MENG Shao-guang;,RAN Yan-xiang;
..............page:372-380
Application research on MC24M: a kind of both-side-etching embedded capacitance material
DU Hong-bing;,LI Hui-hai;,YUAN Ji-wang;
DU Hong-bing;,LI Hui-hai;,YUAN Ji-wang;
..............page:381-390
Double-sided PCB insulated aluminum sandwich hole production technology
CHEN Yi-long;,KE Yong;,LI Ren-rong;,TAN Xiao-lin;,WANG Yuan;,ZHOU Zi-yi;
CHEN Yi-long;,KE Yong;,LI Ren-rong;,TAN Xiao-lin;,WANG Yuan;,ZHOU Zi-yi;
..............page:391-396
Study on manufacture program of high frequency hybrid ladder PCB
AI Xin;,DONG Hao-bin;
AI Xin;,DONG Hao-bin;
..............page:397-403
The difficulty of PCB process using welding process to embed components
LUO Chang;,PENG Lang;,ZHOU Yu;
LUO Chang;,PENG Lang;,ZHOU Yu;
..............page:404-408
Discussion on production reliability of embedded coin Printed circuit board
CHEN Xiao-yu;,LI Wen-guan;,ZHANG Xia;
CHEN Xiao-yu;,LI Wen-guan;,ZHANG Xia;
..............page:409-414
Research on the method of reducing fresh water in PCB process
CHEN Shi-jin;,DENG Hong-xi;,HUANG Kun-ping;,LI Yun-ping;
CHEN Shi-jin;,DENG Hong-xi;,HUANG Kun-ping;,LI Yun-ping;
..............page:415-419
Research of precise control and energy save for the constant temperature and humidity workshop
YAO Xin-mu;
YAO Xin-mu;
..............page:420-424
qian yan
huang zhi dong ;
huang zhi dong ;
..............page:前插1