1009-0096
2014 Issue 8
..............page:1-1
Study on the rheological properties of prepreg used in PN-Curing Copper Clad Laminate containing filler
CHEN Cheng;,LI Xue;,REN Ke-mi;,XIAO Sheng-gao;,ZHANG Rui-jing;
CHEN Cheng;,LI Xue;,REN Ke-mi;,XIAO Sheng-gao;,ZHANG Rui-jing;
..............page:5-8
..............page:9-11,14
Research on halogen-free paper base CCL preparation method
CHEN Xiao-peng;,LIU Ming-pei;
CHEN Xiao-peng;,LIU Ming-pei;
..............page:12-14
Research on epoxy soybean modified phenolic resin to produce paper based CCL
CHEN Xiao-peng;,LIU Ming-pei;
CHEN Xiao-peng;,LIU Ming-pei;
..............page:15-17
Research on the curing accelerators of epoxy resin/DDS system
HUANG Qin-qin;,LIANG Guo-zheng;,TANG Qing-ke;,XIAO Sheng-gao;,YI Qiang;
HUANG Qin-qin;,LIANG Guo-zheng;,TANG Qing-ke;,XIAO Sheng-gao;,YI Qiang;
..............page:18-20,25
The application of inorganic filler dispersion technology in the copper-clad plate manufacture
HUANG Chao-yong;
HUANG Chao-yong;
..............page:21-25
Application of oxidation induction time and oxidation induction temperature test methods in Copper Clad Laminate
LI Du-ye;,LI Yuan;,YAN Shan-yin;,YANG Zhong-qiang;
LI Du-ye;,LI Yuan;,YAN Shan-yin;,YANG Zhong-qiang;
..............page:26-27,54
Plasma desmear for high aspect ratio PCB
CHEN Yu-chun;,HUANG lei;
CHEN Yu-chun;,HUANG lei;
..............page:28-31
geng zheng
ben kan bian ji bu ;
ben kan bian ji bu ;
..............page:31-31
Research for improvement of high ratio and microhole’s plate thickness uniformity
FU Xue-ming;,LIU Hou-wen;,MA Zhong-yi;,SHANG Jian-rong;
FU Xue-ming;,LIU Hou-wen;,MA Zhong-yi;,SHANG Jian-rong;
..............page:32-38
Study on the technology of the controlled depth drill micro-via of the Printed Circuit Board
JIANG Hui-cong;,YUAN Ji-wang;
JIANG Hui-cong;,YUAN Ji-wang;
..............page:39-46
Research on the resistance welding and hole clogging technology for printed circuit board
XIE Wei-li;,YU Hua;,ZHANG Wen-han;
XIE Wei-li;,YU Hua;,ZHANG Wen-han;
..............page:47-50
The further discussion on the impact of nickel oxide on the solderability of plating gold
CHEN Li-yang;,LIU Pan;,ZHANG Jie-wei;
CHEN Li-yang;,LIU Pan;,ZHANG Jie-wei;
..............page:51-54
Fool proof method in the application of PCB industry
HUANG Hui;,LI Jia-yu;,ZHANG Hui-lai;
HUANG Hui;,LI Jia-yu;,ZHANG Hui-lai;
..............page:55-57
Research on the infiuence factors of FPC black hole process
FENG Li;,GUO Mao-gui;,HE Wei;,JIANG Jun-feng;,LIU Zhen-hua;,WANG Jiao-long;
FENG Li;,GUO Mao-gui;,HE Wei;,JIANG Jun-feng;,LIU Zhen-hua;,WANG Jiao-long;
..............page:58-60,70
Research on mis-registration improvement of dense cells of PCB
DU Hong-bing;,FAN Jin-ze;,WANG Xiao-ping;,YUAN Ji-wang;
DU Hong-bing;,FAN Jin-ze;,WANG Xiao-ping;,YUAN Ji-wang;
..............page:61-64
zheng gao qi shi -- kai qi duan bing xiang jie shi zhan chang
ben kan bian ji bu ;
ben kan bian ji bu ;
..............page:64-64
..............page:65-67
..............page:68-68
Deep milling technology control of PCB machining
LI Cheng-jun;,ZHANG Huang-chu;
LI Cheng-jun;,ZHANG Huang-chu;
..............page:69-70
..............page:71-71
..............page:72-72