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Printed Circuit Information
1009-0096
2014 Issue 7
ceng ya ru li zhu jia liang
gong yong lin ;
..............page:1-2
Study on single-ended vias in high speed PCB
CHEN Bei;,WANG Hong-fei;
..............page:10-14
Development and application of engineering design software for FPC
WANG Xin-liang;,WU Wei-zhong;
..............page:21-23
Analysis report of laminate thickness control
LIU Yun-jie;,XIE Wei-li;,ZHANG Wen-han;
..............page:24-26,49
Copper wrinkle analysis and improvement
CHEN Yu-chun;,LI Zi-yang;
..............page:27-29
Research on lfatness of lamination
CUI Huai-lei;,LIN Ye;,XING Rui-min;
..............page:30-31,70
The development and application of high-precision adjustable TDR probe
CAI Lin;,OU Zhi-qiang;,WANG Tian-sheng;,XU Li-fen;
..............page:36-41
The conductive heat PCB
LIN Jin-du;,WU Mei-zhu;
..............page:42-45,68
Inductor buried analytical design principle and process of PCB board
HU Xian-jin;,HUANG Jiang-bo;,WANG Yi-xiong;
..............page:46-49
Fabrication of double-sided PCB by Patterning-Adsorption-Plating additive process
CHANG Yu;,YANG Chao;,YANG Zhen-guo;,ZHENG Xin-yao;
..............page:50-53
Research in COD treatment technology of Printed Circuit Board wastewater
JIN Hong-jian;,LIU Qing-hui;
..............page:54-58
Ammonia nitrogen wastewater treatment technology and application in PCB factory
CHEN Qi-jun;,CHEN Zhi-qiang;,XIE Yan-man;
..............page:59-61
How should the energy-saving PCB factory puriifcation workshop
OUYANG Yan-xiao;
..............page:62-64
Talk about the source of some PCB scratch
DAI Chen-xi;,LI Xiao-wang;,LIU De-ling;
..............page:65-66
Impacts of shop lfoor arrangement to improve efifciency
LI Xiao-wang;,LIU De-lin;,LU Hua-yong;
..............page:67-68
To improve the HDI production process
CHEN De-zhang;,LI Jia-yu;
..............page:69-70
New Product & New Technology (86)
gong yong lin ;
..............page:71-71
Literatures & Abstracts (150)
shang hai mei wei ke ji you xian gong si ;
..............page:72-72