1009-0096
2014 Issue 3
geng duo di guan zhu pcb cai liao
gong yong lin ;
gong yong lin ;
..............page:1-1
The starting of high precision rolled copper foil industry in China
HUANG Tian-zeng;
HUANG Tian-zeng;
..............page:5-8,19
Summary of market, manufacturing & technology of dry iflm used for PCB
Jia-lin;,LUO Xiao-yang;,QIN Xian-zhi;,ZHOU Hu TANG;
Jia-lin;,LUO Xiao-yang;,QIN Xian-zhi;,ZHOU Hu TANG;
..............page:9-12,23
Fabrication and properties of carbon-black based embedded resistor inkjet-printing ink for PCB
HE Wei;,WANG Shou-xu;,ZHOU Guo-yun;
HE Wei;,WANG Shou-xu;,ZHOU Guo-yun;
..............page:13-16
Study on high Tg and semi-lfexible CCL
LIU Dong-liang;,WANG Qing;
LIU Dong-liang;,WANG Qing;
..............page:17-19
Ion migration resistance of halogen-free coverlay
CUI Yong-mou;,DAI Zhou;,LIU Sheng-peng;,RU Jing-hong;,WANG Zhi-yong;
CUI Yong-mou;,DAI Zhou;,LIU Sheng-peng;,RU Jing-hong;,WANG Zhi-yong;
..............page:20-23
Laser head board with FPC key materials
CHEN Lang;,HE Bo;,WANG Li;
CHEN Lang;,HE Bo;,WANG Li;
..............page:24-26
..............page:27-29
..............page:29-29
High frequency, high density interconnect rigid-lfex PCB production technology
HE Miao;,QIN Hong-xiu;,TIAN Qing;,ZHONG Hao-wen;,ZHU Tuo;
HE Miao;,QIN Hong-xiu;,TIAN Qing;,ZHONG Hao-wen;,ZHU Tuo;
..............page:30-33,49
A technique for producing pure FR-4 material semi soft plate
CHEN Jian;,HE De-hai;,ZENG Xiang-fu;,ZOU Ming-liang;
CHEN Jian;,HE De-hai;,ZENG Xiang-fu;,ZOU Ming-liang;
..............page:34-35
Semi-additive processing for 30μm ifne lines and its process optimization
CHEN Shi-jin;,FENG Li;,HE Wei;,JIANG Jun-feng;,ZHOU Hua;
CHEN Shi-jin;,FENG Li;,HE Wei;,JIANG Jun-feng;,ZHOU Hua;
..............page:36-39
Location hole without ring production method
CHEN Guang-hong;,LI Wei-bao;,LIU Geng-xin;,ZHOU Ding-zhong;
CHEN Guang-hong;,LI Wei-bao;,LIU Geng-xin;,ZHOU Ding-zhong;
..............page:40-42
Process of selectivity organic conductive coating
GAO Jian;,LIU Bin-yun;,SU Cong-yan;,XIAO Liang;
GAO Jian;,LIU Bin-yun;,SU Cong-yan;,XIAO Liang;
..............page:43-45
ENIPIG process introduction and its advantages
CHEN Run-wei;,HUANG Hui-xiang;,LIU Bin-yun;
CHEN Run-wei;,HUANG Hui-xiang;,LIU Bin-yun;
..............page:46-49
Study of the effect of the additives and processing conditions in PCB blind hole iflling
WANG Wei-Ren;,YI Hong-Kun;
WANG Wei-Ren;,YI Hong-Kun;
..............page:50-53
Discussing the prevention method of ink overlfowed of sold mask
LIU Dong;,PENG Chun-sheng;,ZHU Tuo;
LIU Dong;,PENG Chun-sheng;,ZHU Tuo;
..............page:54-58
The genesis of annular sand hole problem and improvement measures analysis
YE Han-Xiong;,ZHOU Ai-Ming;
YE Han-Xiong;,ZHOU Ai-Ming;
..............page:59-61
Soldering failure analysis methods introduction for immersion tin PCB
GU Xiao-jin;,LI Bin;,LI Fu;
GU Xiao-jin;,LI Bin;,LI Fu;
..............page:62-66
..............page:66-66
PCB solder welding defect cause analysis
CHEN Qiang;,WANG Yi-xiong;
CHEN Qiang;,WANG Yi-xiong;
..............page:67-70
New Product & New Technology (83)
gong yong lin ;
gong yong lin ;
..............page:71-71
Literatures & Abstracts (147)
shang hai mei wei ke ji you xian gong si ;
shang hai mei wei ke ji you xian gong si ;
..............page:72-72