Printed Circuit Information 2014 Issue 12 The Strong Development of HDI Technology

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Printed Circuit Information
1009-0096
2014 Issue 12

The Strong Development of HDI Technology

..............page:1-1

Any layer interconnection technology research
JIN Li-kui;

..............page:5-6,34

Registration system optimization for anylayer HDI
HUANG Yong;,JIN Li-kui;,WU Hui-lan;,ZEN Xiang-gang;

..............page:7-9

Study on warpage in HDI PCB of mobile communication products
GUI Hai-yang;,HUANG Yong;,WU Hui-lan;

..............page:10-13

Research and application of 2 step laser hole drilling processing technology
JI Long-jiang;

..............page:14-16,26

The study of microvia iflling by direct copper electroplating in PCB
CHEN Shi-jin;,DENG Hong-xi;,HU Wen-guang;,LI Zhi-dan;,YUNPING-LI;

..............page:17-18,37

The research about improvement on microvia iflling plating
LEI Hua-shan;,LIU Bin-yun;,XIAO Ding-jun;,YU Yong-zhen;

..............page:19-22

Experimental design method used to study the inlfuential factors of blind via iflling in HDI manufacturing
HE Wei;,PENG Jia;,TAN Ze;,WANG Chong;,XIAO Ding-jun;

..............page:23-26

Thin PCBs for smartphones:technology & reliability considerations
GONG Yong-lin;

..............page:27-31

Observation of copper clad laminate structure based on the technology of ion milling
GE Ying;,ZHU Yong-ming;

..............page:32-34

Research on reduce wrinkles of copper clad laminate
WANG Peng;,ZHANG Hua;

..............page:35-37

Improve the crystal problem of Benzoxazine Resin mixture
ZHANG Hua;

..............page:38-39

Study on the catalyst system for cyanate ester copper clad laminate
LI Jiang;

..............page:40-42

Study on the root cause of interference in PCB pattern copper plating and its solution
LIN Wei-dong;,WU Rong-xuan;

..............page:43-46

Test the performance impact of tin plating solution in lab
LIN Xiu-xin;

..............page:47-48,70

Investigation of inlfuence factors of nickel thickness on ENIG board
LI Li-ming;

..............page:49-51

Discussing the problem in the process of the selection ENIG PCB
YANG Wei-feng;

..............page:52-54

Research on the improved method of long-short edge-board contacts diffusion coating gold
LI Feng;,LIU Ke-gan;

..............page:55-58

Acidic copper electroplating anode passivation
LI Yan;

..............page:59-60

Application of Organic Conductive Process
YE Jin-qun;

..............page:61-64

A study of PCB electroplating copper particles cause and mechanism
ZHENG Fan;

..............page:65-67

Panel plating line copper plating uniformity improvement scheme
CHEN De-zhang;,LI Jia-yu;,WANG Chen;

..............page:68-70

New Product & New Technology (91)
gong yong lin ;

..............page:71-71

Literatures & Abstracts (155)
shang hai mei wei ke ji you xian gong si ;

..............page:72-72