1009-0096
2014 Issue 10
..............page:1-1
Special technical research for heavy copper panel’s mass production with total thickness above 3mm
FAN Zhi-hong;,JI Long-jiang;,ZHEN Wei;
FAN Zhi-hong;,JI Long-jiang;,ZHEN Wei;
..............page:5-8,51
Multi-fabric interconnect PCB manufacturing process development
CHEN Li-yu;,REN Yao-ru;,YUAN Ji-wang;
CHEN Li-yu;,REN Yao-ru;,YUAN Ji-wang;
..............page:9-18
Introduction to the inner end of 411.6μm copper processing technology
LI Wei-bao;,LIU Geng-xin;,XIONG Hou-you;,ZHANG Xing-wang;
LI Wei-bao;,LIU Geng-xin;,XIONG Hou-you;,ZHANG Xing-wang;
..............page:19-21
The making of PCB depth control milling
LI Cheng-jun;,ZHANG Huang-chu;
LI Cheng-jun;,ZHANG Huang-chu;
..............page:22-23
The production method for PCB of 3D aluminum substrate
AN Jin-ping;,GUO Jin-jin;,GUO Xian-xian;,ZHANG Wen-han;
AN Jin-ping;,GUO Jin-jin;,GUO Xian-xian;,ZHANG Wen-han;
..............page:24-26
Summary of the mass manufacture of stair-step PCB with golden finger surface finishing
GE Chun;,REN Jun-cheng;,SHI Shu-han;,ZHU Xing-hua;
GE Chun;,REN Jun-cheng;,SHI Shu-han;,ZHU Xing-hua;
..............page:27-32,70
Research for delamination of the capacitors embedded in the PCB
HU Xin-xing;,JI Cheng-guang;,WANG Hong-fu;,YUAN Ji-wang;
HU Xin-xing;,JI Cheng-guang;,WANG Hong-fu;,YUAN Ji-wang;
..............page:33-36
wo men ying gai duo liao jie xie da shu ju
wang long ji ;
wang long ji ;
..............page:36-36
Technology of partial hybrid
WANG Jun;,ZENG Ping;
WANG Jun;,ZENG Ping;
..............page:37-38,64
Materials of Flexible Printed Circuit Board for High-Frequency Applications
CHEN Lang;,GAO Qiang;,LU Yun-long;,XIANG Yong;,XU Jing-hao;,ZHANG Shu;
CHEN Lang;,GAO Qiang;,LU Yun-long;,XIANG Yong;,XU Jing-hao;,ZHANG Shu;
..............page:39-41,56
Introduction and application of DEA in the electronic circuits base materials
LI Yuan;,LUO Yun-hao;,MENG Yun-dong;,YAN Shan-yin;,YANG Zhong-qiang;
LI Yuan;,LUO Yun-hao;,MENG Yun-dong;,YAN Shan-yin;,YANG Zhong-qiang;
..............page:42-45
The research of improving the temperature of the return air in impregnator
WANG Cheng;,WANG Peng;,ZHANG Hua;
WANG Cheng;,WANG Peng;,ZHANG Hua;
..............page:46-48
Discussion on reworking for solder resist
YE Jin-cai;
YE Jin-cai;
..............page:49-51
Research on the Improvement of Copper Plating Pit defects
Peng Guang-ming;
Peng Guang-ming;
..............page:52-56
The improvement of trace nick on the pattern plating panel
Liao Hui;,Tang Chang-sheng;
Liao Hui;,Tang Chang-sheng;
..............page:57-58,66
Talent cultivation for PCB company
ZHANG Zhao;
ZHANG Zhao;
..............page:59-61
Study on key factors of implementing ERP successfully in PCB enterprises
SONG Jian-yuan;,XIE Ping-ping;
SONG Jian-yuan;,XIE Ping-ping;
..............page:62-64
Research on automatic temperature reduction for metal substrate molding
CHEN Jian;,DENG Wei-xing;
CHEN Jian;,DENG Wei-xing;
..............page:65-66
..............page:67-68
Production Method of Stratified or Subsectional Edge-Board Contact
HUANG Shao-bing;,ZHU Duo;
HUANG Shao-bing;,ZHU Duo;
..............page:69-70
New Product & New Technology (89)
gong yong lin ;
gong yong lin ;
..............page:71-71
Literatures & Abstracts (153)
shang hai mei wei ke ji you xian gong si ;
shang hai mei wei ke ji you xian gong si ;
..............page:72-72