1009-0096
2014 Issue 1
Direction and form of the magazine
GONG Yong-lin;
GONG Yong-lin;
..............page:5-6
..............page:7-11
A new kind of additive process for fabricating Printed Circuit Board
CHANG Yu;,YANG Zhen-guo;
CHANG Yu;,YANG Zhen-guo;
..............page:12-15
Opportunities and challenges in the development of flexible Printed Circuit Board
HE Bo;,XIANG Yong;,ZHANG Shu;
HE Bo;,XIANG Yong;,ZHANG Shu;
..............page:16-17,22
New development of surface finishes
CHEN Lang;,HE Bo;,XIANG Yong;,XU Jing-hao;,ZHANG Jian-fei;,ZHANG Shu;,ZHANG Xuan-dong;
CHEN Lang;,HE Bo;,XIANG Yong;,XU Jing-hao;,ZHANG Jian-fei;,ZHANG Shu;,ZHANG Xuan-dong;
..............page:18-22
Application prospect analysis of LDS technology in printed circuit board industry
SHI Shu-han;,TU Qing-lan;
SHI Shu-han;,TU Qing-lan;
..............page:23-25,67
The process development of laser in fine micro-hole
LIN Jin-du;,WU Mei-zhu;
LIN Jin-du;,WU Mei-zhu;
..............page:26-29,49
The development of PCB signal integrity test technology
HU Xin-xing;,LIU Feng;,SU Xin-hong;
HU Xin-xing;,LIU Feng;,SU Xin-hong;
..............page:30-34,37
Developing trend of chemical solution and fabrication technology of PCB
HUANG Ge;,WANG Ke-jun;,YU Jin;,ZHANG Wei;,ZHOU Zhong-cheng;
HUANG Ge;,WANG Ke-jun;,YU Jin;,ZHANG Wei;,ZHOU Zhong-cheng;
..............page:35-37
MSAP process:The study of sputtering as seed layer on FR-4 material
CHEN Hua-li;,GU Xiao-jin;
CHEN Hua-li;,GU Xiao-jin;
..............page:38-39,58
New technology trend of Printed Circuit Board
CAI Ji-qing;
CAI Ji-qing;
..............page:40-44,62
Impact of blind via and buried via on high speed PCB signal property
LIAO Xi-chun;,QU Feng-cheng;
LIAO Xi-chun;,QU Feng-cheng;
..............page:45-49
Cost control before PCB design
CHEN De-zhang;,HUANG Hui;,LI Jia-yu;,WANG Chen;
CHEN De-zhang;,HUANG Hui;,LI Jia-yu;,WANG Chen;
..............page:50-54
Study on high dielectric constant copper clad laminate based on active ester curing agent and epoxy resin
LI Du-ye;,YAN Shan-yin;,YANG Zhong-qiang;,YIN Wei-feng;
LI Du-ye;,YAN Shan-yin;,YANG Zhong-qiang;,YIN Wei-feng;
..............page:55-58
..............page:59-62
Analysis of plating leakage in PCB ENIG process
DAI Hui;,LIN Ren-dao;,LIU Xi-ke;
DAI Hui;,LIN Ren-dao;,LIU Xi-ke;
..............page:63-67
Study of problems in the production of electroless nickel/immersion gold process
DAI Feng-shuang;,ZHANG Gang-qiang;,ZHANG Yan-feng;
DAI Feng-shuang;,ZHANG Gang-qiang;,ZHANG Yan-feng;
..............page:68-70
New Product & New Technology (81)
gong yong lin ;
gong yong lin ;
..............page:71-71
Literatures & Abstracts (145)
shang hai mei wei ke ji you xian gong si ;
shang hai mei wei ke ji you xian gong si ;
..............page:72-72