Printed Circuit Information 2013 Issue z1 The technology of production process for multilayer PCB embedded magnetic core

The technology of production process for multilayer PCB embedded magnetic core
FAN Si-wei;TANG Hong-hua;CHEN Chun;CHEN Yu-tao

..............page:370-374

Study on high dielectric constant copper clad laminate based on phenolic resin curing agent and epoxy resin
YAN Shan-yin;YANG Zhong-qiang;YIN Wei-feng;LI Du-ye

..............page:1-5

Study on impact of chemical microetching process on the copper surface roughness
YE Fei-hua;LIU Pan;CHANG Run-chuan

..............page:189-195

Study on processing of thermotropic liquid crystal polymer material
AI Xin;DONG Hao-bin;ZENG Zhi-jun

..............page:11-21

Research on the optimization of laser window uncovery technology
WU Jun-quan;LIU Ji-cheng;CHEN Yu-tao;CHEN Chun

..............page:345-349

Case analysis for abnormity of blister on hole edge of PCB
HE Xiao

..............page:242-245

Research on the wetting mechanism of different ifnishes
ZHANG Zhi-chang;HU Men-hai;CHEN Bei

..............page:225-230

The cause and countermeasure of drill burr on high speed backplane
CHEN Xi;LIU Pan;ZENG Zhi-jun

..............page:76-83

The study on improvement surface topography of electroplating Au/Ni
TIAN Shen-you;CUI Zheng-dan;XIE Tian-hua;LI Zhi-dong

..............page:231-237

Study on manufacturing technology of local gold plating and selective immersion Au
SHI Bo;DONG Hao-bin;ZENG Zhi-jun

..............page:196-202

Research on 0.03 mm solder mask window Printed Circuit Board with POFV design technology
XIAO Lu;JI Cheng-guang;YUAN Ji-wang;TAO Wei

..............page:290-299

Process research and development of PTFE multilayer antenna PCB
LI Ming-shan;JI Chen-guang;YUAN Ji-wang;WANG Hong-fu

..............page:381-395

Study on improve high-frequency board ICD method and drilling parameters optimization
LI Feng;YANG Qiao-yun;DU Ming-xing;ZHU Tuo

..............page:96-102

Mechanical processing of micro-via
YANG Cheng-jun;ZENG Ping;HUANG Xian-quan

..............page:91-95

Control method of resin lfow on rigid-lfex PCB by iflling cushion material application
LIN Chu-tao;LI Chong;MO Xin-man;CHEN Bei

..............page:357-363

Study on registration accuracy for any layer HDI boards
CHEN Shi-jin;HU Wen-guang;LI Zhi-dan;DENG Hong-xi

..............page:277-281

Technology research of uniformity of copper thickness on synchronous plating on blind hole and through-hole of circuit board
LI Xiao-xiao;SHU Ming

..............page:317-321

The study on improving microvia-iflling plating
ZHU Kai;HE Wei;CHEN Yuan-ming;TAO Zhi-hua;CHEN Shi-jin;XU Huan

..............page:150-155

Study on the relationship between negative iflm full board electroplating surface copper thickness range and etching amount
LI Feng;LIU Dong;BAI Ya-yu;CEN Wen-feng

..............page:32-38

The manufacturing process of PCB with double-side etching embedded capacitor material
TANG Hai-bo;YUAN Ji-wang

..............page:402-409

Discussion about the super-high precision concentric ring of PCB production technology
Tang Hong-hua;SHI Xue-bing;CHEN Chun;CHEN Yu-tao

..............page:375-380

Sheet resistance welding plug hole technology to explore
ZENG Xiang-fu;ZHANG Huang-chu;HUANG Ke-qiang;JIA Yu-yi

..............page:168-171

Study on registration and reliability for multi-step via HDI board
ZHANG Zhi-qiang;LI Yan-guo;CHEN Li-yang

..............page:260-266

Manufacturing research on three-dimensional microwave PCB
JIAO Qi-zheng;DU Hong-bing;YUAN Ji-Wang

..............page:396-401

Optimization of delmination of R-FPC by using plasma treatment
DONG Ying-tao;HE Wei;CHEN Yuan-ming;YUAN Peng-fei;FAN Hai-xia;HUANG Yong;SU Xin-hong;CHEN Zheng-qing

..............page:322-326

Study on the by-products of copper plating additives over microvia iflling
KUANG Dong-lai;HU Meng-hai;CHEN Bei

..............page:156-161

Study on via in pad became invalid in bugle
LIU Ji-cheng;CHEN Chun;CHEN Yu-tao

..............page:246-251

Research and improvement of the micro-crack of HDI PCB plug buried hole
ZHANG Jun-jie;LIU Ke-gan;HAN Qi-long

..............page:304-312

Study on back panel etch uniformity
ZHANG Jun-jie;HAN Qi-long;PENG Wei-hong

..............page:61-69

Thick copper doughnut-shaped circuit etching improvement
YANG Chan-rong

..............page:51-56

Inlfuence of trace element ge on lead-free solder and practical application
HUANG Xiao-dong;ZHANG Jie-wei;CHEN Li-yang;QIAO Shu-xiao

..............page:217-224

Study of etch back process for N5000
LENG Ke;ZHANG Li-hua

..............page:137-142

The etch back process of multilayer printed circuit board
CUI Rong;JIANG Zhong-ming

..............page:143-149

Plating ability Of HDI with high aspect ratio item
BAN Xiang-dong

..............page:313-316

Research on nickel corrosion problem and gold tank parameters
ZHANG Jie-wei;CHEN Li-yang;QIAO Shu-xiao

..............page:209-216

The tensile strength about micro-etching on ENIG board
LI Li-ming

..............page:238-241

Thinning technology investigation of high density interconnecting printed circuit board
HUANG Yong;WU Hui-lan;SU Xin-hong

..............page:300-303

Selective organic conductive coating reliability investigation
LIU Bin-yun;SU Cong-yan;GAO Jian;XIAO Liang

..............page:131-136

Study on plating FA technique that base on logical mathematic calculation plus capability evaluation result
LIU Dong;BAI Ya-xu;LI Feng;CEN Wen-feng

..............page:162-167

Investigation for typical solder void
SUN Guang-hui;ZHOU Long-jie;CHEN Ri-rong

..............page:267-272

The research on min space and folding endurance of the edge of rigid-lfex area
LIN Qi-heng;LIN Ying-sheng;CHEN Chun

..............page:335-344

Improvement research about developing sludge of residue of copper in inner layer
SUN Ying-jie;LI Zhi-ming

..............page:39-42

Research on the embedded plane sheet capacitance PCB
CHEN Liang;LIU Zhen-quan;LIN Can-rong;YU Zhong-yao;ZHANG Jing

..............page:364-369

A new method of resist loading in aqueous developers
SU Pei-tao;LIN Xiu-xin

..............page:57-60

Discuss on the fabrication process of high frequency material hybrid copper coin partial lamination in PCB
MA Shi-long;SHU Ming;WANG Jin

..............page:419-424

The study of delamination for rigid-lfex PCB
HOU Li-juan;ZENG Ping;CHEN Xiao-yu

..............page:350-356

Study on the nail-heading of drilling process
YANG Jian-jun;WANG Xue-tao

..............page:84-90

The impact of different factors on line accuracy
ZHANG Xia;CHEN Xiao-yu;ZENG Ping

..............page:43-50

Glass ifber reinforced thermal conductive CCL
HUANG Zeng-biao;DENG Hua-yang;YE Xiao-min

..............page:22-27

Preparation of copper sulfate used in PCB and the inlfuence of organic impurities and processing method
WANG Hao;CHEN Shi-rong;YANG Qiong;WANG Hen-yi;XIE Jin-ping;FAN Xiao-ling

..............page:120-124

Process technology research of FPC ENEPIG
LI Zhi-dan;CHEN Shi-jin;HU Wen-guang;YANG Ting

..............page:327-334

Depression improvement of cavity PCB surface
LI Chong;MO Xin-man;CHEN Bei

..............page:410-418

The reliability study of thermostability for high layer heavy copper PCB
LU Yu-ting;ZENG Ping;CHEN Xiao-yu

..............page:273-276

Analysis of plating leakage of ENIG in PCB
DAI Hui;LIU Xi-ke;LIN Ren-dao

..............page:172-178

Process control points for high thermal conductivity of metal based copper clad laminate
LIU Xi

..............page:28-31

Development and application of PCB environment friendly iflter elements
CHEN Shi-rong;LUO Xiao-hu;YI Guo-bin;LIN Ke;MEI Lin-liang;WU Guo-fang;TANG Xian-ming;SHENG Zhou-lin

..............page:125-130

Innovation and improvement of processing equipments for copper clad laminates
CHEN Ji-da;LIU You-chang;LI Xiao-wei;ZHANG Sheng-tao;YAN Fang-xiong;ZHOU Qiang-cun;XU Huan;CHEN Shi-jin;HE Wei

..............page:6-10

The advantages and challenge in production practice of super roughening
LUO Chang;CHEN Li-yang;LIU Pan

..............page:203-208

qian yan
huang zhi dong

..............page:-6--6

Analysis on AOI logic and resolution
ZHOU Song

..............page:252-259

Current status and development prospect of ENIG and ENEPIG
XIE Meng;ZHANG Shu;XIANG Yong;XU Yu-shan;XU Jing-hao;ZHANG Xuan-dong;HE Bo

..............page:185-188

Study of silver activating solution used in PCB electroless copper plating
YANG Qiong;CHEN Shi-rong;WANG Hao;CAO Quan-gen;WANG Hen-yi;XIE Jin-ping;FAN Xiao-ling

..............page:116-119

Multilayer HDI board with stacked holes manufacture technology research
LIU Xi-ke;DAI Hui

..............page:282-289

The inlfuence on pretreatment of HASL to tin in via holes and its improvement
CUI Rong;GAO Lai-hua

..............page:179-184

The parameter optimization of CO2 laser during drilling blind-vias.by simplex optimization
LI Xiao-wei;CHEN Ji-da;XU Huan;CHEN Shi-jin;GUO Mao-gui;HE Wei;FENG Li;JIANG Jun-feng

..............page:70-75

Research and optimization of through holes and ifne lines with simultaneous electroplating
HE Jie;HE Wei;TAO Zhi-hua;FENG Li;XU Huan;ZHOU Hua;LI Zhi-dan;GUO Mao-gui

..............page:110-115

Effect of the pre-treatment cleaner solution on deposition characteristics of electroless copper plating
LI Wei-ming

..............page:103-109