1009-0096
2013 Issue 7
PCB plating technology of free electroless copper plating
LIU Ren-zhi;FAN Xiao-bin
LIU Ren-zhi;FAN Xiao-bin
..............page:29-32
..............page:71-71
A multilayer laminated with rubber and the cause of the deformation and improvement method
ZHAO Yao;LIU De-wei;ZHOU Gang;CHEN Liu-ning
ZHAO Yao;LIU De-wei;ZHOU Gang;CHEN Liu-ning
..............page:18-21,26
..............page:8-11
Interconnect defect research on high speed HDI PCB
TANG Hai-bo;WAN Li-peng;GU Yi-cheng
TANG Hai-bo;WAN Li-peng;GU Yi-cheng
..............page:49-55
Analysis of Micro-drilling & its test method in PCB industry
ZHAI Qing-xia;DU Ming-xing
ZHAI Qing-xia;DU Ming-xing
..............page:14-17
Brief analysis on processing technology of OEPCB
JI Cheng-guang;LV Hong-gang;TAO Wei;LI Min-shan
JI Cheng-guang;LV Hong-gang;TAO Wei;LI Min-shan
..............page:63-70
From gradually thinning copper thickness no Cu in hole to dog liked bone board design
XIAO Jing-song
XIAO Jing-song
..............page:33-35,48
About DPGC and cyanide gold
WANG Long-ji
WANG Long-ji
..............page:3-3,7
Development of single-side etching Embedded-Capacitance PCB
DU Hong-bing;YUAN Ji-wang;LV Hong-gang
DU Hong-bing;YUAN Ji-wang;LV Hong-gang
..............page:56-62
Research on blind via filling plating technology for HDI in PCB manufacturing
CHEN Shi-jin;LUO Xu;QIN Xin;HAN Zhi-wei;XU Huan
CHEN Shi-jin;LUO Xu;QIN Xin;HAN Zhi-wei;XU Huan
..............page:41-48
The contribution of engineer in the field of technology development and product innovation
LIN Jin-du
LIN Jin-du
..............page:4-7
Brief introduction of PCB enterprise cost saving methods
SUN Zheng-jie
SUN Zheng-jie
..............page:12-13,17
Analyses of delamination after IR
HU Xing-xing;SUN Li-li;LIU Feng;XIAO Yong-long
HU Xing-xing;SUN Li-li;LIU Feng;XIAO Yong-long
..............page:22-26
..............page:27-28,55
CuSO4 electroplating technology for PCB
cai ji qing ( yi ); lin jin du ( xiao )
cai ji qing ( yi ); lin jin du ( xiao )
..............page:36-40,70