Printed Circuit Information 2013 Issue 5 Inspection of small size defect in PCB AOI

Inspection of small size defect in PCB AOI
zou mei fang ; jin gang

..............page:18-20

The research of the design and processing method of embedded PCB
xu xue jun ; zeng zhi

..............page:91-94

Preparation of self-reductive silver inks and studying on fabrication of conductive patterns at low temperatures
cao hong yin ; tang yao ; wang shou xu ; he wei ; mao ying jie

..............page:109-112

The experimental exploration of thermal conductivity measurement of double-layered materials by flash method
tang yun jie ; chen zuo

..............page:36-41

Research the synthesis of nano-copper powder by using PCB alkaline etching wastewater
luo xiao hu ; chen shi rong ; yang qiong ; xie jin ping ; wu yao cheng ; liang yun rui

..............page:128-130

Printed circuit board embedded plane sheet resistance research
ran yan xiang ; meng zhao guang

..............page:70-75

Energy saving research on compressed air system in PCB industry
zhou yuan wei ; wu zhong qiang

..............page:117-122

Discrete devices embedded technology research and development
peng qin wei ; ding zuo peng

..............page:104-108

Research of epoxy adhesive for flexible Al-based copper clad laminate with high thermal conductivity
li zuo lin ; yan hui ; zhang xue ping ; han zhi hui ; yang zhi lan ; fan he ping

..............page:100-103

Analysis of failure mechanism of CAF and analytical method
di qing xia ; jiang xue fei ; li xue ming ; peng wei hong

..............page:21-24

Recent research development of acid etching liquid waste regeneration technology
huang zuo zuo ; zhou jun ; liu hong jiang ; chen jian min

..............page:113-116

Preparation and properties of a high performance FPC substrate protective film
xiao jian wei ; liu da juan ; yan hui ; li jing ; meng fei ; liu sha sha ; fan he ping

..............page:51-55

Detection method based on the HB LED thermal conductivity of the substrate
wang jian ping ; liu jin feng ; pei tong zhan

..............page:25-30

The process of non-symmetrical rigid-flex PCB
wu yun peng ; chen yong sheng ; huang zhen ; zhao yu ; li xiu min

..............page:66-69

The discussion on how to implement sustainable energy saving control by wireless energy management system
huang

..............page:137-140

Application of Uniform design in fast-laminating parameters optimization of coverlay
feng li ; he wei ; he jie ; huang yu xin ; xu huan ; zhou hua ; guo mao gui ; wang jiao long

..............page:46-50

Research on the Feasibility of Thin Film Capacitance Material with Double-side-etch Process
fan hai xia ; wang shou xu ; he wei ; dong ying zuo ; hu xin xing ; su xin hong ; liu feng

..............page:76-79

Rigid Flex PCB lamination bonding improvement
zhang li hua ; xu ming

..............page:56-61

Impedance design by experiment data for the rigid-flex PCB
wu chuan liang ; wei xiong ; chen xiao yu ; zeng ping

..............page:62-65

The technology of production process for super thick copper multilayer PCB
fan si wei ; tang hong hua ; chen chun ; chen yu zuo

..............page:83-86

The technology in manufacturing of aluminum substrate rigid-flex board
shi xue bing ; tang hong hua ; chen yu zuo ; chen chun

..............page:87-90

Research on the recovery of copper from the waste printed circuit board
cao xing ; liu hong jiang ; huang shan duo ; zhou jun ; chen jian min

..............page:123-127

The influence of internal layer prepreg to anti-CAF capability of PCB
hu meng hai ; chen zuo

..............page:31-35

Analysis of V groove of gold
wang gang ; liu ; lv yong ; yang wei feng ; zuo shi jie ; wu jun ; wang zhi ying ; liu zeng ; chu li bo

..............page:12-17

Study and development prospect analysis of ENEPIG surface treatment technology
zheng sha ; ou zhi fu ; di qing xia ; liu dong

..............page:8-11

Study on the cost factor of outer negative etching process
liu dong ; jiang xue fei ; li xue ming ; peng wei hong ; yu zhong

..............page:146-153

A study of improving the quality of PTFE step board
tang hong hua ; shi xue bing ; chen yu zuo ; chen chun

..............page:80-82

Equipment energy efficiency energy-saving control technology and application
cao yang

..............page:131-136

Prevention of ENIG depositing in FPC base materials with nitric acid
yuan peng fei ; chen yuan ming ; he wei ; peng yong qiang ; liu hui min

..............page:42-45

The principle, characteristic and application of the alkaline immersion silver process replacing ENIG
fang jing li

..............page:1-7

Process and Quality Control Analysis on Control of High-frequency PIM Intermodulation Products
li chun ming ; xu xue jun

..............page:95-99

Analysis on the recycle and reuse of the acid etching solution
wang gang ; yang wei feng ; liu ; ye jun ; yu hong ; du shu ting ; zhang zhen jun ; li xiu min ; liu zeng ; chu li bo

..............page:141-145