Printed Circuit Information 2013 Issue 4 Effect of Via-hole Stub on signal integrity

Effect of Via-hole Stub on signal integrity
wang hong fei ; chen zuo

..............page:44-47

Design and application of the coefficients in project management
yao wei ; tian ling

..............page:48-53

The synthesis and properties of polyamide curing agent
liu da juan ; xiao jian wei ; li zuo lin ; zhang xue ping ; chen wei ; li jing ; fan he ping

..............page:54-57

Preparation of an Innovative halogen free and phosphorus free flame retardant CCL
su shi guo ; zhou ying xian ; yang hu ; he yue shan

..............page:76-80

Copper residual defects research on innerlayer DES
yao xiao shan ; li rui huan ; peng jing hui ; ren jin lei

..............page:81-91

Research on relationships between line width compensation&e-factor/copper thickness/line space in acid-subtractive process
peng jing hui ; he ping ; han long

..............page:92-103

Research of dynamic compensation
wei jian she ; zhu xing hua ; li jin hong

..............page:104-108

The study on the process of back drilling in 1.0 mm/0.20 mm via BGA with 2 trace routing
wang zuo ; zhou ming zuo ; li xiao xiao ; shu ming

..............page:109-118

Application of UV-LED surface light source in PCB solder mask exposure
zuo xiu hong

..............page:119-124

Dry film combination analysis and improvement in the film lamination process of the image transition
huang li qiu ; zhang li hua

..............page:125-129

Analysis of factors in the wire-bonding finger width for BGA
lin jia ; zhang ya ping ; zheng yang cun ; sun jun jie

..............page:130-135

The effect of LED lamp on PCB photosensitive materials
liu ; wang gang ; chen gang ; ye jun ; gu ; liu zeng ; chu li bo

..............page:136-142

The effect of laser intensity distribution in laser drilling
wu jun quan ; liu ji cheng ; chen yu zuo ; chen chun

..............page:143-147

Research on the new technology application with CO2 laser-drilling
lin ying sheng ; lin qi heng ; wu jun quan ; chen yu zuo ; chen chun

..............page:148-157

Study on solving hole block of back drill
zhou shang song

..............page:158-162

A Study of Process for Laser charring of cutting Cu
zhang li hua ; wang si hua

..............page:163-167

Research on the method of SMED in the study of application of NC machining
zuo zhuan yun

..............page:168-173

Research on the scanning method for UV laser blind via drilling
li xi zuo ; zuo xian de ; yin tong fang ; song liu yang

..............page:174-179

Research on plugging buried hole of HDI product
zhao yu

..............page:180-185

The research on buried hole for prepreg direct plugging
he jie ; he wei ; feng li ; huang yu xin ; zhong hao ; xu huan ; luo xu ; xin feng

..............page:186-190

Discuss on processing difficulties of ultra-thin copper foil in PCB manufacturing
chen shi jin ; xu huan ; luo xu ; zuo xin ; han zhi wei

..............page:191-195

The technology of resin filling with vacuum lamination instead of conventional resin plugging
du lu zuo ; wu zhi jian ; chen chun ; tang hong hua ; chen dong

..............page:196-200

Research on technology of filling HDI buried holes and advantage of cost accounting
bai ya xu ; he zuo ; peng wei hong ; ou zhi fu

..............page:201-206

Multilayer pressing study with superposition and closed“copper free area”inner graphics
huang zhen

..............page:207-212

Pressing technology in high-frequency and high-speed hybrid multilayer PCB
yuan huan xin

..............page:213-217

The study on throwing power of 20:1 high aspect ratio item
liu lu ; feng ling yu

..............page:218-227

Electrochemical methods applied in the analysis on the By-products of copper plating additives
kuang dong lai ; chen zuo

..............page:228-232

Ordinary copper plating light agent in vertical plating line of the blind hole plating fill hole capacity study
lin xu rong ; zhang jian ru

..............page:233-237

The introduction of a high Tg halogen-free CCL with good dielectric properties
su jun hua ; xi kui dong ; kuang xiao jun

..............page:69-75

New Generation of high heat resistance and low CTE copper clad laminates for high layer count printed circuit boards
wu zuo hui ; su xiao sheng ; wang yi ; fang ke hong

..............page:65-68

Application study of generalized two-dimensional infrared correlation spectroscopy
li dan ; su xiao sheng ; meng yun dong ; zhang yan hua ; wang xiao bing ; zhang chi

..............page:58-64

Research on insertion loss of Printed Circuit Board
peng qin wei ; tang rong yao

..............page:37-43

CAM tool design schedule management
peng chun sheng ; li xue ming ; wang hai yan ; zhu fang sheng

..............page:31-36

Study on impedance consistency
feng xiao fei

..............page:25-30

The technical development roadmap of any layer interconnection PCB
chen yong sheng

..............page:20-24

Influence of IPD on PCB technology development
peng qin wei ; gao wen shuai ; shi geng cai

..............page:15-19

Comparative study on worldwide top 100 PCB companies between 2011 and 2001
yang hong qiang

..............page:5-14