1009-0096
2013 Issue 3
Application of PTFE in copper clad laminate
jiang en wei ; yang zhong qiang
jiang en wei ; yang zhong qiang
..............page:14-17
The analysis of the factors of No-Flow prepreg adhesion
liu zuo jian ; zheng jun ; zheng ying dong
liu zuo jian ; zheng jun ; zheng ying dong
..............page:18-22
Study of multilayer inner foil brown oxide processing solution for PCB
fu fei yan ; huang ge ; wang ke jun ; gao si ; wang long biao
fu fei yan ; huang ge ; wang ke jun ; gao si ; wang long biao
..............page:23-26
PCB bending causes and improving methods
pan qiu ping ; hu ji feng ; shu xuan ; guo rong
pan qiu ping ; hu ji feng ; shu xuan ; guo rong
..............page:27-30
Orthogonal optimization the technique parameters made by the 50 μm/50 μm fine line
he jie ; he wei ; huang yu xin ; feng li ; xu huan ; zhou hua ; luo xu ; dai guan jun
he jie ; he wei ; huang yu xin ; feng li ; xu huan ; zhou hua ; luo xu ; dai guan jun
..............page:31-34
Shallow silver pulp through hole process
meng zhao guang
meng zhao guang
..............page:38-41
Manufacturing engineering of flexible substrate
han zhuo jiang ; liu liang jun
han zhuo jiang ; liu liang jun
..............page:42-45
The rigid-flex PCB open cover process experiment
zeng xian xi ; zhou gang ; zhao zhi ping ; kong hua long
zeng xian xi ; zhou gang ; zhao zhi ping ; kong hua long
..............page:46-49
Flexible printed circuit of stiffening high frequency noise resistance
cai ji qing ; lin jin du
cai ji qing ; lin jin du
..............page:50-53
The process research and application of the golf finger with different classes and steps
zhang liang xiao ; tian zeng jin ; chen hua kun
zhang liang xiao ; tian zeng jin ; chen hua kun
..............page:54-57
Research on the technology of manufacturing of dense spacing long-short gold fingers
zhang jun jie ; ye ying cai ; liu ke gan ; zhu tuo
zhang jun jie ; ye ying cai ; liu ke gan ; zhu tuo
..............page:58-61
..............page:62-64
Next generation organic solderability preservative
cai ji qing ; lin jin du
cai ji qing ; lin jin du
..............page:65-68
New approach to waste solder stripper for PCB
qing shang quan
qing shang quan
..............page:69-70
..............page:71
..............page:72
..............page:35-37
Tack about fine design of PCB
liu zao lan
liu zao lan
..............page:13
..............page:8-12
..............page:3-7