1009-0096
2013 Issue 11
Literatures & Abstracts (143)
shang hai mei wei ke ji you xian gong si
shang hai mei wei ke ji you xian gong si
..............page:72-72
..............page:71-71
A study on the technological improvement contribution to material utilization
GUO Guo-dong;ZHANG Li-hua;LI Zu-qing
GUO Guo-dong;ZHANG Li-hua;LI Zu-qing
..............page:67-70
Discuss the improvement of wove and measles
WANG Chun-yan
WANG Chun-yan
..............page:64-66
The analysis of the affects factors and defects of layer misregistration
ZHANG Lai-ping;CHEN Li-yang;LIU Pan
ZHANG Lai-ping;CHEN Li-yang;LIU Pan
..............page:59-63
Application research on hybrid with high speed and FR4 material
SUN Li-li;HU Xin-xing;LIU Feng;XIAO Yong-long;LUO Long
SUN Li-li;HU Xin-xing;LIU Feng;XIAO Yong-long;LUO Long
..............page:54-58
Analysis of technical difficulties of partial hybrid board manufacturing
YUAN Kai-hua;ZHAO Xin;YUAN Chu
YUAN Kai-hua;ZHAO Xin;YUAN Chu
..............page:47-53
The control of PCB thickness
YUAN Chu;LUO Na
YUAN Chu;LUO Na
..............page:42-46
Application of 3D measuring laser microscope in surface roughness research for PCB
SONG Jian-yuan;ZHENG Sha;ZHU Tuo;LONG Li-ping
SONG Jian-yuan;ZHENG Sha;ZHU Tuo;LONG Li-ping
..............page:38-41
Delamination research because of moisture absorption
LV Yong;WANG Chun-yan;DI Gui-juan
LV Yong;WANG Chun-yan;DI Gui-juan
..............page:34-37,41
Analysis of the CTE and its influence on FCBGA solder joint reliability
LIN Jia;ZHEN Yang-cun;ZHANG Ya-ping;YANG Zhi-qin
LIN Jia;ZHEN Yang-cun;ZHANG Ya-ping;YANG Zhi-qin
..............page:31-33
Brief talk on signal loss test of printed circuit boards
GE Ying;ZHU Yong-ming;LIU Shen-xing
GE Ying;ZHU Yong-ming;LIU Shen-xing
..............page:28-30,63
The research of solder bridge fall off risk assessment and response
SHI Hong-yu;LIU Shao-liang;LUO Na
SHI Hong-yu;LIU Shao-liang;LUO Na
..............page:26-27,58
..............page:23-25
Discussion on the influence factors of using DSC to test Tg of PCB
CHEN Xiao-fei;FANG Jung-jiang
CHEN Xiao-fei;FANG Jung-jiang
..............page:19-22,25
Research on thermal character & influencing factors for high standard lead-free PCB
TANG Hai-bo;WAN Li-peng;GUO Xiang
TANG Hai-bo;WAN Li-peng;GUO Xiang
..............page:12-18
Analysis and improvement on impedance issue
DENG Wen-zhang
DENG Wen-zhang
..............page:9-11
The effect of moisture on PCB CAF test
ZHOU Ding-zhong;GENG Wen-wu;LI Wei-bao
ZHOU Ding-zhong;GENG Wen-wu;LI Wei-bao
..............page:7-8
..............page:6-6
20 years with PCI
LIANG Zhi-li
LIANG Zhi-li
..............page:5-6
Thoughts on the policy change
WANG Long-ji
WANG Long-ji
..............page:3-4,11
..............page:0-0