Printed Circuit Information 2012 Issue z1 Discussion about the core based on aluminum plate PCB production technology

Discussion about the core based on aluminum plate PCB production technology
tang hong hua ; chen yu zuo

..............page:377-382

Research and application of aor for PCB manufacturing
chen shi jin ; luo xu ; zuo xin ; qiao peng cheng

..............page:470-475

Improvement research of defects of making semi-metalized groove on RF power amplifier PCB
li zuo ; he wei ; wang shou xu ; huang yun zhong ; zhao qiao ling

..............page:208-213

The analysis of high-frequency dielectric constant test of printed circuit boards
ge ying ; liu shen xing ; zhu yong ming

..............page:60-63

Thermal effects of PCB iaminates in dynamic temperature
chen yuan ming ; he wei ; wang shou xu ; tao zhi hua ; yang ying ; wang yang ; luo dao jun

..............page:489-493

Lead-free materials applied in high densely holes exploration
su jian xiong ; zeng ping

..............page:19-26

Compensation coefficient forecast of core in PCB process:experimental and statistical method
deng dan ; zhang yan sheng ; liu dong ; song jian yuan ; wang li quan ; wu feng shun

..............page:193-197

Analysis and improvement of delamination of rigid-flex PCB under plasma treating
liang peng ; mo xin man ; chen zuo

..............page:315-322

Discussion on the control of the third order intermodulation of antenna multilayer board
wu chang gen ; li chang sheng ; yan lai liang ; an guo yi

..............page:410-416

Discussion on the improvement of the burr about blind groove of PTFE multilayer board
li bang qiang ; li chang sheng ; yan lai liang ; an guo yi

..............page:343-348

TDR characteristic impedance tester performance analysis based on msa
liu jin feng ; deng shi wen

..............page:480-488

Analysis and research of water savings technology in PCB vertical process
meng fan yi ; bei jun tao

..............page:516-521

Analysis on the cost control of PCB molding
gao qing rui ; li chang sheng ; yan lai liang ; an guo yi

..............page:553-557

Study on the technology of simultaneous through-hole metallization and blind hole filled copper
ning min jie ; he wei ; tang xian zhong ; he xue mei ; yang xin qi ; hu yong shuan ; su xin hong ; li liang ; cheng shi gang

..............page:294-302

The preparation and performance of flexible thermal conductive insulating epoxy adhesive
han zhi hui ; li zuo lin ; yan hui ; liu sha sha ; shi yu jie ; chen wei ; fan he ping

..............page:328-332

Study on the white ink of solder mask getting yellow after reflow with immersion gold
ou zhi fu ; song chao wen ; zhu tuo ; jiao rong hui

..............page:64-67

Analysis and control of dimensional stability on flexible base material in Rigid-flex circuit board
xu bo ; mo xin man ; chen zuo

..............page:308-314

Study on different processing flow of back-drilling
li jin hong ; chen xian ren ; luo long

..............page:223-228

Impact factors analysis for the rigidity of CCL
zeng mei yan ; lin zhen sheng ; yu zhong zuo ; wu xiao lian

..............page:49-53

Thermal resistance discussion on different pitch of high density holes
zeng xiang wei ; zhang chuan chao ; wang jun

..............page:449-456

Thermal stress simulation of HDI PCB based on finite element analysis of COSMOSWORKS
yu yan ; wang shou xu ; he wei ; chen yuan ming ; su xin hong

..............page:494-500

Study on manufacturing process of semi-flex printed circuit board
he xue mei ; he wei ; ning min jie ; hu yong shuan ; su xin hong ; huang yong ; chen xian ren

..............page:323-327

Technology research about non-cyanide immersion gold plating
li bing ; li ning ; xie jin ping ; wang heng yi ; wang qun ; gao shuai

..............page:443-448

Investigation for burned trace on used PCB
sun guang hui

..............page:501-505

The research of beam expanders influence on the laser cutting quality
yin tong fang ; zuo xian de ; liang liao yuan ; lin xiao bo

..............page:203-207

The detection algorithm about maximum and minimum values of PCB line width
wang jing ; duan zu fen ; cai yu

..............page:476-479

Discuss about fine space of BGA design and manufacturing
luo wen zhang ; li chang sheng ; yan lai liang ; an guo yi

..............page:13-18

Preparation of a halogen-free flame retardant converlay
pan jin ping ; dong hui ; shen zong hua

..............page:39-43

The research of relationship between line width and copper thickness in acid subtractive method graph manufacturer
yao xiao shan ; peng jing hui

..............page:68-84

The engineering design and process control of automotive heavy copper multilayer PCB
zhou feng ; su fan chun

..............page:383-387

Analysis on copper thickness effect on the PCB dimension stability
huang li qiu ; wu feng wu ; zhang li hua

..............page:357-362

Twin copper in the plating forming causes and effects on product quality
chen liang ; liu zhen quan ; wang de huai ; cheng jing

..............page:274-280

A brief discussion about the V-cut technology of thin PCB
luo wen zhang ; li chang sheng ; yan lai liang ; an guo yi

..............page:229-233

Analysis and improvement of the rigid-flex board pressing foldness
hou li juan ; zeng ping

..............page:303-307

The technology of improving black spots on inner negatives film of PCB exposure
zeng xiang fu ; li fei hong

..............page:141-144

Comparative study of bisphenol a novolac type and phenol type novolac epoxy resins
meng yun dong ; zhou jiu hong ; deng hua yang ; fang ke hong

..............page:54-59

Effect of resin content on thickness uniformity and impedance control
wang hong fei ; chen zuo

..............page:174-179

Research of cost control system for PCB manufacture
ye ying cai ; wang hai yan ; lai chang lian

..............page:538-543

Some special methods of manufacturing printed circuit board with thick copper on the surface
xiao shi xiang

..............page:368-371

Research on the hybrid lamination of high frequency material PTFE
cai tong jun ; li jin hong ; hu xin xing ; liu feng ; ge chun

..............page:401-405

The development and application of high-compatibility and low cost lead-free material
fang zhi xiang

..............page:27-38

Investigation on technology of blind via filling using vertical plating line
chen shi jin ; luo xu ; zuo xin ; qiao peng cheng

..............page:265-273

Causes and solutions of via and blind holes mismatch in HDI
huang hai zuo ; du ming xing ; song jian yuan ; lin zuo ; bai ya xu

..............page:240-247

Discussion on the control of the third order intermodulation of antenna multilayer board
wang fei ; li chang sheng ; yan lai liang ; an guo yi

..............page:406-409

The study on the optimization of PTFE drilling parameter
zhang xia ; chen xiao yu ; zeng ping

..............page:372-376

Research on the influence of solderability on surface and inner hole film thickness
shen jiang hua ; chen li yang ; qiao shu xiao

..............page:427-432

Technical study for LED chip on about MPCB
li ren rong ; zou zi yu ; wang yuan

..............page:363-367

The challenge of dry film diversified process
su pei tao ; mei zhi xiong

..............page:92-97

Research on the ordinal pressing process of impar lamination with blind via
huang zhen

..............page:156-166

Analysis and demonstration of the reasons about undeveloped LPSM around holes' edges after
han qi long ; liu dong ; ye ying cai ; zhang jun jie ; zhu tuo

..............page:134-140

Studying on accurate material preparation realization by mathematics model
liu dong ; deng dan ; xiao gen fu ; zhu tuo ; luo yun chang ; zuo bin bin

..............page:532-537

A new approach of printing conductive patterns with sliver nanoparticles without sintering
tang yao ; tao zhi hua ; wang shou xu ; he wei

..............page:417-422

Study on process of thick copper laminating
lv yong

..............page:167-173

Conductive carbon oil resistance analysis and discussion on control technology
cui xiao chao ; tang kun ; zhu tuo ; wu feng shun

..............page:130-133

Preparation and application of high temperature resistant protective film for FPC
xiao jian wei ; yan hui ; li zuo lin ; meng fei ; chen wei ; fan he ping

..............page:338-342

The influence of Ink wastewater to heavy metal wastewater on PCB
wang gen chang ; liao qi jun ; yao guo qing

..............page:512-515

The discussion and maintenance of reverse osmosis for PCB reusing water
wang gen chang ; liao qi jun ; yao guo qing

..............page:506-511

Analysis and improvement on solder mask penetrating holes
liu ke gan ; liu dong ; song chao wen ; zhu tuo ; liang shui jiao

..............page:123-129

Study of influence of immersion angle on the solderability tests by wetting balance
liang guo fu ; chen zuo

..............page:464-469

Study on the process technology of a stack-via 3 steps HDI board
chen shi jin ; luo xu ; zuo xin ; qiao peng cheng ; xu huan

..............page:287-293

Factors affecting small hole metalization quality
zhang feng min

..............page:248-253

A review of backdrilling technology development
li guo you ; qiu yan jia ; zhang xue dong

..............page:214-219

The research on direct alignment of artwork
xiong jian cheng

..............page:115-122

The Analysis Report of Backplane Production And Developed Tendency
li zuo ; hu yong shuan ; li jin hong ; ren bao wei ; ge chun

..............page:388-394

Preparation and performance of epoxy resin adhesive with novel polyamides
liu da juan ; li zuo lin ; yan hui ; shi yu jie ; yang zuo ; fan he ping

..............page:333-337

The solution for preservative on gold surface of selective enig+ops process technology
chen shi jin ; luo xu ; zuo xin ; qiao peng cheng ; xu huan

..............page:438-442

The study of modified semi-additive process
wu yun peng

..............page:85-91

Study on plating filling in blind hole by horizontal plating for HDI PCB
ning min jie ; he wei ; tang xian zhong ; he xue mei ; hu yong shuan ; cheng shi gang

..............page:234-239

The carbon ink crack on the line after lead-free reflow soldering
li chun ming

..............page:106-114

Technology development and application of making PTH hole/slot with no ring by DES
kang yi ping ; hu yong shuan ; li jin hong ; luo long ; zuo hao qiang ; cai tong jun

..............page:145-151

The further discussion of immersion tin surface discolor problem
zhang jie wei ; chen li yang ; qiao shu xiao

..............page:433-437

Brief introduction of signal integrity design and manufacturing
tang yu kun ; ze sheng ; li chang sheng ; yan lai liang ; an guo yi

..............page:7-12

Some methods to optimize the laminated structure and reduce the production costs
zhu tuo ; liu dong ; lv qian wei ; liang shui jiao

..............page:152-155

Research on the control method of disconnect and burr of the half metalized hole for a ceramic filled board
zhang xia ; chen xiao yu ; zeng ping

..............page:349-356

Preparation of conductive ink using copper-doped phenolic resin
zhou feng ; wang shou xu ; he wei ; zhang hai quan

..............page:423-426

Why advanced PCB plating need to use microcrystalline copper anodes with low phosphor as its anode?
chen shi rong ; yang qiong ; chen zhi jia ; zhou xiang ling ; liang zhi li

..............page:260-264

Study of iocalization rim void
lin xiu zuo ; xue min fen

..............page:220-222

The discussion on how to reduce the cost&increase the profitability by high efficiency wireless energy management system
yang jin run

..............page:522-526

Research on dispersion ability of the deposits for Panel Plating
yong hui jun ; zhang li hua

..............page:254-259

Research of via-plug with solder mask and improvements
meng fan yi ; sun jian

..............page:98-105

High dielectric constant polymer based copper clad laminate for antenna application
yan shan yin ; su min she ; yin wei feng

..............page:44-48

Barrel cracking of copper plating and solutions
ji long jiang ; wang da wei ; qin li jie

..............page:187-192

Study on the influence factors of middle hole-shift for PCB lamination
feng li ; he wei ; huang yu xin ; he jie ; xu huan ; zhou hua ; luo xu ; dai guan jun

..............page:180-186

The research on the UV laser cutting speed improvement for the cover layer
luo jun tao

..............page:198-202

My suggestions about on PCB company cost management
chen shi jin

..............page:527-531

Analysis of fibre crazing and its influence to anti-caf capability of PCB
hu meng hai ; chen zuo

..............page:457-463

The peel strength descent of PCB of reinforced hydrocarbon/ceramic laminates
sun li li ; hu xin xing ; liu feng

..............page:395-400

The application of a genesis script for fast generating impedance coupons
li yong ; liang shui jiao

..............page:1-6

Functions of the additives in microvia filling by copper electrodeposition
xiao ning ; li ning ; xie jin ping ; wang heng yi ; gao shuai ; fan xiao ling

..............page:281-286

PCB enterprise self-developed project management
zhu tuo ; song jian yuan ; lu hui ; deng dan ; liang shui jiao ; wei xiu yun

..............page:544-552