1009-0096
2012 Issue 6
A study on the process of medium-speed electroless copper plating on PCB with high stability
xie jin ping ; wang qun ; wang heng yi
xie jin ping ; wang qun ; wang heng yi
..............page:25-27,59
A research on the process technology of any layer HDI board
chen shi jin ; luo xu ; zuo xin
chen shi jin ; luo xu ; zuo xin
..............page:28-32
..............page:7-9
Production safety is crucial
wang long ji
wang long ji
..............page:3-3
Development of a lead-free CCL with better CAF,PCB workability and heat resistance
wu zuo hui ; fang ke hong
wu zuo hui ; fang ke hong
..............page:16-18
The application of high temperature resistant Acrylic PSA tape in FPC industry
liu bo ; luo kai qing
liu bo ; luo kai qing
..............page:43-46
..............page:72-72
Two PTH technology application experiences
wei guo ping
wei guo ping
..............page:22-24,46
..............page:10-15
Study on resistance value control method of buried plane resistor PCB
jiang xue fei ; liu dong ; ou zhi fu
jiang xue fei ; liu dong ; ou zhi fu
..............page:38-42
New Product ＆ New Technology （64）
gong yong lin
gong yong lin
..............page:71-71
Analysis on application of information management in PCB industry
deng jun ; cao cou xian ; wei zuo
deng jun ; cao cou xian ; wei zuo
..............page:67-70
Research in plating silver of imidazole radicle ionic solution [BMIm]^＋PF6^-＋AlCl3in room temperature
cheng jing ; chen liang
cheng jing ; chen liang
..............page:52-55,63
Research of pattern and hole in the cavity bottom stairstep PCB which use high-speed material
jiao qi zheng ; zeng zhi jun
jiao qi zheng ; zeng zhi jun
..............page:47-51
How to identify impact of hollow fiber on the reliability of PCB
wang li feng ; wu xiao lian
wang li feng ; wu xiao lian
..............page:19-21
HASL tin defect exploration and improvement
zhao zhi ping ; zhou gang
zhao zhi ping ; zhou gang
..............page:60-63
Application of VNA in high speed PCB material evaluation
zhu xing hua ; he wei
zhu xing hua ; he wei
..............page:64-66
The impact of pre-treatment in solder mask bridge of PCB production
ao si chao ; cai ming yang ; cao cou xian ; deng jun
ao si chao ; cai ming yang ; cao cou xian ; deng jun
..............page:56-59
The difficulties for 2-Step blind via
wang ke cheng
wang ke cheng
..............page:33-37
..............page:4-6