1009-0096
2012 Issue 5
Cause and measures of flex base material＇s reduction and enlargement of rigid-flexed MLB
yang chao zhi ; ma zhong yi ; shang jian rong
yang chao zhi ; ma zhong yi ; shang jian rong
..............page:62-65
How PCB companies to attract and retain talents
wang xiao zuo
wang xiao zuo
..............page:9-13
..............page:14-17
..............page:6-8,13
Process conditions research on the active copper oxide powder
fu fei yan ; wang long biao ; zhou zhong cheng ; yang meng hui
fu fei yan ; wang long biao ; zhou zhong cheng ; yang meng hui
..............page:23-25,65
..............page:71-71
..............page:72-72
jie xi sem eds fen xi yuan li ji ying yong
di qing xia ; huang hai zuo ; liu dong ; liu ke gan
di qing xia ; huang hai zuo ; liu dong ; liu ke gan
..............page:66-70
Study on the expansion and contraction control and delamination problem of HDI printed circuit board
huang zhi yuan ; chen heng ; cao xiao ming ; jin zuo ; zhu meng ; liu xue hui ; he wei
huang zhi yuan ; chen heng ; cao xiao ming ; jin zuo ; zhu meng ; liu xue hui ; he wei
..............page:50-53
Preparation of copper oxide copper etching waste liquor
zhang huang chu ; gong jun ; pan zhan chang ; xiao chu min ; hu guang hui ; wei zhi gang
zhang huang chu ; gong jun ; pan zhan chang ; xiao chu min ; hu guang hui ; wei zhi gang
..............page:48-49,53
Finished colleague study on work
wang long ji
wang long ji
..............page:3-3,17
Research on super fine line and space production
liu hai long
liu hai long
..............page:42-47
..............page:4-5
..............page:54-56,61
Desmearing mechanism,the defect type appeared during desmearing process and improvement method
cheng jing ; wang hao ; yang qiong ; wu pei chang
cheng jing ; wang hao ; yang qiong ; wu pei chang
..............page:33-38
..............page:39-41,47
The present condition and demand research of LTCC multi-layer substrate manufacturing technology standards in our country
zuo yu qing ; wang gui ping ; lv qin hong ; liu rui xia ; he zhong wei
zuo yu qing ; wang gui ping ; lv qin hong ; liu rui xia ; he zhong wei
..............page:57-61
tan jian chi bu xing shi er da hao chu you gan
ma ming cheng
ma ming cheng
..............page:70-70
Analysis of the bipolarization phenomena in plating process
yang zhi qin ; ni chao ; tian rui jie ; lu ran ; zhang zuo
yang zhi qin ; ni chao ; tian rui jie ; lu ran ; zhang zuo
..............page:26-27,38
Copper plating via filling technology
cai ji qing yi
cai ji qing yi
..............page:28-32
Advances in via holes design of high-speed PCB
wang hong fei ; li zhi dong
wang hong fei ; li zhi dong
..............page:18-22,32