Printed Circuit Information 2012 Issue 4 Study of laser shape technology on step boards

Study of laser shape technology on step boards
jiao yun feng ; wu feng wu ; zhang li hua

..............page:28-31

Research and improvement on plating gold area and thickness in pattern plating nickel and gold
liu

..............page:36-42

Above 420μm thick copper power panel drill hole process technology research
ji long jiang ; qin li jie ; zhang wei ; li de zhi

..............page:16-21

The application of TOC （Theory of Constraints） in plan and manufacturing management of PCB
ye jun ; chu li bo ; liu zeng

..............page:175-179

Analysis on the technology of rigid-flex PCB window
deng xian you ; jiang xue fei ; peng wei hong ; liu dong ; song jian yuan

..............page:84-88

Research on the cleaning adhesive of multilayer rigid-flex PCB through wet ways
chen liang ; wang de huai ; chen shi rong ; luo xiao hu ; wang hao

..............page:89-95

The process of rigid-flex PCB
chen yong sheng ; wu yun peng ; huang zhen ; zhao yu ; wang ben chang ; xiao chun ming

..............page:96-100

Discussion on the status and management of research and development of PCB industry
ke yong

..............page:180-184

Studies on registration precision of Anylayer HDI
li yan guo ; lin can rong ; li zhi dong

..............page:161-163

Research on resin filling technology of HDI buried hole
lin can rong ; li yan guo

..............page:164-167

Practice and research of the information in the PCB equipment management
zuo xiu hong

..............page:185-190

The manufacturing method on laser engraving oxide layer of Aluminum base board
he xin rong ; zeng ping

..............page:126-130

Research on laminated void and copper infiltration
zeng hong ; yang xing

..............page:118-125

qian yan

..............page:I0002-I0002

Conductive anodic filament failure investigation of PCB
hu meng hai ; chen zuo

..............page:79-83

A super fine surface treatment improve solder mask peeling off for immersion tin PCB
xie jun ; chen chun

..............page:52-54

Impedance control of Vias and its impact on signal integrity
wang hong fei ; li zhi dong ; qiao shu xiao

..............page:74-78

Technique of embedding electro-static discharge protection printed circuits board
huang yong ; chen zheng qing ; zhu xing hua ; su xin hong ; yao feng ; zuo guo feng

..............page:139-142

Multi-layer and high-frequency mixed-pressing PCB stackup structural design analysis and lamination adhesive control
li chang sheng ; li bang qiang ; yan lai liang ; an guo yi

..............page:135-138

Multi-optical-engine laser dynamic imaging technology and its application in PCB, HDI and IC subtract fabrications
du wei chong ; qu lu jie

..............page:6-9

Synthesis of silver crosslinked activated slurry and its application for RFID
luo guan he ; chen shi rong ; hu guang hui ; pan zhan chang ; huang ben yu ; xu qing song ; wu yu zhi ; sun bin

..............page:143-146

Finite element analysis on the effect of heat conduction layer thickness on heat dissipation capability of PCB
zhou cheng ; he wei ; chen yuan ming ; zhou guo yun ; wang shou xu

..............page:60-63

Research for nickel corrosion problem of ENIG
chen li yang ; zhang jie wei ; shen jiang hua ; qiao shu xiao

..............page:55-59

The development of equipment maintenance management systems in the PCB enterprise
zou yan li ; guo rong wei ; tan yong long ; liu zhi fang

..............page:168-174

The analysis of the impact of pool effect on etching of heavy copper PCB
zeng fan chu ; shi shu han

..............page:1-5

Do you know immersion tin？
li fu ; li bin

..............page:47-51

Application of the hosphofized copper with mico-crystal in perfect PCB manufactured process
chen shi rong ; yang qiong ; luo xiao hu ; luo guan he ; chen zhi jia ; zhou xiang ling

..............page:32-35

The introduction of CCTC＇s R＆D and application on Anylayer technology
lin xu rong ; zhang xue dong

..............page:157-160

Stiffener lamination defect improvement of Flexible Printed Circuit Boards
mo xin man ; xu bo ; chen zuo

..............page:101-105

New advances of laser application for PCB manufacturing
huang yu xin ; he wei ; hu you zuo ; xu huan ; zuo xin ; luo xu ; chen shi jin ; wang ke cheng

..............page:13-15

The mechanism and performance research of pulse plating solution
zhang hong chun

..............page:43-46

The research of influence factors on charring in UV laser cut cover layer
luo jun tao ; yin tong fang ; liang liao yuan

..............page:24-27

Study on the manufacturing technology of high reliability 18 Layers flex-rigid PCB
peng wei hong ; liu dong ; zhu tuo ; deng xian you

..............page:106-110

xu

..............page:I0001-I0001

Blind and buried Via PCB manufacturing difficulty check method
liu dong ; jiang xue fei ; peng wei hong ; deng xian you ; ye ying cai ; peng chun sheng

..............page:147-151

Optimized the parameters of CO2-1aser during drilling blind-vias of PCB
hu you zuo ; he wei ; xue wei dong ; huang yu xin ; xu huan ; lv wen qu ; luo xu

..............page:10-12

Analysis and exploration on bare board test and PCBA performance test and functional usage
zheng chang bo

..............page:64-69

The study of thermal analysis for CCL and PCB
su fan chun

..............page:70-73

Preliminary study on the import of INPLAN intellectualized engineering
peng chun sheng ; jiang xue fei ; peng wei hong ; liu dong ; zhu fang sheng

..............page:152-156

V-cut depth standard analysis
wang jin

..............page:22-23

PTFE high frequency board drilling parameter evaluate
chen hao ; liu xiao hua ; hua yan sheng ; chen zheng qing ; zhu xing hua

..............page:111-117

Application of CEM-3 type copper foil to copper clad laminates
hou li juan ; chen xiao yu ; su jian xiong

..............page:131-134