Printed Circuit Information 2012 Issue 3 Strong, hope to have more private enterprise listed in stock market

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Printed Circuit Information
1009-0096
2012 Issue 3

Strong, hope to have more private enterprise listed in stock market
wang long ji

..............page:3-3,27

None problem issue
lin jin du

..............page:4-5,23

The four-challenge of PCB industry in China （2）
lin jin du

..............page:6-9

Development of technology about phenolic/paper copper clad laminate in recent years（l） review and analysis of Japanese patent to phenolic/paper copper clad laminate in recent years
zhu da tong

..............page:10-14,31

Laser Drilling Technology for Printed Circuit Board
cai ji qing yi

..............page:15-19

Technology trend and theme of PCB for electronics packaging（l）
cai ji qing yi

..............page:69-70

The effect of Phosphorus-containing flame retardant on the properties of halogen free FR-4 copper clad laminates
yang song ; li xing min ; tang qing zuo ; xiao sheng gao

..............page:20-23

New Product ＆ New Technology （62）

..............page:71-71

Characteristic analysis and application of resin coated aluminium foil for entry board
luo xiao yang ; qin xian zhi ; zhang lun qiang ; zhou hu

..............page:24-27

Literatures ＆ Abstracts （126）

..............page:72-72

Profile and flatness techniques for Aluninium back PCB
lin hai

..............page:28-31

0.5mm pitch BGA chip PCB design
wang yong mei

..............page:32-33,44

Imaging technology of high precision parallel light exposure machine
huang zhi yuan ; zhang jian jun ; liang si lian ; yang xiao jian ; wang ze yu ; zhu meng ; he wei

..............page:34-36,39

Analysis and processing of chloride ions accident with Improper control
tang quan

..............page:37-39

Overview of mechanism of sulfate copper electroplating
sun jun jie ; tian rui jie ; lu ran ; ni chao

..............page:40-44

Evolution of cupreous ionic（Cu2＋） concentration with the variety of time in metallic electroplate
cheng jing ; chen liang ; wu pei chang

..............page:45-47,53

Technical research on thin RF-PCB ＋ Cavity substrate
bai yong lan ; guo quan ; ren yao ru

..............page:48-53

Process development of 205.7μm heavy copper PCB
jiao qi zheng ; zeng zhi jun

..............page:54-57

Influence of electroless Ni-P plating condition on wire bondability （2）
cai ji qing yi

..............page:58-60,68

Study of how to improve the AOrs inspection efficiency
huang rong qiong

..............page:61-68