1009-0096
2012 Issue 2
..............page:68-70
Analysis and simulation on the uniformity of ink supply in ink-jet printing system
zhou xiao zhou ; zhang xiang lin ; luo ming ; rao zuo ; mei ling liang
zhou xiao zhou ; zhang xiang lin ; luo ming ; rao zuo ; mei ling liang
..............page:53-58
Dynamic acid CuCl2 etching uniformity and etching rate study
huang yu xin ; he wei ; hu you zuo ; xu huan ; zuo xin ; luo xu
huang yu xin ; he wei ; hu you zuo ; xu huan ; zuo xin ; luo xu
..............page:38-41
PCB acid etching mechanism,technological parameters and trouble shooting
wu pei chang ; cheng jing ; chen liang
wu pei chang ; cheng jing ; chen liang
..............page:31-37
A special panel of new technological process development
zhang huang chu ; gong xuan li ; gong jun ; zhao qi xiang ; liu shi feng
zhang huang chu ; gong xuan li ; gong jun ; zhao qi xiang ; liu shi feng
..............page:64-67
Non-etching adhesion promoters treatment technology for PCB
cai ji qing yi
cai ji qing yi
..............page:44-48
Seize opportunity and improve enterprise competence
wang long ji
wang long ji
..............page:3-3,5
Some thinking during Japan visit
wang long ji
wang long ji
..............page:4-5
..............page:13-16
Discussion on practical regeneration technologies of spent etchant for printed circuit board
jiang yu si ; zhang jian hua ; cheng hua yue ; huang qi shu
jiang yu si ; zhang jian hua ; cheng hua yue ; huang qi shu
..............page:42-43,48
New Product ＆ New Technology （61）
gong yong lin
gong yong lin
..............page:71-71
PCB hole plating void cause analysis
lu da wei
lu da wei
..............page:22-25,63
..............page:26-30
..............page:59-63
More solutions than difficulties
lin jin du
lin jin du
..............page:6-7
Study on the technology of the CCL with thin base material ＆ thick copper foil
ma dong jie ; huang wei zhuang ; huang hai lin
ma dong jie ; huang wei zhuang ; huang hai lin
..............page:17-19,52
..............page:72-72
Limitation and improvement of thermal management on high frequency mixed-laminated multilayer PCB
li zuo ; chen yuan ming ; he wei ; huang yun zhong ; zhang jia ; zhao li ; fu hong zhi ; liu zhe
li zuo ; chen yuan ming ; he wei ; huang yun zhong ; zhang jia ; zhao li ; fu hong zhi ; liu zhe
..............page:49-52
Study on the cathode initial process of copper plating on the electroless copper base
yang zhi qin ; ni chao ; lu ran ; zhang zuo ; tian rui jie
yang zhi qin ; ni chao ; lu ran ; zhang zuo ; tian rui jie
..............page:20-21
..............page:8-12