Printed Circuit Information 2012 Issue 10 FPC Technology trend of South Korea

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Printed Circuit Information
1009-0096
2012 Issue 10

FPC Technology trend of South Korea

..............page:8-10

Development of research and application of resin with high thermal conductivity(1)——review of new technology of heat dissipation substrate material
ZHU Da-tong

..............page:11-16

Analysis of the eductor process in copper electroplating microvia filling process
SUN Jun-Jie;OUYANG Xiao-ping;LU Ran;NI Chao

..............page:22-25,33

Process of plating to form smooth circuit on various materials

..............page:38-41

Discussion and research of Thiourea masking——complexometric titration method for the determination of EDTA in the electroless copper plating waste
ZHANG You-Zhen;PENG Yi-hua

..............page:47-49,51

Talk about electroplating uniformity problem
LUO Wei-fei

..............page:50-51

Making R-FPC by using rigid board manufacturing equipment
LV Wen-qu

..............page:56-59

Electroless nickel immersion gold black pad features & test methods introduction and black pad criteria recommendation
LI Fu;LI Bin

..............page:60-66

PCB factory equipment maintenance problems and countermeasures
OUYANG Yan-xiao

..............page:67-70

New Product & New Technology (68)

..............page:71

Literatures & Abstracts (132)

..............page:72

How big is the world PCB market?

..............page:5-7,10

Application research of any layer interconnect technology
HUANG Yong;WU Hui-lan;ZHU Xing-hua;CHEN Zheng-qing

..............page:52-55

The application of plasma in printed circuit board
XIN Feng

..............page:42-43

Research progress of conductive adhesives for stacked micro via
WU Hui-lan;HUANG Yong;ZHU Xing-hua;SHI Shu-han

..............page:34-37

The research studying of laser drilling process for HDI board with inner layer brown oxidation treatment
ZENG Hong;HAN Ming

..............page:26-33

Add energy to the development of private enterprises
WANG Long-ji

..............page:4,59

Private enterprises——the strength of the industry
WANG Long-ji

..............page:3,70

Applications of high dielectric constant copper clad laminate in miniaturized microstrip antenna
YAN Shan-yin;SU Min-she;YIN Wei-feng

..............page:17-21,37

Research on the effect of copper plating by different additives
WANG Ke-cheng

..............page:44-46