Printed Circuit Information 2011 Issue z1 Development of a new type of flocculant for stannic colloid

Development of a new type of flocculant for stannic colloid
ZHOU Zhong-cheng;WANG Ke-jun;GAO Si;YI Jia-xiang;WU Xiao-hong;DUAN Yuan-fu

..............page:146-152

A calculating method for cost accounting and resource optimization of plating
ZHANG Yan-sheng;ZHU Tuo;DENG Dan;SONG Jian-yuan;JIANG Cui-hong;WANG Li-quan;JIAO Rong-hui

..............page:367-372

Solder application process before the plug hole
TANG Pan

..............page:82-91

Research of developer and stripper wastewater treatment by Fenton Oxidation
MENG Fan-yi

..............page:333-338

The study of the lighting source system used on the measurement of the PCB line width
LONG Qing-wen;AO Hui-lan

..............page:203-208

The Development and Mass Production for Simplified HDI Technology
WU Mei;Fan Ze-jie

..............page:380-386

The measurement of FCCL high frequency dielectric properties and thermal coefficient of dielectric constant
GE Ying;WANG Zhi-yong;LIU Shen-xing

..............page:28-32

Drilling technology for high-thick copper
LU Yu-ting;CHEN Xiao-yu;WEI Xiong;YOU Jun;LUO Wen-wu

..............page:102-109

qian yan
wang long ji

..............page:封2

The effects of flux residues on the PCB
SUN Guang-hui

..............page:209-213

Study on technology of high frequency mixed lamination cavity board
SONG Jian-yuan;PENG Wei-hong;LIU Dong;HE Miao;ZHU Tuo;WEI Xiu-yun

..............page:278-284

Application of thermal analysis technology in the test of printed circuit
PEI Xu

..............page:220-226

Progress in Water-based Epoxy-acrylate for Flexible Copper Clad Laminate
LIU Chuan-chao;FAN He-ping;HAN Zhi-hui

..............page:33-38

The impact of HIC to PCB surface and performance
ZHANG Qiu-rong;LI Zhi

..............page:344-352

Study on gold thickness control in Cyanide-free immersion gold process
SU Xin-hong;DENG Yin;ZHANG Sheng-tao;HE Wei

..............page:166-169

Research about the production technology of the PCB with extra-thick copper
XIE Chang-wen;ZHANG Xiao-qiang;XIAO Xiang-hui

..............page:314-319

The applied study of polyurethane resin in FR-4 copper clad laminate
QIU Yu-xing

..............page:44-48

A kind of special manufacturing process of printed circuit board
LI Guo-you;SUN Jian

..............page:304-308

The summarization of pre-production DFM
ZHENG You-wen

..............page:3-12

Analyzing the reason of under developing on annual ring after solder mask
WANG Jing-song;DU Yu-fang;WU Ying-xin;SUN Xin

..............page:77-81

A new technology for PCB Effect Increasing and Pollution Reduction——Introduction of WWT project
XIE Qing-wen

..............page:339-343

The reliability discussion of Semi-metal and cavity structure of PCB
LUO Yang-yang

..............page:320-323

Research on fractal characterization of via cleaning in PCB
DONG Ying-tao;HE Wei;ZHOU Guo-yun;WANG Shou-xu;XU Huan;QIN Xin;LUO Xu

..............page:133-138

EXCEL and Dynamic Compensate of CoreSS
LIN Xiao-dan;WEI Pei-jun

..............page:1-2

Development of halogen free and flame retardant Copper-Clad Laminate
TANG Guo-fang

..............page:39-43

The preparation of heat conductive insulating adhesive used for aluminum based board
LIU Chuan-chao;FAN He-ping;LI Zhen-lin;YANG Pei

..............page:13-18

Multilayer mini edge metallization PCB making technology study
ZHOU Jie-feng;LIU Dong;HU Lin-gui;DU Ming-xing;LIANG Shui-jiao;ZHU Tuo

..............page:309-313

The Study of Efficiency Improvement of MI & CAM Preparation
LI Zheng-cai;JIANG Xue-fei;PENG Wei-hong

..............page:373-379

16 layer R-FPC experiment
CHEN Liang;LIU Zhen-quan;ZHU Xian-jia

..............page:273-277

The study and improvement of plating deformation
ZHANG Lin

..............page:387-395

HDI board blind holes crack study
LIU Dong;ZHOU Gang;YE Han-xiong;WANG Yu-zhou

..............page:234-243

Analyzing the reason of Brass wires after Electroplating
CHEN Yu-chun;TIAN Qing-shan

..............page:139-145

Study on accuracy improvement of resistance on screen-printing resistor
JIN Yi;HE Wei;ZHOU Guo-yun;CHEN Yuan-ming;CHEN Zheng-qing;SU Xin-hong;HUANG Yun-zhong

..............page:324-329

Industrial Engineering and management technology to improve the efficiency of AOI scans
YANG Hai-yun;LIU Ying-ping

..............page:353-366

Discussion on delamination improvements of dense cooling Via in Pad
HUANG Shi-qing;CAI Tong-jun

..............page:214-219

Analysis of factors influencing the result of testing PCB material by Dynamic Mechanical Analysis
YANG Tuo;CHEN Pei

..............page:19-23

The apply of one method to improve resin solder mask plugging quality
OU Zhi-fu

..............page:73-76

Processing technique of rigid-flex PCB
YAO Guo-qing

..............page:266-272

FPC edge-board contact laser cutting technology with high precision
QIN Xian-de;LIU Ze-min

..............page:92-95

Processing technology of high-frequency copper substrate based PCB
ZHEN Hui-fang;YUAN Huan-huan;YANG Hai-yong;OU Wei-biao;ZHANG Xue-dong

..............page:291-295

Application and modification of Polyphenylene oxide in copper clad laminate
MENG Yun-dong;FANG Ke-hong

..............page:24-27

Finite Analysis on Drilling Thermal Effect for PCB
ZHOU Guo-yun;HE Wei;WANG Shou-xu;HU Ke;HE Bo;MO Yun-qi

..............page:116-119

The harms and the prevention methods of static and space static
LIU Dong;ZHU Tuo;PENG Wei-hong;JIANG Xue-fei;LIU Ke-gan;GAO Tuan-fen;WU Feng-shun

..............page:49-55

Control methods researched for reliability of heavy copper PCB
YE Ying-cai;HE Miao;HUANG Hai-jiao;YU Yang;PENG Wei-hong;JIANG Xue-fei;LIU Dong

..............page:296-303

The Test Technique of Characteristic Impedance in PCB
YUAN Huan-xin;ZHENG Hui-fang

..............page:227-233

The research and investigation of filling plating quality and reliability
PENG Tao;TIAN Wei-feng;LIU Chen;JIANG Xue-fei;PENG Wei-hong;LIU Dong

..............page:153-158

The analyses of multilayer board shrink during the lamination process
DENG Dan;XU Peng;WANG Li-quan;WU Feng-shun;LIU Dong;JIANG Xue-fei;PENG Wei-hong

..............page:127-132

The research of solder mask and resin plugging capacity
AI Hui

..............page:62-67

Preparation of nano-copper conductive slurry by using alkaline etching waste liquid
CHENG Liang;WU Zi-jian;ZHU Wen-wen;LIUZhen-quan;LUO Xiao-hu;CHEN Shi-rong;LUO Guan-he;PAN Zhan-chang

..............page:330-332

The concave - point confusion of the inner open for HDI
ZOU Ru-bin;PENG Wei-hong;OU Zhi-fu;RONG Xiao-qiang;LIU Dong;YE Ying-cai;ZOU Li-bin

..............page:258-265

The practice of cyanide-free golf plating process
DING Qi-heng;GAO Lin-jun

..............page:170-177

Solderability effecting factor of immersion tin
ZHAO Jian-hua

..............page:183-195

Influence of IMC growth on wettingability of PCB
CHEN Li-yang;QIAO Shu-xiao;YOU Zhi-min;LI Xiong-hui

..............page:178-182

Application of affine transformation in the PCB hole checker system
DENG Xiao-ming;XU De-ping;LIANG Qian

..............page:249-252

The application of heating technology in prepreg cutting process
LI Hong-li;PEI Tong-zhan;XU Gao-yong

..............page:96-101

Analyze and improve the Microcracks of gold surface of FPC
ZHANG Zhi-hua;CHEN Bei

..............page:159-165

Discuss about the pure ROGERS laminated high-frequency blind vias delamination
XIE Chang-wen;ZHANG Xiao-qiang;XIAO Xiang-hui

..............page:244-248

The study of how to control the nickel-foot in ENIG
QI Bin-bin;LI Xiong-hui;XIE Tian-hua;LI Zhi-dong

..............page:196-202

Super inner Cu thickness (≥ 0.4 mm) multilayer PCB pressing method research
GAO Tuan-fen;LIU Dong;JI Hui;CHEN Cong;HE Miao;PENG Wei-hong

..............page:120-126

A research on the process technology of a special cavity board
LUO Long;LI Jin-hong;CAI Tong-jun;CHEN Xian-ren

..............page:285-290

Influence of IMC growth on wetability of PCB
CHEN Li-yang;QIAO Shu-xiao;YOU Zhi-min;LI Xiong-hui

..............page:253-257

Research on triggered method Making PCB line
CHEN Shi-rong;LUO Guan-he;HU Guang-hui;LUO Xiao-hu

..............page:68-72

A study on the process of mechanical depth control of blind via
CHEN Xian-ren;LI Jin-hong;HU Xin-xing;IAO Liang-hui

..............page:110-115

Research and application on new green sulfuric acid and hydrogen peroxide micro-etching pretreatment process
ZHU Xing-hua

..............page:56-61