1009-0096
2011 Issue 6
Electroplating vibration implement basic research
LIU Dong;ZHOU Gang;YE Han-xiong;WANG Yu-zhou
LIU Dong;ZHOU Gang;YE Han-xiong;WANG Yu-zhou
..............page:41-45,70
Our industry is the industry with bright future
WANG Long-ji
WANG Long-ji
..............page:3-4
..............page:58-59
An effective preventive solution against the missing defect of AOI machine in PCB application
HUANG Rong-qiong
HUANG Rong-qiong
..............page:60-65
..............page:5-6,13
..............page:28-32
Embedded component PCB (1)
BAI Ya-xu;YUAN Zheng-xi;HE Wei;MO Yun-ji;HE Bo;ZHOU Hua
BAI Ya-xu;YUAN Zheng-xi;HE Wei;MO Yun-ji;HE Bo;ZHOU Hua
..............page:49-51
Application Research of Aluminum hydroxide in Copper Clad Laminates
HUANG Wei-zhuang;MA Dong-jie
HUANG Wei-zhuang;MA Dong-jie
..............page:33-36
..............page:71
..............page:37-40
Matched terminated stub VIA technology for higher bandwidth transmission in Line cards and backplanes
WU Xiao-long;WU Mei-zhu
WU Xiao-long;WU Mei-zhu
..............page:22-27,40
Build-up packaging technology development and design challenge (2)
WU Mei-zhu;WU Xiao-long
WU Mei-zhu;WU Xiao-long
..............page:7-13
..............page:46-48,65
Discussion of underfill process
Zhang Tao;SUN Zhong-xing
Zhang Tao;SUN Zhong-xing
..............page:66-70
..............page:后插1-后插2
Significance of enterprise-university-institute collaboration on promoting full-printed electronics industry in China
YANG Zhen-guo;CHAI Zhi-qiang;LIANG Zhi-li
YANG Zhen-guo;CHAI Zhi-qiang;LIANG Zhi-li
..............page:14-17,21
..............page:52-57
..............page:72
The cooperation of production and university and research in PCB industry, how to do research?
LIANG Zhi-li
LIANG Zhi-li
..............page:18-21