1009-0096
2011 Issue 5
..............page:71-72,后插6-后插7
..............page:4
Build-up packaging process development and design challenge
WU Mei-zhu;WU Xiao-long
WU Mei-zhu;WU Xiao-long
..............page:8-16,52
Double-sided COP subtractive process study
WANG Yan-yan;HE Wei;ZHOU Guo-yun;CHEN Yuan-ming;HE Bo;MO Yun-qi;ZHOU Hua
WANG Yan-yan;HE Wei;ZHOU Guo-yun;CHEN Yuan-ming;HE Bo;MO Yun-qi;ZHOU Hua
..............page:17-20
..............page:3-4
Investigation of high thermal conductivity silicone polymers encapsulant for printed circuit board assembly
ZHANG Min;HU Wen-chen;HE Wei
ZHANG Min;HU Wen-chen;HE Wei
..............page:58-60
..............page:21-22,30
Discussion about the different calculating method of plating area
SU Pei-tao;LI Guo-you
SU Pei-tao;LI Guo-you
..............page:23-25,42
..............page:35-42
..............page:31-34,57
The method of soldering test and evaluation for PCB
JIA Yan;CHEN Wen-lu;LI Xiao-ming
JIA Yan;CHEN Wen-lu;LI Xiao-ming
..............page:61-65
Requirements for SMT stencil design
SUN Zhong-xing;ZHANG tao
SUN Zhong-xing;ZHANG tao
..............page:53-57
The solderability and the reliability of ENEPIG final finish
LIN Jin-du;WU Mei-zhu
LIN Jin-du;WU Mei-zhu
..............page:43-48
A high-precision automatically method of line width measurement based on image processing
GAN Ming-hui;WU Wei-qin;LONG Qing-wen
GAN Ming-hui;WU Wei-qin;LONG Qing-wen
..............page:66-70
..............page:5-7,20
The implementation of PCB intelligent quotation system
HUANG Qun-dian;ZHANG Mian-sheng
HUANG Qun-dian;ZHANG Mian-sheng
..............page:49-52
Optimizing tests in Electroless copper plating using Sodium Hypophosphite as reducing agent append K4Fe(CN)6
WU Jing;WANG Shou-xu;HE Wei;HU Ke
WU Jing;WANG Shou-xu;HE Wei;HU Ke
..............page:26-30