Printed Circuit Information 2011 Issue 4 Degrade the EDTA in the waste of PTH by Photoelectron catalysis

Degrade the EDTA in the waste of PTH by Photoelectron catalysis
CHEN Liang;WU Zi-jian;ZHU Wen-wen;CHEN Shi-rong;LUO Xiao-hu;PAN Shen-chang;LUO Guan-he

..............page:179-182

Discussion about the PCB with thick copper and lack of plastic blind hole
TANG Hong-hua;CHEN Dong;CHEN Yu-tao

..............page:175-178

Study on the causation of having no copper in the holes of the PCB pattern plating
Li Lin-hong;Liu Yu-tao

..............page:76-79

The key technology of PCB AOI and one AOI system based on the sub-pixel detection and intelligence shape analysis
JIN Gang

..............page:100-105

Introduction of low Dk/Df CCL
SU Jun-hua

..............page:17-24

Research on buried hole technique of HDI products
CHEN Yong-sheng;LI Xiu-min;YANG Jin-shuang

..............page:85-88

BMV plating problem analysis and improvement
WU Yun-peng

..............page:89-92

Promote total safe production by implementation of occupation health safety management system
ZENG Hong;OU Yang-hong

..............page:188-194

Study on the resin coated copper of excellent tracking resistibility
WANG Qing;LIU Dong-liang

..............page:29-31

Research of the influence to post-process by copper-plating surface
GAO Qun-feng

..............page:93-99

Pressing technology in low-flow prepreg and its application development
YUAN Huan-xin;SU Fan-chun

..............page:57-61

Study on process parameters of RFID antenna printed with Roll to Roll technology
HE Xue-mei;HE Wei;CHEN Yuan-ming;MAO Ji-mei;LIU Wei-hua;ZHOU Hua;MO Yun-qi

..............page:117-120

Nano coating plating technology applied in mechanical process mechanical Process of PCB
LIU Dong;JIANG Xue-fei;PENG Wei-hong;LIU Ke-gan;GAO Tuan-fen;ZHOU Jie-feng;YE Ying-cai

..............page:67-71

Research on blind via drilling using UV laser
YU Xiao-fei;HE Wei;WANG Shou-xu;LU Yan-hui;ZHOU Cuo-yun;HU Ke;HE Bo;MO Yun-qi

..............page:62-66

Impact of adhesive on reliability of PTH in rigid-flex PCB
MO Xin-man;CHEN Pei

..............page:50-56

qian yan

..............page:前插1

New stack of through-hole printed circuit board design and manufacturing methods
HE Run-hong

..............page:200-202

Studies on calculating model of multilayer PCB registration capability
LI Yan-guo;YUAN Kai-hua;LI Zhi-dong

..............page:47-49

The challenge caused by PCB high density design to solder mask exposure——the study and application for new design and new equipment
LV Xiao-wei

..............page:203-213

High end Server PCB Technology Trend and Challenge
HU Gao-bin

..............page:1-4

Study on the drilling technology of Micro-Hole of flexible printed circuit
WANG Si-hua;FENG Lang

..............page:121-124

Development and mass production of embedded-capacitance PCB process
QU Gang

..............page:146-149

Study on key technology of high frequency embedded capacitance PCB
SONG Jian-yuan;JIANG Xue-fei;PENG Wei-hong;LIU Dong;YE Ying-cai

..............page:128-132

Safety evaluation and audit experiment
WU Zhi-hui

..............page:183-187

The progress of the improving toughness of the cyanate ester used in the laminate
WANG Zheng-fang;FANG Ke-hong

..............page:32-36

Discuss design and processing method of hole to Line small and high thick diameter ratio
XIE Chang-wen;ZHANG Xiao-qiang;XIAO Xiang-hui

..............page:195-199

A production process method of the Rigid-Flex PCB
WU Tie-ying;ZHU Zhan-zhi

..............page:125-127

Reliability testing of high density thermal via
XING Rui-min;LI Xiong-hui;ZHANG Ke

..............page:112-116

Technology research on partial hybrid PCB
HUA Yan-sheng;XIE Qiang-wei;XU Ming;LIU Xiao-hua;ZHU Xing-hua;HUANG Yun-zhong

..............page:37-43

Study on resin plugging hole of dense VIP with high aspect ratio
Huang Yun-zhong;LI Jin-hong

..............page:72-75

Preparation of a moderate temperature curing epoxy adhesive coverlay
PAN Jin-ping;FAN He-ping

..............page:5-8

A Novel Normal Tg And high heat resistance lead-free CCL
DIAO Zhao-yin

..............page:25-28

The research and develop of buried magnetic core PCB
ZENG Zhi-jun;GUO Quan;REN Rao-run

..............page:166-174

Study on the technology of thick hole copper ≥60μm
XU Xue-jun;GU Jian-ding

..............page:138-141

A new clean cutting machine for prepreg
LI Hong-li

..............page:44-46

Different surface treatment and high-performance resin hand in hand——a new technology for the cost-efficient manufacture of metal base PCB
CHEN Chong;LIU De-bo;PENG Qin-wei;KONG Ling-wen

..............page:133-137

Generic technology of control and inspection for PCB industry
LI Di

..............page:106-111

The study on the influence of different plating parameter in microvia filling plating
CUI Zheng-dan;XIE Tian-hua;LI Zhi-dong

..............page:80-84

Progress in Insulating and Thermal Conductive Adhesives and Application of Metal Substrates
HAN Zhi-hui;LIU Chuan-chao;FAN He-ping

..............page:9-16

Discussion on production of high-level thick copper blind and buried vias board
LU Yu-ting;WANG Jun;WEI Xiong;LONG Xiao-ming;YOU Jun

..............page:142-145

Process development of pre-bonding metal-based board
DU Hong-bin;DU Cheng-guang;REN Rao-run

..............page:150-165