Printed Circuit Information 2010 Issue z1 Discussion about the improvement of the black hole and the solder off for the Circuit Board with holes in pad

Discussion about the improvement of the black hole and the solder off for the Circuit Board with holes in pad
TANG Hong-hua;CHEN Yu-dao

..............page:107-110

The significant factors analysis for IMS surface discolour problem
CHEN Li-yang;QIAO Shu-xiao

..............page:34-38

Micro-etching and compound metal OSP
LIAO Gui-sheng;LIU Zheng

..............page:56-60

Principle of laminate wrinkle and troubleshooting in high layer count PCB
LIU Dong;GAO Tuan-fen;YU Hua;JIANG Xue-fei;WU Feng-shun;YE Ying-cai;DENG Dan;QU Qing-xia

..............page:360-365

Measuring solidifying extent of solder mask by FTIR spectrum test report
CHEN Ze-min;SHI Huan-ying;ZHANG Wei-xuan

..............page:24-27

Analyzing the Reason of black PAD after ENIG soldering
OU Zhi-fu

..............page:39-42

Discussion about the production process of the PCB with extra-thick copper(343 μm)
LI De-jia;ZHU Zhan-zhi;LIU Min

..............page:252-257

HASL tin-copper-nickel reflow process product pad color defect research and solution
XU Huan;ZHANG Qiu-rong

..............page:43-55

Positioning capacity assessment in the legend screen printing
ZHANG Jian

..............page:276-287

Analysis and improvement of HDI delamination
YANG Jin-shuang

..............page:137-145

Discuss about the line production process of thick copper
XING Rui-min;ZHANG Ke

..............page:244-251

Investigation of OSP treatment system by the spray
K.Nishie;N.Yaguma;Y.Furukawa

..............page:9-14

A supper thin carrier film for FPC study
LI Zhenlin;ZHANG Xue-ping;FAN He-ping

..............page:195-198

Research on the process of Micro buried/blind Via in HDI rigid-flex PCB
LONG Fa-ming;XU Yu-shan;HE Wei;MO Yun-qi;CHEN Yuan-ming;WANG Yan-yan

..............page:190-194

PTFE high frequency board problem analysis
HUA Yan-sheng;ZHU Xing-hua;GAO Bin;Lin xiao-hao;Huang Bing meng

..............page:232-243

Perception on the coupled lines control
WEI Yan-ping;FANG Da-lang

..............page:524-537

Research of CCL material purchasing tactics and rules of operation cost variation
LIU Dong

..............page:488-498

bian hou gan

..............page:前插2

The contrast and analysis of the heat-resistant performance of different materials on high density thermal via
ZHANG Ke;QIAO Shu-xiao

..............page:551-560

Processing technology on short slot hole
ZHAO Yao;ZHOU Gang

..............page:431-439

Study and improvement on burrs in backdrilling hole
CHEN Xian-ren;HUANG Yun-zhong;HUANG Cheng-ming

..............page:469-474

PCB half hole Multi-step processing
HUANG Ren-quan

..............page:465-468

Researched of preparation of special copper powder for conductive ink
YU Xiao-fei;HE Wei;WANG Shou-xu;TANG Yu;ZHANG Min;HU Ke;MAO Ji-mei

..............page:561-564

Thick copper core and high resin content pressing structure study
HUANG Zhen

..............page:374-382

A study about filling mechanical blind hole directly with prepreg
OU Wei-biao

..............page:394-397

A high thermal resistant fire-retardant low dialectic loss thermal resin development
LIU Guo-wen;LIU Yu;XU Qing-yu;WANG Luo-li;LI Xiang

..............page:337-341

The signal integrity study of printed circuit board
GAO Bin;ZHU Xing-hua;CHEN Zheng-qing;SUN Peng

..............page:512-523

CO2 direct laser pre and post treatment
Sachiko NAKAMURA;Shigehiro IKEJIRI;Yukinhiro MAEDA

..............page:446-452

The effect of hole on line in SES
XU Juan;TIAN Ling

..............page:304-308

Analyzing of the influence of spindle speed on drilling
LIU Lan

..............page:461-464

The technology description of resin plugging PCB
YE Ying-cai

..............page:398-406

PCB company quality cost control
XIE Chang-wen;LI Ye-fei

..............page:475-480

Enhance FPC usage on design stage
SONG Guo-guang

..............page:178-182

The process technology of PTFE-based step laminated buffed resistant Multilayer printed circuit board
LAI Han-qi;PENG Qin-wei

..............page:225-231

Anodic oxidation techniques and growing mechanism of oxidative film
DING He-bin;LIU Yi-hua;QIAO Shu-xiao

..............page:126-132

Application of PCB spray system
HE Ping;LI Xiao-bo

..............page:499-511

Analysis and solutions for the path filter error caused by failure of GERBER segment
CHEN Yang

..............page:538-541

A kind of Halogen free material with good PCB mechanical Processability
GUO Li-qin

..............page:346-352

Study of an electroless copper plating bath using potassium sodium tartrate as chleating agent
ZHOU zhong-cheng;MA si-cai;YI jia-xiang;GAO si;SU liang-fei;LIU Rong-sheng

..............page:98-102

The influence of super filling in Microvia filling by electroplating
CUI Zheng-dan;XIE Tian-hua;LI Zhi-dong

..............page:92-97

A novel superior toughness and high Tg lead-free compatible CCL
LI Jun-hua

..............page:321-328

Embedded inductor magnetic core in PCB during mounting process
CHEN Jian;HUANG Liang-rong

..............page:215-218

Ability development of resin plugging on high aspect ratio PCB
DONG Hao-bin;ZHANG Jian

..............page:383-393

A summary of electroplating uniformity in PCB
WANG Xue-tao;QIAO Shu-xiao

..............page:116-120

Optimized tests of printing process parameters in manufacturing RFID Antenna on paper substrate
CHEN Yuan-ming;HE Wei;LONG Fa-ming;WANG Yan-yan;BAI Ya-xu;LIN Jun-xiu;MO Yun-qi;HE Bo

..............page:315-320

The analysis of MLB\'s shrinkage during the lamination process
DENG Dan;XU Peng;WU Feng-shun;JIANG Xue-fei;PENG Wei-hong;LIU Dong;YE Ying-cai;GAO Tuan-fen

..............page:366-373

The impact of plating copper thickness difference on line width
TIAN Ling;LI Zhi-dong

..............page:121-125

Green production and cost saving of the wet processes for printed circuit board
SUI Pei-tao

..............page:160-163

Research on electroless copper plating technology using Hypophosphite as reducing agent
WU Jing;HE Wei;WANG Shou-xu;XIA Jian-fei;HU Ke;MAO Ji-mei

..............page:103-106

Preparation of a halogen-free flame retardant FCCL
LIU Gang;FAN He-ping;LI Zhen-lin;YAN Hui

..............page:332-336

Development of Micro drill bit with high aspect ratio
FU Lian-yu;LI Xue-guang;GUO Qiang

..............page:440-445

Discussion on design and processing method of blind slot
XU Xue-jun;LI Ye-fei;RAN Yan-xiang;WU Bei-cheng

..............page:415-421

Perception on the control of thick copper laminate thickness uniformity
WEI Yan-ping;RAN Yan-xiang

..............page:407-414

The application of Z-Axis interconnection technology in high layer count printed circuits board
LIU Yi-chao;PENG Qin-wei

..............page:219-224

qian yan
huang zhi dong

..............page:前插1

Numerical research on the influence of a side-jet on the flow within via
LIAO Qin;WANG Xue-tao;LI Zhi-dong

..............page:85-91

Micro via laser drilling orientation methods studied for HDI Products
YE Ying-cai;LIU Dong;SONG Jian-yuan;HUANG Fa-hai

..............page:422-430

An auto test system for the analysis of dielectric property of copper clad laminate substrate
GE Ying;XIE Mei-luan;GONG Yan-bin

..............page:329-331

Research on registration optimization of HDI
LI Xin;XIA Zhi;GONG Lei

..............page:298-303

Dynamic etch compensation function to improve the non-uniformity of acid etching
WEI Pei-jun

..............page:288-292

Test of router performance
OU Neng;QIN Li-jie;WANG Da-wei

..............page:565-570

Technical elements analysis on the enhancement of routing precision
JIAO Yun-feng

..............page:453-460

Analysis and improvement of Multi-layer PCB plated slot hole wall pullaway
YANG Hai-yong;SUN Jian

..............page:111-115

The application of elliptical model in intensive line manufacture
TANG Guo-liang

..............page:293-297

The factors research of the S/M peeling off during ENIG
ZOU Ru-bin

..............page:152-159

The research and breakthroughs of the UV laser cutting technology in flexible printed circuit industry
SONG Liu-yang;LIANG Qian;WU Wei-qin

..............page:183-189

Influence of solder mask and dry film on thickness of ENIG
MENG Fan-yi

..............page:28-33

Rigid-flex PCB hole plating metallization process
ZHU Xian-jia

..............page:133-136

Studies on stress effect between copper and base material
LI Yan-guo;LI Zhi-dong

..............page:353-359

Study of micro-via copper plating capability on PCB
LIU Lu

..............page:146-151

Low cost high performance Halogen free CCL research
LIU Ying-jiu;HE Jia-jun;LIU Yu;XU Qing-yu;WANG Luo-li;LI Xiang

..............page:342-345

Application research review of Polyesters in FPC
YAN Hui;LI Zhen-lin;ZHANG Xue-ping;FAN He-ping

..............page:199-205

Research of etching uniformity of varied materials in rigid-flex circuit board and its mechanism
ZHOU Guo-yun;HE Wei;WANG Shou-xu;MO Yun-qi;MAO Ji-mei;CHEN Lang;HE Bo

..............page:206-214

Cyanoqen free immersion gold process
GAO Lin-jun;DONG Zhen-hua

..............page:1-8

The origin analysis of shot copper in PTH process
NI Liang-suo;LIU Xue-ting

..............page:61-84

Research on key factors affecting corrosion resistance on electroless Nickel
YANG Zhang-rong;WANG Cai-xia;SHA Lei

..............page:15-23

Discussion on the engineering design, process control and testing techniques of the precise characteristic impedance of PCB
YUAN Huan-huan;SU Pan-chun

..............page:542-550

Signal attenuation analysis of high frequency materials for FPC
MO Xin-man;CHEN Bei;LI Zhi-dong

..............page:168-177

Milling product new technology development in PCB manufacturing
YE Dong-quan;ZHOU Jian-ping

..............page:309-314

The Polymer optical waveguide materials for EOPCB and its applications
CHEN Wei;FAN HE

..............page:258-275

Research on application of pump fault detection and prevention in PCB wet process equipment
XIAO Rong-jian;MAI Zhuo-hua

..............page:481-487

Copper recovery and acid etching liquid waste recycling technology
HUANG Ping

..............page:164-167