1009-0096
2010 Issue 12
..............page:64-70
High thermal conductivity aluminum base copper clad laminate Research status and prospect
GE Zhi-hua
GE Zhi-hua
..............page:27-32
The effects of signal transfer-performance with the ground-return vias in PCB
LIN Jin-du;WU Mei-zhu
LIN Jin-du;WU Mei-zhu
..............page:7-8,39
..............page:71-72
Who is responsible for pollution?
WANG Long-ji
WANG Long-ji
..............page:3-4
..............page:33-39
..............page:5-6,12
..............page:59-63
Common defects & solutions of FR-4 copper clad laminate
ZENG Guang-long
ZENG Guang-long
..............page:19-26,52
Three types of silicane performance test and difference
HUANG Chang-gen
HUANG Chang-gen
..............page:16-18
Failure analysis of tin-lead plating in Ag Electrode of MLCC
SHI Qin-gang;ZHUANG Li-bo
SHI Qin-gang;ZHUANG Li-bo
..............page:53-54,58
Wiring design technique of PCB
LV Jun-xia
LV Jun-xia
..............page:13-15,70
Control of electrical resistivity of TaN thin films by reactivesputtering for embedded Passive resistors
BAI Ya-xu;YUAN Zheng-xi;HE Wei;HE Bo;MO Yun-qi
BAI Ya-xu;YUAN Zheng-xi;HE Wei;HE Bo;MO Yun-qi
..............page:55-58
EMC Design of PCB
NIE Qiong;QIAN Min;DING Jie
NIE Qiong;QIAN Min;DING Jie
..............page:9-12
..............page:47-52
Study on mixed lamination technology of asymmetric high frequency PCB
ZHANG Yu-meng;HU Yan-hui;LIU Liang-ping;XIE Hai-shan
ZHANG Yu-meng;HU Yan-hui;LIU Liang-ping;XIE Hai-shan
..............page:40-41,63
..............page:42-46