Printed Circuit Information 2010 Issue 11 Reutilization of waste electronic substrate

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Printed Circuit Information
1009-0096
2010 Issue 11

Reutilization of waste electronic substrate

..............page:62-65

The methods and characterization of toughness in lead-free copper clad laminate
WU Yi-hui;FANG Ke-hong

..............page:13-16

Recent trend of Japanese PCB base material industry
ZHU Datong

..............page:7-12,28

The water absorbing characteristic impact on permittivity and loss tangent
WANG Jun;WANG Jiang-hua

..............page:17-19,33

Major environmental technology innovation projects for PCB industry
LI Jian-guang

..............page:54-61

Development and commercialization of embedded passive and active devices PCB

..............page:20-28

xin xi dong tai

..............page:71-72

The exploration of the adhesive power in BUM
LIN Jin-du;WU Mei-zhu

..............page:29-33

Present necessity of Company Social Responsibility
WANG Long-ji

..............page:3,6

Processing technology research of the precise characteristic impedance of PCB
YUAN Huan-xin

..............page:34-39,70

X-ray inspection in PCB assembly field
XIAN Fei

..............page:66-70

Evaluation and test of PCB solderability
DONG Li-ling;JIA Yan

..............page:44-47,50

Awareness of product quality of electrolytic copper foil production enterprise
YE Jing-min;WEN Qiu-xia

..............page:48-50

Differential connections of hydraulic system with a small piece of the production process
XIONG Gen-sheng

..............page:51-53

The curvature and its model of polyimide adhesiveless flexible copper clad laminate
ZHUANG Yong-bing;GU Yi

..............page:40-43,53

Innovation is the result of great efforts——PCB industry soft competency (5)

..............page:4-6